公开(公告)号：US09354388B2

公开(公告)日：2016-05-31

申请号：US14446525

申请日：2014-07-30

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael Renne Ty Tan ,  Georgios Panotopoulos ,  Paul Kessler Rosenberg ,  Sagi Varhgese Mathai ,  Wayne Victor Sorin ,  Susant K. Patra

IPC: H01L29/40 ,  G02B6/12 ,  G02B6/122 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  B29D11/00

CPC classification number: G02B6/12004 ,  B29D11/00307 ,  B29D11/0073 ,  G02B6/122 ,  H01L24/16 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/81815 ,  H01L2224/8313 ,  H01L2224/83132 ,  H01L2224/83141 ,  H01L2224/8385 ,  H01L2224/83898 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/06593 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract translation: 复合晶片包括模制晶片和第二晶片。 模制的晶片包括多个第一部件，并且第二晶片包括多个第二部件。 将第二晶片与模制晶片组合以形成复合晶片。 第一组分中的至少一个与至少一个第二组分对准以形成多组分元素。 多组分元素可从复合晶片中分离出来。