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公开(公告)号:US20210404895A1
公开(公告)日:2021-12-30
申请号:US17345354
申请日:2021-06-11
Applicant: Hitachi, Ltd.
Inventor: Hiroyuki YOSHIMOTO , Ryotaro KAWAHARA , Ryohei MATSUI , Nobuyuki SUGII , Tsuneya KURIHARA , Hirohiko SAGAWA , Naoko USHIO , Motoki TAJIMA , Shingo KIRITA
Abstract: Provided is a digitalization system capable of digitalizing the skills of delicate work. This digitalization system comprises a first sensor mounted on a work tool and which detects a deformation of the work tool when the work tool is pressed against a work target, a second sensor which detects a force applied to the work target or a force applied to the work tool when the work tool is pressed against the work target, and a computer which calculates an angle of a corner formed with the work tool and the work target based on sensor values acquired with the first sensor, and calculates a force applied to the work target when the work tool is pressed against the work target based on sensor values acquired with the second sensor.
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公开(公告)号:US20220342480A1
公开(公告)日:2022-10-27
申请号:US17714309
申请日:2022-04-06
Applicant: HITACHI, LTD.
Inventor: Ryohei MATSUI , Ryotaro KAWAHARA , Tetsufumi KAWAMURA , Nobuyuki SUGII , Naoko USHIO , Hiroyuki YOSHIMOTO
Abstract: A pressure sensor device, a method for manufacturing the pressure sensor device, and a work management system mitigating a degree of a false detection is presented. The pressure sensor device detecting pressure includes a flexible substrate base material having flexibility; a comb-teeth shape electrode having an exposed metal surface formed in a predetermined area on the flexible substrate base material; and a pressure-sensitive material that is provided on the comb-teeth shape electrode, varies in a resistance value depending on an amount of a load, and has a curvature in a static state.
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公开(公告)号:US20210089014A1
公开(公告)日:2021-03-25
申请号:US16817839
申请日:2020-03-13
Applicant: Hitachi, Ltd.
Inventor: Hiroyuki YOSHIMOTO , Naoko USHIO , Ryohei MATSUI , Hiroki OHASHI , Toshinari ISHII , Daiji IWASA
IPC: G05B19/418 , G06Q30/00 , G06T7/00 , H04N7/18
Abstract: The product inspection system comprises an inspection information collecting unit which collects inspection information acquired from an inspection target, an inspection time acquisition unit which acquires an inspection time that the inspection information was acquired, a recording unit which mutually associates and records the inspection information collected by the inspection information collecting unit and the inspection time acquired by the inspection time acquisition unit, and a display control unit which displays the inspection information recorded in the recording unit on a display terminal.
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公开(公告)号:US20200033390A1
公开(公告)日:2020-01-30
申请号:US16446907
申请日:2019-06-20
Applicant: HITACHI, LTD.
Inventor: Ryohei MATSUI , Nobuyuki SUGII , Tetsufumi KAWAMURA
Abstract: One preferable aspect of the present invention is a state detecting system which detects a state of a machine device based on a detection signal from a detecting element provided to the machine device, and is the state detecting system which includes a non-normal time rate detecting unit which detects a rate or a value as a non-normal time rate, the rate being a rate of an integration value of a time during which an amplitude of the detection signal exceeds a predetermined normal amplitude within a predetermined time, and the value being physically equivalent to the rate.
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公开(公告)号:US20180121589A1
公开(公告)日:2018-05-03
申请号:US15788303
申请日:2017-10-19
Applicant: HITACHI, LTD.
Inventor: Tetsufumi KAWAMURA , Nobuyuki SUGII , Yuudai KAMADA , Yuhua ZHANG , Atsushi ISOBE , Ryohei MATSUI , Daisuke RYUZAKI
IPC: G06F17/50
CPC classification number: G06F17/5045 , G06F2217/02
Abstract: The present invention provides a technique for determining the circuit configuration and device structure that meet required specifications in a short time. A device design support method includes: a step (S2) of receiving an input of specifications of a sensor, and extracting the circuit configuration and device specification range corresponding to the received specifications of the sensor, by referring to a circuit design database in which the circuit configuration configuring the sensor, the range of the specifications of the device configuring the sensor, and the specifications of the sensor are associated with each other; and a step (S3) of extracting the device structure corresponding to the extracted device specification range by referring to a device design database in which the specifications of the device and the structure of the device are associated with each other.
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