公开(公告)号：US20180370793A1

公开(公告)日：2018-12-27

申请号：US15918502

申请日：2018-03-12

Applicant: Hitachi, Ltd.

Inventor： Masaharu KINOSHITA ,  Atsushi ISOBE ,  Kazuo ONO ,  Noriyuki SAKUMA ,  Tomonori SEKIGUCHI ,  Keiji WATANABE

IPC: B81C1/00 ,  B81B3/00 ,  B06B1/02 ,  G01N29/24

Abstract: A manufacturing method of a MEMS sensor includes a step of, by irradiating a first hole formed in a second layer on a semiconductor substrate with a focused ion beam for a first predetermined time, forming a first sealing film, which seals the first hole, on the first hole, and a step of, by irradiating a second hole formed in the second layer with a focused ion beam for a second predetermined time, forming a second sealing film, which seals the second hole, on the second hole. At this time, each of the first predetermined time and the second predetermined time is a time in which thermal equilibrium of the second layer is maintainable, and the step of forming the first sealing film and the step of forming the second sealing film are performed repeatedly.

公开(公告)号：US20180121589A1

公开(公告)日：2018-05-03

申请号：US15788303

申请日：2017-10-19

Applicant: HITACHI, LTD.

Inventor： Tetsufumi KAWAMURA ,  Nobuyuki SUGII ,  Yuudai KAMADA ,  Yuhua ZHANG ,  Atsushi ISOBE ,  Ryohei MATSUI ,  Daisuke RYUZAKI

IPC: G06F17/50

CPC classification number: G06F17/5045 ,  G06F2217/02

Abstract: The present invention provides a technique for determining the circuit configuration and device structure that meet required specifications in a short time. A device design support method includes: a step (S2) of receiving an input of specifications of a sensor, and extracting the circuit configuration and device specification range corresponding to the received specifications of the sensor, by referring to a circuit design database in which the circuit configuration configuring the sensor, the range of the specifications of the device configuring the sensor, and the specifications of the sensor are associated with each other; and a step (S3) of extracting the device structure corresponding to the extracted device specification range by referring to a device design database in which the specifications of the device and the structure of the device are associated with each other.

公开(公告)号：US20170292970A1

公开(公告)日：2017-10-12

申请号：US15511444

申请日：2014-11-11

Applicant: HITACHI, LTD.

Inventor： Atsushi ISOBE ,  Noriyuki SAKUMA ,  Chisaki TAKUBO ,  Yuudai KAMADA ,  Takashi SHIOTA

IPC: G01P15/125

CPC classification number: G01P15/125

Abstract: An acceleration sensor (1) includes a fixed portion (33), a movable portion (31) connected to the fixed portion (33), a lower electrode (11) that is disposed to face a lower surface of the movable portion (31), and an upper electrode (21) that is disposed to face an upper surface of the movable portion (31). A distance in an x-axis direction between an end portion (41) of the lower electrode (11) and the fixed portion (33) is shorter than a distance in the x-axis direction between an end portion (51) of the upper electrode (21) and the fixed portion (33). Further, a distance in the x-axis direction between an end portion (42) of the lower electrode (11) and the fixed portion (33) is shorter than a distance in the x-axis direction between an end portion (52) of the upper electrode (21) and the fixed portion (33).

公开(公告)号：US20170018471A1

公开(公告)日：2017-01-19

申请号：US15182657

申请日：2016-06-15

Applicant: Hitachi, Ltd.

Inventor： Takanori AONO ,  Tomonori SEKIGUCHI ,  Takashi SHIOTA ,  Yuudai KAMADA ,  Atsushi ISOBE

IPC: H01L23/053 ,  G01L9/02 ,  G01P15/18 ,  G01P3/44 ,  H01L23/498 ,  B81B7/00

CPC classification number: G01L9/02 ,  B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0264 ,  B81B2207/07 ,  G01C19/5783 ,  G01L9/12 ,  G01P1/006 ,  G01P1/023 ,  H01L23/057 ,  H01L23/49838 ,  H01L23/49861 ,  H01L2224/16225

Abstract: To provide a physical quantity sensor in which the influence of deformation of a package substrate on the measuring accuracy of a sensor element can be suppressed. A physical quantity sensor includes a sensor element that detects a predetermined physical quantity and outputs an electrical signal, a plurality of lead portions that are connected to the sensor element, and a package substrate that accommodates the sensor element and the plurality of lead portions. The plurality of lead portions are connected at proximal end sides thereof to the package substrate side, and connected at distal end sides thereof to the sensor element side, and the plurality of lead portions support the sensor element in such a manner that the sensor element does not contact the package substrate and that the transmission of deformation of the package substrate side to the sensor element is suppressed.

Abstract translation: 提供能够抑制封装基板的变形对传感器元件的测量精度的影响的物理量传感器。 物理量传感器包括检测预定物理量并输出电信号的传感器元件，连接到传感器元件的多个引线部分和容纳传感器元件和多个引线部分的封装基板。 多个引线部分在其近端侧连接到封装基板侧，并且在其远端侧连接到传感器元件侧，并且多个引线部分以传感器元件的方式支撑传感器元件 不接触封装基板，并且抑制封装基板侧向传感器元件的变形的传输。

公开(公告)号：US20160091525A1

公开(公告)日：2016-03-31

申请号：US14856537

申请日：2015-09-16

Applicant: HITACHI, LTD.

Inventor： Takashi OSHIMA ,  Atsushi ISOBE ,  Yuudai KAMADA ,  Noriyuki SAKUMA ,  Yuki FURUBAYASHI

IPC: G01P15/125

CPC classification number: G01P15/125

Abstract: An acceleration sensor that achieves a simultaneous operation method of a signal detection and a servo control is provided as an alternative to a time-division processing method. The acceleration sensor is a MEMS capacitive acceleration sensor. The acceleration sensor includes signal detection capacitor pairs 12, 15, and DC servo control capacitor pairs 13, 16, and AC servo control capacitor pairs 14, 17, which are different from the signal detection capacitor pairs 12, 15. A voltage that generates a force in a direction opposite to a detection signal of acceleration detected by the signal detection capacitor pairs 12, 15 is applied to the DC servo control capacitor pairs 13, 16 and the AC servo control capacitor pairs 14, 17.

Abstract translation: 提供了实现信号检测和伺服控制的同时操作方法的加速度传感器作为时分处理方法的替代。 加速度传感器是MEMS电容式加速度传感器。 加速度传感器包括不同于信号检测电容器对12,15的信号检测电容器对12,15和DC伺服控制电容器对13,16以及AC伺服控制电容器对14,17。 与由信号检测用电容器对12,15检测出的加速度检测信号相反的方向的力被施加到DC伺服控制电容器对13,16和AC伺服控制电容器对14,17。

公开(公告)号：US20180321274A1

公开(公告)日：2018-11-08

申请号：US15756279

申请日：2016-11-08

Applicant: HITACHI, LTD.

Inventor： Yuudai KAMADA ,  Atsushi ISOBE ,  Noriyuki SAKUMA ,  Takashi SHIOTA ,  Chisaki TAKUBO

IPC: G01P15/125 ,  G01V1/18 ,  G01R19/00 ,  G01V1/30

CPC classification number: G01P15/125 ,  G01P15/08 ,  G01P15/13 ,  G01P2015/0862 ,  G01R19/0084 ,  G01V1/18 ,  G01V1/181 ,  G01V1/28 ,  G01V1/30

Abstract: Provided are acceleration sensor, geophone and seismic prospecting system with high sensitivity and low power consumption. The acceleration sensor includes a mass body displaceable with respect to a rotation shaft. The acceleration sensor includes a first AC servo control facing a first symmetrical region of the first movable portion, a second AC servo control electrode facing a second symmetrical region of the second movable portion, and a DC servo control electrode facing an asymmetrical region of the second movable portion. A first AC servo capacitive element is formed by the first movable portion and the first AC servo control electrode, a second AC servo capacitive element is formed by the second movable portion and the second AC servo control electrode, and a DC servo capacitive element is formed by the second movable portion and the DC servo control electrode.

公开(公告)号：US20180273378A1

公开(公告)日：2018-09-27

申请号：US15765206

申请日：2016-03-18

Applicant: Hitachi, Ltd.

Inventor： Tetsufumi KAWAMURA ,  Kazuki WATANABE ,  Atsushi ISOBE ,  Yuudai KAMADA ,  Shuntaro MACHIDA ,  Nobuyuki SUGII ,  Daisuke RYUZAKI

IPC: B81C99/00 ,  G06F17/50

Abstract: Provided is a technology that enables the shortening of the designing period. A device designing method includes a step of extracting a structure compatible with requested characteristics from a database in which each structure of a device is associated with characteristics and a step of outputting the extracted structure and a tuning parameter for adjusting the structure into ranges of the requested characteristics. In regard to each structure parameter determining the structure of the device, characteristics obtained by performing a simulation while exhaustively changing the structure parameter in a manufacturable range and the structure parameter used for the simulation are stored in the database while being associated with each other.

公开(公告)号：US20180252745A1

公开(公告)日：2018-09-06

申请号：US15758188

申请日：2015-09-15

Applicant: HITACHI, LTD.

Inventor： Atsushi ISOBE ,  Takashi SHIOTA ,  Yuudai KAMADA ,  Chisaki TAKUBO ,  Noriyuki SAKUMA

IPC: G01P15/125 ,  G01P15/18 ,  G01P15/08

Abstract: There is provided an acceleration sensor with low noise and high sensitivity. Specifically, a first number of opening portions are formed in a region corresponding to a heavyweight section of a mass body, on a surface of a membrane layer, and a second number of opening portions are formed in a region corresponding to the heavyweight section of the mass body, on a back surface of the membrane layer. The opening portion and the opening portion are connected to each other to form a plurality of through portions on the membrane layer, and the first number is larger than the second number.

公开(公告)号：US20180210005A1

公开(公告)日：2018-07-26

申请号：US15742550

申请日：2015-07-10

Applicant: Hitachi, Ltd.

Inventor： Atsushi ISOBE ,  Yuki FURUBAYASHI ,  Takashi OSHIMA ,  Yuudai KAMADA ,  Takashi SHIOTA ,  Chisaki TAKUBO ,  Noriyuki SAKUMA

IPC: G01P15/125 ,  G01P15/13 ,  G01P15/08 ,  G01P15/18

CPC classification number: G01P15/125 ,  B81B2201/0235 ,  G01P15/0802 ,  G01P15/131 ,  G01P15/18

Abstract: There is provided an inertia sensor with low noise and high sensitivity. The inertia sensor captures a physical quantity as a change of electrostatic capacitance and detects the physical quantity based on a servo voltage generating electrostatic force that cancels the change of the electrostatic capacitance. The inertia sensor includes a detection capacitor unit that captures the physical quantity as the change of the electrostatic capacitance and a servo capacitor unit to which the servo voltage is applied. Here, the detection capacitor unit and the servo capacitor unit are connected mechanically through an insulation material.

公开(公告)号：US20180137212A1

公开(公告)日：2018-05-17

申请号：US15806803

申请日：2017-11-08

Applicant: HITACHI, LTD.

Inventor： Yuhua ZHANG ,  Tetsufumi KAWAMURA ,  Atsushi ISOBE ,  Nobuyuki SUGII ,  Daisuke RYUZAKI

IPC: G06F17/50

CPC classification number: G06F17/50 ,  G06F17/5009 ,  G06F17/5018 ,  G06F2217/12

Abstract: Provided is a device design support apparatus in which a data input-output portion receives an input of a first device provisional specification relating to a device from a customer, a database generating portion generates a second database based on a first database stored in a database storing portion and the first device provisional specification, and a device specification generating portion generates a second device provisional specification relating to the device based on the second database, presents the second device provisional specification to the customer by outputting the generated second device provisional specification through the data input-output portion, receives the input of a change content of the second device provisional specification from the customer, and generates a device fixed specification of the device based on the second device provisional specification and the change content.