公开(公告)号：US10913680B2

公开(公告)日：2021-02-09

申请号：US16068759

申请日：2017-01-11

Applicant: HITACHI, LTD.

Inventor： Takashi Naito ,  Takuya Aoyagi ,  Tatsuya Miyake ,  Takeshi Kondo ,  Hiroki Kaneko ,  Kazutaka Okamoto

IPC: C03C8/24 ,  C03C8/16 ,  C03C8/18 ,  C03C27/06 ,  C03C3/12 ,  C03C8/20 ,  H01J9/02 ,  H01L23/10 ,  H01J11/48 ,  H01J11/22 ,  C03C8/02 ,  H01L23/02 ,  H01L51/50 ,  H01L31/0224 ,  H05B33/04 ,  H01J9/24 ,  H05B33/26 ,  C03C3/21 ,  C03C14/00 ,  C03C17/00 ,  C03C17/04 ,  H01L51/52 ,  H03H9/10

Abstract: The purpose of the present invention is to provide a lead-free glass composition in which crystallization is suppressed and which has a low softening point. This lead-free glass composition is characterized by containing silver oxide, tellurium oxide and vanadium oxide, and further containing at least one compound selected from among yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, gallium oxide, indium oxide, iron oxide, tungsten oxide and molybdenum oxide as an additional component, and in that the content values (mol %) of silver oxide, tellurium oxide and vanadium oxide satisfy the relationships Ag2O>TeO2≥V2O5 and Ag5O≤2V2O5 when calculated in terms of the oxides, and in that the content of TeO2 is 25-37 mol. %.

公开(公告)号：US10913677B2

公开(公告)日：2021-02-09

申请号：US16608057

申请日：2018-02-28

Applicant: Hitachi, Ltd.

Inventor： Tatsuya Miyake ,  Takashi Naitou

IPC: E06B3/66 ,  C03B23/24 ,  B32B17/06 ,  B32B37/06 ,  B32B37/18 ,  E06B3/677 ,  E06B3/673

Abstract: An object of the invention is to provide a multilayer glass which can be manufactured by a simple process. To solve the above problem, the multilayer glass according to the invention includes a first glass substrate, a second glass substrate that faces the first glass substrate at an interval of a predetermined space, and a sealing part that seals a periphery of an internal space defined by the first glass substrate and the second glass substrate. The sealing part is formed with a sealing material containing low melting point glass. The internal space is in a vacuum state. The first glass substrate includes an exhaust port that is provided to be included in a projection part of the sealing part when being projected in a lamination direction of the first glass substrate and the second glass substrate. The exhaust port is blocked by the sealing material (see FIG. 3).

公开(公告)号：US10442724B2

公开(公告)日：2019-10-15

申请号：US15755947

申请日：2016-07-11

Applicant: HITACHI, LTD.

Inventor： Takuya Aoyagi ,  Takashi Naito ,  Tatsuya Miyake

IPC: C03C8/24 ,  B32B7/02 ,  B32B7/12 ,  C03C3/12 ,  C03C3/14 ,  C03C3/21 ,  C03C8/02 ,  C03C8/04 ,  C03C8/08 ,  B23K35/36

Abstract: The purpose of the present invention is to provide a joining material that can easily join materials to be joined even when characteristics and physical properties thereof differ greatly. To solve the above problem, the joining material according to the present invention is characterized by including a base material, a first layer that is disposed on one surface of the base material, and a second layer that is disposed on the other surface of the base material and includes a phase having a different coefficient of thermal expansion to that of the phase configuring the first layer, at least one of the first and second layers including glass having a softening point of 600° C. or lower.

公开(公告)号：US10177069B2

公开(公告)日：2019-01-08

申请号：US15501374

申请日：2015-09-09

Applicant: HITACHI, LTD.

Inventor： Takashi Naito ,  Motomune Kodama ,  Takuya Aoyagi ,  Shigeru Kikuchi ,  Takashi Nogawa ,  Mutsuhiro Mori ,  Eiichi Ide ,  Toshiaki Morita ,  Akitoyo Konno ,  Taigo Onodera ,  Tatsuya Miyake ,  Akihiro Miyauchi

IPC: C03C8/02 ,  C03C8/08 ,  C03C8/24 ,  H01L23/373 ,  C09J1/00 ,  C09J11/04 ,  H01L21/52 ,  H01L25/07 ,  H01L25/18 ,  H01L23/00

Abstract: A heat-dissipating structure is formed by bonding a first member and a second member, each being any of a metal, ceramic, and semiconductor, via a die bonding member; or a semiconductor module formed by bonding a semiconductor chip, a metal wire, a ceramic insulating substrate, and a heat-dissipating base substrate including metal, with a die bonding member interposed between each. At least one of the die bonding members includes a lead-free low-melting-point glass composition and metal particles. The lead-free low-melting-point glass composition accounts for 78 mol % or more in terms of the total of the oxides V2O5, TeO2, and Ag2O serving as main ingredients. The content of each of TeO2 and Ag2O is 1 to 2 times the content of V2O5, and at least one of BaO, WO3, and P2O5 is included as accessory ingredients, and at least one of Y2O3, La2O3, and Al2O3 is included as additional ingredients.

公开(公告)号：US10566503B2

公开(公告)日：2020-02-18

申请号：US15574007

申请日：2016-03-14

Applicant: HITACHI, LTD.

Inventor： Hiroki Kaneko ,  Takashi Naito ,  Yoshifumi Sekiguchi ,  Tatsuya Miyake

IPC: H01L33/48 ,  C03C8/24 ,  H01L25/075 ,  H01L33/60 ,  H04N5/225 ,  C03C27/06 ,  G06T7/55 ,  G06T7/70 ,  B60J1/00 ,  B60J1/02 ,  B60J1/18 ,  B60Q1/04 ,  B60Q1/22 ,  F25D27/00 ,  H01L33/62 ,  H04N5/247

Abstract: The purpose of the present invention is to decrease the process temperature for a multilayer glass into which an optical element is to be packed, thereby reducing the damage to the optical element during processing. A multilayer glass according to the present invention is so configured that a gap formed between glass plates is sealed with a sealing material that can fix at a process temperature lower than a temperature employed for the processing of an optical element (see FIG. 1).