公开(公告)号：US09793011B2

公开(公告)日：2017-10-17

申请号：US14646223

申请日：2012-11-21

Applicant: Hitachi, Ltd.

Inventor： Ryou Ishibashi ,  Takashi Naitou ,  Motomune Kodama ,  Takuya Aoyagi ,  Tetsushi Hino ,  Motoo Aoyama ,  Tsuneyuki Hashimoto ,  Katsuhito Takahashi ,  Junichi Sakano ,  Hiroshi Nakano

IPC: B32B17/06 ,  G21C3/34 ,  H05K1/03 ,  H05K1/18 ,  G21C3/07 ,  H05K7/20 ,  C03C8/18 ,  G21C3/20 ,  H01L23/15 ,  H01L23/473 ,  F28F19/02 ,  F28F21/00 ,  F28F21/04 ,  C03C8/14 ,  C03C8/24 ,  C04B37/02 ,  H01L23/373 ,  F28D7/16

CPC classification number: G21C3/34 ,  C03C8/14 ,  C03C8/18 ,  C03C8/24 ,  C04B37/025 ,  C04B2237/10 ,  C04B2237/365 ,  C04B2237/38 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/407 ,  C04B2237/765 ,  C04B2237/84 ,  F28D7/16 ,  F28F19/02 ,  F28F21/006 ,  F28F21/04 ,  F28F2255/06 ,  G21C3/07 ,  G21C3/20 ,  H01L23/15 ,  H01L23/3735 ,  H01L23/473 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/181 ,  H05K1/0306 ,  H05K1/18 ,  H05K7/20509 ,  Y02E30/40 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is a structure including a first member (2); a second member (3) disposed opposite to the first member (2); and a glass layer (4) disposed between the first member (2) and the second member (3) so as to bond the first member (2) and the second member (3). A glass transition point of the glass layer (4) is lower than a temperature of the glass layer (4) under operation. In the glass layer (4), at least either of ceramic and metallic particles 4b, 4c is dispersed. In a temperature region lower than the glass transition point of the glass layer (4), a thermal expansion coefficient thereof falls in between thermal expansion coefficients of the first member (2) and the second member (3). This allows thermal strain caused within the structure (1) to be reduced when the structure (1) is operated at a higher temperature than a room temperature.

公开(公告)号：US09824900B2

公开(公告)日：2017-11-21

申请号：US14440124

申请日：2012-11-09

Applicant: Hitachi, Ltd.

Inventor： Motomune Kodama ,  Takashi Naito ,  Yuichi Sawai ,  Tadashi Fujieda ,  Takuya Aoyagi ,  Masanori Miyagi

IPC: C03C3/21 ,  C03C3/12 ,  C03C8/08 ,  C03C8/02 ,  C03C8/24 ,  C03C8/14 ,  H01L21/48 ,  B32B7/02 ,  B32B7/04 ,  B32B27/06 ,  C03C8/18 ,  C03C23/00

CPC classification number: H01L21/481 ,  B32B7/02 ,  B32B7/04 ,  B32B27/06 ,  B32B2264/102 ,  B32B2307/30 ,  B32B2307/54 ,  B32B2457/14 ,  C03C3/122 ,  C03C3/21 ,  C03C8/02 ,  C03C8/08 ,  C03C8/18 ,  C03C8/24 ,  C03C23/0025 ,  H01L21/4807 ,  Y10T428/24942

Abstract: The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.

公开(公告)号：US09789568B2

公开(公告)日：2017-10-17

申请号：US14177988

申请日：2014-02-11

Applicant: Hitachi, Ltd.

Inventor： Takuya Aoyagi ,  Motomune Kodama ,  Takashi Naito ,  Tadashi Fujieda ,  Yuichi Sawai ,  Masanori Miyagi ,  Haruo Akahoshi ,  Norihisa Iwasaki

IPC: B22F5/00 ,  B23K35/02 ,  H02K3/02 ,  B23K35/36 ,  B23K35/26 ,  B23K35/28 ,  B23K35/30 ,  B23K35/32 ,  H01R4/02 ,  H01R4/62

CPC classification number: B23K35/025 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/282 ,  B23K35/286 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/32 ,  B23K35/3602 ,  H01R4/023 ,  H01R4/625 ,  H02K3/02

Abstract: An aluminum wire body, in which an aluminum or aluminum alloy electric wire and a metal to be joined are joined by solder, wherein the solder includes an oxide glass including vanadium and a conducting particle. Preferably, the conducting particle contained in the solder is 90% by volume or less and the oxide glass is 20% by volume to 90% by volume. Further preferably, the oxide glass includes 40% by mass or more of Ag2O in terms of oxides and the glass transition point is 180° C. or less.

公开(公告)号：US20150279700A1

公开(公告)日：2015-10-01

申请号：US14440124

申请日：2012-11-09

Applicant: HITACHI, LTD.

Inventor： Motomune Kodama ,  Takashi Naito ,  Yuichi Sawai ,  Tadashi Fujieda ,  Takuya Aoyagi ,  Masanori Miyagi

IPC: H01L21/48 ,  B32B27/06 ,  B32B7/02 ,  B32B7/04

CPC classification number: H01L21/481 ,  B32B7/02 ,  B32B7/04 ,  B32B27/06 ,  B32B2264/102 ,  B32B2307/30 ,  B32B2307/54 ,  B32B2457/14 ,  C03C3/122 ,  C03C3/21 ,  C03C8/02 ,  C03C8/08 ,  C03C8/18 ,  C03C8/24 ,  C03C23/0025 ,  H01L21/4807 ,  Y10T428/24942

Abstract: The deterioration of the resin base materials in the bonded structure is prevented. In a bonded structure containing two base materials at least one of which is a resin, an oxide which contains either P or Ag, V, and Te, and are formed by softening on the two base materials, bond the two base materials. In addition, in a method for producing a bonded structure containing two base materials at least one of which is a resin containing: supplying an oxide containing either P or Ag, V, and Te to the base material; and applying electromagnetic waves to the oxide, whereby the oxide, which soften on the substrates, bond the two base material.

Abstract translation: 防止粘结结构中的树脂基材的劣化。 在包含两种基材的粘合结构中，其中至少一种是树脂，包含P或Ag，V和Te的氧化物，并且通过在两种基材上软化形成，将两种基材粘合。 此外，在含有两种基材的接合结构体的制造方法中，至少其中之一是含有将含有P或Ag，V，Te的氧化物供给到基材中的树脂; 并向氧化物施加电磁波，由此在基板上软化的氧化物结合两种基材。

公开(公告)号：US20150020879A1

公开(公告)日：2015-01-22

申请号：US14369056

申请日：2012-11-21

Applicant: Hitachi, Ltd.

Inventor： Yuichi Sawai ,  Takashi Naito ,  Takuya Aoyagi ,  Tadashi Fujieda ,  Hajime Murakami ,  Hiroshi Yoshida ,  Masahiko Ogino ,  Akihiro Miyauchi

IPC: H01L31/048 ,  H01L51/52

CPC classification number: H01L31/0481 ,  B32B17/10788 ,  B32B27/365 ,  C03C3/122 ,  H01L31/048 ,  H01L51/524 ,  Y02E10/50 ,  Y10T428/31507 ,  Y10T428/31623

Abstract: To improve the gas barrier property of a laminate containing a substrate containing resin or rubber and oxide glass. A laminate 8 comprising a substrate 9 containing resin or rubber and oxide glass 10 formed at least on one surface of the substrate, in which the oxide glass softens and fluidizes at a temperature equal to or lower than the softening temperature of the substrate and adheres to the substrate.

Abstract translation: 为了提高包含含有树脂或橡胶的基材和氧化物玻璃的层压体的阻气性。 层压体8，其包含基材9，其含有树脂或橡胶，氧化物玻璃10至少形成在基材的至少一个表面上，其中氧化物玻璃在等于或低于基材的软化温度的温度下软化并流化，并粘附至 底物。

公开(公告)号：US20150008573A1

公开(公告)日：2015-01-08

申请号：US14374396

申请日：2012-11-21

Applicant: Hitachi, Ltd.

Inventor： Yuichi Sawai ,  Takashi Naito ,  Takuya Aoyagi ,  Tadashi Fujieda ,  Mutsuhiro Mori

IPC: H01L23/373 ,  H01L33/64 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L23/3736 ,  B23K35/26 ,  C04B37/025 ,  C04B37/026 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/10 ,  C04B2237/12 ,  C04B2237/125 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/408 ,  C22C5/06 ,  C22C13/00 ,  H01L21/52 ,  H01L23/3731 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/34 ,  H01L24/36 ,  H01L24/40 ,  H01L33/62 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/40095 ,  H01L2224/40225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1432 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  Y10T428/12014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/37099

Abstract: Bondability and heat conductivity of a bonded body in which some of metal, ceramic, or semiconductor are bonded to each other are improved. In the bonded body in which a first member and a second member each comprise one of metal, ceramic, or semiconductor are bonded to each other, the second member is bonded to the first member by way of an adhesive member disposed to the surface of the first member, and the adhesive member contains a V2O5-containing glass and metal particles. In a semiconductor module having a base metal, a ceramic substrate, a metal wiring, and a semiconductor chip, the ceramic substrate is bonded to the base metal by way of a first adhesive member disposed to the surface of the base metal, the metal wiring is bonded to the ceramic substrate by way of a second adhesive member disposed to the surface of the ceramic substrate, the semiconductor chip is bonded to the metal wiring by way of a third adhesive member disposed to the surface of the metal wiring, and the first adhesive member, the second adhesive member, and the third adhesive member each comprise a V2O5-containing glass and metal particles.

Abstract translation: 其中一些金属，陶瓷或半导体彼此结合的接合体的结合性和导热性得到改善。 在其中每个包括金属，陶瓷或半导体中的一个的第一构件和第二构件彼此结合的接合体中，第二构件通过设置在第二构件的表面上的粘合构件接合到第一构件 第一构件，并且粘合构件含有含V2O5的玻璃和金属颗粒。 在具有基底金属，陶瓷基板，金属布线和半导体芯片的半导体模块中，陶瓷基板通过设置在基板金属的表面上的第一粘合部件接合到基底金属，金属布线 通过设置在陶瓷基板的表面上的第二粘合部件与陶瓷基板接合，半导体芯片通过设置在金属布线表面的第三粘合部件与金属布线接合，第一 粘合剂构件，第二粘合构件和第三粘合构件各自包含含V 2 O 5的玻璃和金属颗粒。

公开(公告)号：US09490380B2

公开(公告)日：2016-11-08

申请号：US14379208

申请日：2013-01-15

Applicant: Hitachi, Ltd.

Inventor： Tadashi Fujieda ,  Takashi Naito ,  Takuya Aoyagi ,  Yuichi Sawai

IPC: H01L31/032 ,  H01L31/18 ,  C23D5/00 ,  H02S40/20

CPC classification number: H01L31/032 ,  C23D5/00 ,  H01L31/18 ,  H02S40/20

Abstract: A metal matrix composite having high corrosion resistance even if the coating film deposit amount is low is obtained. A metal matrix composite includes a metal or alloy substrate coated with a molten transition metal oxide glass, wherein the transition metal oxide glass has an n-type polarity. Further, a method for producing a metal matrix composite includes a step of applying a paste containing a transition metal oxide glass, an organic binder, and an organic solvent onto the surface of a metal or alloy substrate, and a step of forming a glass coating film on the substrate by heating to and maintaining a temperature equal to or higher than the softening point of the transition metal oxide glass after the application step, wherein the transition metal oxide glass has an n-type polarity.

Abstract translation: 即使涂膜沉积量低，也可获得具有高耐蚀性的金属基复合材料。 金属基复合材料包括涂覆有熔融过渡金属氧化物玻璃的金属或合金基底，其中过渡金属氧化物玻璃具有n型极性。 此外，金属基质复合体的制造方法包括将含有过渡金属氧化物玻璃，有机粘合剂和有机溶剂的糊料涂布到金属或合金基材的表面上的步骤，以及形成玻璃涂层 通过在施加步骤之后加热并保持等于或高于过渡金属氧化物玻璃的软化点的温度在基板上的膜，其中过渡金属氧化物玻璃具有n型极性。

公开(公告)号：US10913680B2

公开(公告)日：2021-02-09

申请号：US16068759

申请日：2017-01-11

Applicant: HITACHI, LTD.

Inventor： Takashi Naito ,  Takuya Aoyagi ,  Tatsuya Miyake ,  Takeshi Kondo ,  Hiroki Kaneko ,  Kazutaka Okamoto

IPC: C03C8/24 ,  C03C8/16 ,  C03C8/18 ,  C03C27/06 ,  C03C3/12 ,  C03C8/20 ,  H01J9/02 ,  H01L23/10 ,  H01J11/48 ,  H01J11/22 ,  C03C8/02 ,  H01L23/02 ,  H01L51/50 ,  H01L31/0224 ,  H05B33/04 ,  H01J9/24 ,  H05B33/26 ,  C03C3/21 ,  C03C14/00 ,  C03C17/00 ,  C03C17/04 ,  H01L51/52 ,  H03H9/10

Abstract: The purpose of the present invention is to provide a lead-free glass composition in which crystallization is suppressed and which has a low softening point. This lead-free glass composition is characterized by containing silver oxide, tellurium oxide and vanadium oxide, and further containing at least one compound selected from among yttrium oxide, lanthanum oxide, cerium oxide, erbium oxide, ytterbium oxide, aluminum oxide, gallium oxide, indium oxide, iron oxide, tungsten oxide and molybdenum oxide as an additional component, and in that the content values (mol %) of silver oxide, tellurium oxide and vanadium oxide satisfy the relationships Ag2O>TeO2≥V2O5 and Ag5O≤2V2O5 when calculated in terms of the oxides, and in that the content of TeO2 is 25-37 mol. %.

公开(公告)号：US10392296B2

公开(公告)日：2019-08-27

申请号：US15033167

申请日：2013-12-04

Applicant: HITACHI, LTD.

Inventor： Motomune Kodama ,  Masanori Miyagi ,  Takuya Aoyagi ,  Takashi Naito

IPC: B32B17/06 ,  E06B3/66 ,  C03C17/04 ,  C03C3/12 ,  C03C3/21 ,  C03C8/24 ,  B32B1/02 ,  B32B7/14 ,  B32B37/14 ,  B32B38/00 ,  C03C17/00 ,  C03C8/02 ,  C03C8/08 ,  C03C8/18 ,  C03C27/06 ,  E06B3/663

Abstract: A sealed structural body has an internal space and is made of glass, wherein at least a part of a boundary between the internal space of the sealed structural body and the outside is separated by a sealing material containing a metal material and a lead-free oxide glass. The lead-free oxide glass contains at least one of element Ag or P, Te, and V.

公开(公告)号：US09708460B2

公开(公告)日：2017-07-18

申请号：US14368479

申请日：2012-11-01

Applicant: Hitachi, Ltd.

Inventor： Tadashi Fujieda ,  Takashi Naito ,  Takuya Aoyagi ,  Yuichi Sawai ,  Hajime Murakami ,  Hiroshi Yoshida ,  Akihiro Miyauchi ,  Masahiko Ogino

IPC: C03C3/12 ,  C03C3/21 ,  C03C14/00 ,  C03C8/08 ,  C08J5/10 ,  C08K3/40 ,  F03D1/06 ,  C09D125/06 ,  C03C13/00

CPC classification number: C08K3/40 ,  C03C3/122 ,  C03C3/21 ,  C03C13/00 ,  C03C14/00 ,  C08J5/10 ,  C09D125/06 ,  F03D1/0675 ,  Y02E10/721

Abstract: Mechanical strength of a composite material is enhanced by a simple process. In a composite material comprising a resin or a rubber and an oxide glass, the resin or the rubber is dispersed in the oxide glass, or the oxide glass is dispersed in the resin or the rubber, and the oxide glass is softened and fluidized by heating at or lower than a heat decomposition temperature of the resin or the rubber.