公开(公告)号：US10703947B2

公开(公告)日：2020-07-07

申请号：US15970353

申请日：2018-05-03

申请人： HITACHI CHEMICAL COMPANY, LTD.

发明人： Tomohiro Iwano ,  Hirotaka Akimoto ,  Takenori Narita ,  Tadahiro Kimura ,  Daisuke Ryuzaki

IPC分类号： C09K3/14 ,  B24B37/04 ,  H01L21/3105 ,  C09G1/02

摘要： The slurry of the invention comprises abrasive grains and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %. The polishing liquid of the invention comprises abrasive grains, an additive and water, wherein the abrasive grains include tetravalent cerium hydroxide particles and produce light transmittance of at least 50%/cm for light with a wavelength of 500 nm in an aqueous dispersion with the content of the abrasive grains adjusted to 1.0 mass %.