SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE
    9.
    发明申请
    SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE 审中-公开
    浆料,抛光溶液组合,抛光溶液,底材抛光方法和基材

    公开(公告)号:US20150098887A1

    公开(公告)日:2015-04-09

    申请号:US14401246

    申请日:2013-03-26

    Abstract: A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces absorbance of 0.035 or more for light having a wavelength of 400 nm in a liquid phase obtained when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×105 G.

    Abstract translation: 包含磨粒,添加剂和水的抛光液,其中所述磨粒包括四价金属元素的氢氧化物,在具有400nm波长的光的水分散体中产生1.00或更大且小于1.50的吸光度, 将磨粒的含量调整为1.0质量%,对于将磨粒含量调整为1.0质量%的水性分散体离心获得的液相中,对于波长为400nm的光,产生0.035以上的吸光度,为 50分钟,离心加速度为1.59×105G。

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