公开(公告)号：US20140099176A1

公开(公告)日：2014-04-10

申请号：US14023874

申请日：2013-09-11

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Keita NOGI ,  Teruo NAKATA ,  Kenji TAMAI ,  Michinori KAWAGUCHI ,  Yoshiro SUEMITSU

IPC: H01L21/677

CPC classification number: H01L21/677 ,  H01L21/67276 ,  H01L21/67703 ,  H01L21/67739 ,  H01L21/67745

Abstract: A semiconductor processing apparatus is provided, which includes processing chambers coupled together by transport mechanisms having transfer robots. After having completed wafer processing in each processing chamber, the allowable value of a time permitted for a processing-completed wafer to continue residing within the processing chamber is set up. Then, a time consumed up to the completion of transportation of a wafer scheduled to be next processed is estimated, thereby controlling a transfer robot in a way such that, when the estimated transfer time exceeds the allowable value of the waiting time, priority is given to an operation for unloading a processed wafer from the processing chamber insofar as the processed wafer's transfer destination is already in its state capable of accepting such wafer.

Abstract translation: 提供一种半导体处理装置，其包括通过具有传送机器人的传送机构联接在一起的处理室。 在每个处理室中完成晶片处理之后，建立处理完成的晶片继续驻留在处理室内所允许的时间允许值。 然后，估计到预定进行下一次处理的晶片的运送完成所消耗的时间，从而以这样的方式控制传送机器人，使得当估计的传送时间超过等待时间的允许值时，给予优先级 涉及从处理室卸载经处理的晶片的操作，只要处理的晶片的转印目的地已经处于能够接受该晶片的状态。