公开(公告)号：US20140099176A1

公开(公告)日：2014-04-10

申请号：US14023874

申请日：2013-09-11

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Keita NOGI ,  Teruo NAKATA ,  Kenji TAMAI ,  Michinori KAWAGUCHI ,  Yoshiro SUEMITSU

IPC: H01L21/677

CPC classification number: H01L21/677 ,  H01L21/67276 ,  H01L21/67703 ,  H01L21/67739 ,  H01L21/67745

Abstract: A semiconductor processing apparatus is provided, which includes processing chambers coupled together by transport mechanisms having transfer robots. After having completed wafer processing in each processing chamber, the allowable value of a time permitted for a processing-completed wafer to continue residing within the processing chamber is set up. Then, a time consumed up to the completion of transportation of a wafer scheduled to be next processed is estimated, thereby controlling a transfer robot in a way such that, when the estimated transfer time exceeds the allowable value of the waiting time, priority is given to an operation for unloading a processed wafer from the processing chamber insofar as the processed wafer's transfer destination is already in its state capable of accepting such wafer.

Abstract translation: 提供一种半导体处理装置，其包括通过具有传送机器人的传送机构联接在一起的处理室。 在每个处理室中完成晶片处理之后，建立处理完成的晶片继续驻留在处理室内所允许的时间允许值。 然后，估计到预定进行下一次处理的晶片的运送完成所消耗的时间，从而以这样的方式控制传送机器人，使得当估计的传送时间超过等待时间的允许值时，给予优先级 涉及从处理室卸载经处理的晶片的操作，只要处理的晶片的转印目的地已经处于能够接受该晶片的状态。

公开(公告)号：US20210151336A1

公开(公告)日：2021-05-20

申请号：US16641329

申请日：2019-02-07

Applicant: Hitachi High-Technologies Corporation

Inventor： Yoshikazu SAIGOU ,  Yoshiro SUEMITSU ,  Hiroyuki ISHIKAWA

IPC: H01L21/67 ,  H01L21/677 ,  H01L21/683

Abstract: Provided is a technique capable of implementing efficient transport and processing related to multi-step processing in the case of a link-type vacuum processing apparatus with related to an operating method of a vacuum processing apparatus. The operating method of the vacuum processing apparatus according to the embodiment, in order to minimize time required for all processing of a plurality of wafers in a multi-step processing, includes a first step (steps 601 to 607) of selecting one first processing unit and one second processing unit from a plurality of processing units for each wafer and determining a transport schedule including a transport path using the selected processing units. In the first step, for at least one wafer, a transport schedule including a transport path is configured using the selected first processing unit by excluding at least one first processing unit from the plurality of first processing units. The operating method selects an optimal transport schedule when a second step is rate-limited.

公开(公告)号：US20140294555A1

公开(公告)日：2014-10-02

申请号：US13975612

申请日：2013-08-26

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Michinori KAWAGUCHI ,  Satomi INOUE ,  Yoshiro SUEMITSU ,  Keita NOGI

IPC: H01L21/677

CPC classification number: H01L21/67745

Abstract: A method for operating a vacuum processing apparatus, the vacuum processing apparatus including: a plurality of cassette stands on which a cassette capable of housing a plurality of wafers therein can be placed; a plurality of vacuum processing vessels each having a processing chamber arranged therein, wherein the wafer is arranged and processed in the processing chamber; and at least one transport robot transporting the wafer on a transport path between either one of the plurality of cassettes and the plurality of vacuum processing vessels, the vacuum processing apparatus sequentially transporting in a predetermined transport order the plurality of wafers from either one of the plurality of cassettes to a predetermined one of the plurality of vacuum processing vessels and processing the plurality of wafers. The method includes a number determining step, a remaining-time determining step and a transport order skip step.

Abstract translation: 一种真空处理装置的操作方法，所述真空处理装置包括：能够放置能够容纳多个晶片的盒的多个盒架; 多个真空处理容器，每个具有布置在其中的处理室，其中所述晶片在所述处理室中被布置和处理; 以及至少一个传送机器人，其将所述晶片传送到所述多个盒中的任一个与所述多个真空处理容器之间的传送路径上，所述真空处理装置以预定的传送顺序依次传送来自所述多个盒中的任一个的多个晶片 将多个真空处理容器中的一个预定的一个放入盒中并处理多个晶片。 该方法包括数字确定步骤，剩余时间确定步骤和传输顺序跳过步骤。

公开(公告)号：US20130108400A1

公开(公告)日：2013-05-02

申请号：US13633155

申请日：2012-10-02

Applicant: Hitachi High-Technologies Corporation

Inventor： Keita NOGI ,  Teruo NAKATA ,  Yoshiro SUEMITSU ,  Michinori KAWAGUCHI ,  Satomi INOUE

IPC: H01L21/677

CPC classification number: H01L21/67276

Abstract: Transportation control in a vacuum processing device with high transportation efficiency without lowering throughput is provided. A control unit is configured to update in real time and holds device state information showing an action state of each of a process chamber, a transportation mechanism unit, a buffer room, and a holding mechanism unit, the presence of a process subject member, and a process state thereof; select a transport algorithm from among transport algorithm judgment rules that are obtained by simulating in advance a plurality of transport algorithms for controlling transportation of a process subject member for each condition of a combination of the number and arrangement of the process chambers and process time of a process subject member based on the device state information and process time of the process subject member; and compute a transport destination of the process subject member based on the selected transport algorithm.

Abstract translation: 提供了具有高运输效率而不降低生产量的真空处理装置中的运输控制。 控制单元被配置为实时更新并保持表示处理室，运送机构单元，缓冲室和保持机构单元的动作状态的装置状态信息，处理对象构件的存在和 其处理状态; 从传输算法判断规则中选择一种传输算法，该传输算法判断规则是通过预先模拟用于控制处理室的数量和布置的组合的每个条件的处理对象构件的传送的多个传输算法而获得的，以及处理室的处理时间 基于过程主体的设备状态信息和处理时间处理主题成员; 并基于所选择的传输算法计算过程主体成员的传输目的地。