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公开(公告)号：US20150036295A1
公开(公告)日：2015-02-05
申请号：US14446503
申请日：2014-07-30
发明人： SHYAN-JUH LIU , KAR-WAI HON , SHA-SHA LIU
IPC分类号： H05K5/02
CPC分类号： G06F1/20 , G03F7/20 , G03F7/42 , H05K5/0213 , H05K7/20409
摘要： An electronic device includes a housing, a mother board received in the housing, and a plurality of heat-generating members received in the housing. A dissipation area is formed in the housing, and a plurality of dissipation holes are defined in an outer surface of the dissipation area. Each dissipation hole is in a nanometer scale. The disclosure also supplies a method for manufacturing a housing of the electronic device.
摘要翻译： 电子设备包括壳体，容纳在壳体中的母板以及容纳在壳体中的多个发热构件。 在壳体中形成有耗散区域，并且在耗散区域的外表面中限定多个散热孔。 每个耗散孔都是纳米级的。 本公开还提供了一种用于制造电子设备的壳体的方法。
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公开(公告)号：US20150118479A1
公开(公告)日：2015-04-30
申请号：US14515935
申请日：2014-10-16
发明人： KAR-WAI HON
CPC分类号： B32B3/263 , B29C45/14311 , B29C45/14795 , B29K2705/00 , B29K2881/04 , B29K2995/0041 , B29L2031/34 , B32B3/26 , B32B15/08 , B32B2250/02 , B32B2307/704 , B32B2457/00 , Y10T428/24997
摘要： A composite of metal and resin is provided. The composite of metal and resin includes a metal piece and a resin piece, and the surface of the metal piece includes a number of micropores. Each micropore includes a first inclining hole and a second inclining hole, and the first inclining hole and the second inclining hole are disposed inclined with the surface of the metal piece. The first inclining hole and the second inclining hole are disposed symmetrical around an axis perpendicular to the surface of the metal piece, and communicate with each other on the surface of the metal piece. The resin piece is embedded to the micropores to combine with the metal piece. The bonding strength of the composite of metal and resin is increased. A method of manufacturing the composite of metal and resin is also provided.
摘要翻译： 提供金属和树脂的复合材料。 金属和树脂的复合材料包括金属片和树脂片，并且金属片的表面包括多个微孔。 每个微孔包括第一倾斜孔和第二倾斜孔，并且第一倾斜孔和第二倾斜孔与金属片的表面倾斜设置。 第一倾斜孔和第二倾斜孔围绕垂直于金属片表面的轴对称设置，并且在金属片的表面上彼此连通。 将树脂片嵌入微孔中以与金属片结合。 金属和树脂复合材料的粘接强度提高。 还提供了一种制造金属和树脂复合材料的方法。
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公开(公告)号：US20170087800A1
公开(公告)日：2017-03-30
申请号：US15373875
申请日：2016-12-09
发明人： KAR-WAI HON
CPC分类号： B32B3/263 , B29C45/14311 , B29C45/14795 , B29K2705/00 , B29K2881/04 , B29K2995/0041 , B29L2031/34 , B32B3/26 , B32B15/08 , B32B2250/02 , B32B2307/704 , B32B2457/00 , Y10T428/24997
摘要： A composite of metal and resin and a manufacturing method require a metal piece and a resin piece, and the surface of the metal piece is etched to include a number of micropores. Each micropore includes a first inclined hole and a second inclined hole, the first inclined hole and the second inclined hole diverging from each other below the surface of the metal piece. The first inclined hole and the second inclined hole extend downwards from a common starting hole which is symmetric around an axis perpendicular to the surface of the metal piece. The resin is embedded in the micropores to combine with the metal piece, where the bonding strength of the composite of metal and resin is increased.
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公开(公告)号：US20170060200A1
公开(公告)日：2017-03-02
申请号：US15348946
申请日：2016-11-10
发明人： SHYAN-JUH LIU , KAR-WAI HON , SHA-SHA LIU
CPC分类号： G06F1/20 , G03F7/20 , G03F7/42 , H05K5/0213 , H05K7/20409
摘要： A method for manufacturing a housing of an electronic device includes the following steps. An area not to be etched is shielded and an etching area is exposed. The etching area is etched by photolithography and forming a plurality of heat dissipation holes of nanometer scale in the etching area. The area not to be etched is cleaned for removing the shielding.
摘要翻译： 一种用于制造电子设备的外壳的方法包括以下步骤。 屏蔽不被蚀刻的区域并暴露蚀刻区域。 通过光刻蚀刻蚀刻区域，并在蚀刻区域中形成多个纳米级散热孔。 清洁不被蚀刻的区域以去除屏蔽。
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5.发明申请公开(公告)号：US20150111002A1
公开(公告)日：2015-04-23
申请号：US14513591
申请日：2014-10-14
发明人： SHYAN-JUH LIU , KAR-WAI HON , SHA-SHA LIU
CPC分类号： B29C45/14311 , B29C37/0082 , B29C59/14 , B29C2045/14868 , B29C2045/14885 , B29K2101/12 , B32B3/30 , B32B7/045 , B32B7/08 , B32B15/088 , B32B15/09 , B32B27/16 , B32B27/20 , B32B2250/02 , B32B2262/101 , B32B2398/20 , B32B2509/00 , B32B2605/08 , G03F7/0002 , Y10T428/24521
摘要： A method for manufacturing composite of resin and other materials includes the following steps. A shaped piece made by materials different with resin is provided, and is degreased and cleaned. A resist layer with a lot of location holes is formed on the surface of the heterogeneous member by nano-imprint lithography, and a lot of small holes are formed on the surface of the heterogeneous member while the resist layer is removed. Then the heterogeneous member is inserted in an injection mold, and molten crystalline thermoplastic resin is injected into the mold, thus the resin embedded into the holes and bonding with the shaped piece. The method is environmentally friendly and suitable for mass production.
摘要翻译： 树脂和其他材料的复合材料的制造方法包括以下步骤。 提供由与树脂不同的材料制成的成形件，并进行脱脂和清洁。 通过纳米压印光刻在异质部件的表面上形成具有大量定位孔的抗蚀剂层，并且在除去抗蚀剂层的同时，在异质部件的表面上形成许多小孔。 然后将异质构件插入注塑模具中，并将熔融的结晶热塑性树脂注入模具中，从而将树脂嵌入孔中并与成形件粘合。 该方法环保，适合批量生产。
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