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公开(公告)号：US20180257177A1
公开(公告)日：2018-09-13
申请号：US15760847
申请日：2016-09-16
发明人： Takanori SATO , Shin YOSHIDA , Masahiro KOIKE , Kenichi FUKAMI
CPC分类号： B23K26/38 , B23K26/03 , B23K26/0846 , B23K26/0869 , B23K26/0876 , B23K26/40 , B23K26/402 , B23K26/60 , B23K26/702 , B23K2101/16 , B23K2103/02 , B23K2103/10 , B23K2103/14 , B23K2103/15 , B23K2103/42 , B23K2103/52 , B23K2103/54
摘要： Provided are a laser processing method and a laser processing device which prevent a laser irradiation unit from colliding with an edge of a plate material when the laser irradiation unit returns to a portion just above the plate material from an outer part of the portion just above the plate material. The laser processing method for cutting a plate material by laser irradiation, the method including: a plate material end portion holding process of holding a position of an end portion of the plate material at a predetermined position when a laser irradiation unit is present outside a portion just above the plate material; and a laser irradiation unit moving process in which the laser irradiation unit moves from an outer part of the portion just above the plate material to the portion just above the plate material.
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公开(公告)号：US20210268604A1
公开(公告)日：2021-09-02
申请号：US17183372
申请日：2021-02-24
发明人： Hiroki TOKUICHI , Yuichi HIRATA , Takanori SATO , Shin YOSHIDA
摘要： A laser processing apparatus 3 includes: a laser head H; a conveying device 4 that conveys a workpiece W; a head driving mechanism that moves the laser head H; a dust collecting box 60 that moves below the workpiece W and follows the laser head H such that the dust collecting box 60 is disposed below the laser head H; an outer support roller 81 and an inner support roller 82 that are provided at an opening 61 of the dust collecting box 60 and are rotatable around an axis parallel to a width direction orthogonal to a conveying direction Fy; and a counter roller 9 that rotates the outer support roller 81 in synchronization with a conveying operation of the workpiece W by the conveying device 4. The counter roller 9 transmits motive power of the conveying device 4 as a belt conveyor to the outer support roller 81.
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公开(公告)号：US20190054505A1
公开(公告)日：2019-02-21
申请号：US16080185
申请日：2016-12-28
发明人： Yuichi HIRATA , Shinji AGO , Takanori SATO , Yuki SATO
摘要： A machining swarf removing apparatus (7) includes a left and a right machining swarf removing units (25)(26). When removing machining swarf adhered to a recovery box (6), the left machining swarf removing unit (25) is placed in removal starting position. A brush (32) enters an insertion-ready state in which transverse direction thereof is oriented in a second direction D2. The brush (32) is moved to an insertion position for insertion into the recovery box (6), then the brush (32) is rotated to enter a machining swarf removal-ready state in which a longitudinal direction thereof is oriented in the second direction D2. The left machining swarf removing unit (25) is moved to remove the machining swarf adhered to the recovery box (6) by the brush (32), while a left rod vibrating device (43) is driven to vibrate a rod (33), vibrating the brush (32) attached to the rod (33).
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公开(公告)号：US20210268609A1
公开(公告)日：2021-09-02
申请号：US17182243
申请日：2021-02-23
发明人： Yuichi HIRATA , Takanori SATO , Yuya JIN
摘要： A laser processing apparatus 1 includes a laser head 31, a flexible cable 6 connecting a laser oscillator and the laser head 31 to each other, a conveyance apparatus 2 that conveys a workpiece W, a head drive mechanism 5 that moves the laser head 31 to a processing position, and a cable support mechanism 7 that moves the cable 6 in association with movement of the laser head 31. The cable support mechanism 7 includes a first holder 61 holding the cable 6, a first spring balancer 711 connected to the first holder 61 through a first wire 712, and a second spring balancer 721 connected to the first holder 61 through a second wire 722. The spring balancers 711, 721 are fixed to a support frame 8, and as viewed in plane, are arranged in a line along a width direction X perpendicular to a conveyance direction Y.
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公开(公告)号：US20210268603A1
公开(公告)日：2021-09-02
申请号：US17183374
申请日：2021-02-24
发明人： Hiroki TOKUICHI , Shin YOSHIDA , Takanori SATO , Yuichi HIRATA , Naruhiko OKUBO , Koki MIZUTANI
摘要： A laser processing apparatus 3 includes: a laser head H; a head driving mechanism that moves the laser head H above a workpiece W; and a dust collecting box 60 that moves below the workpiece W and follows the laser head H. A non-contact support unit 7 is provided at an opening 61 of the dust collecting box 60, and the non-contact support unit 7 suctions a lower surface of the workpiece W toward a suction surface 71 and supports the workpiece W without bringing the lower surface of the workpiece W and the suction surface 71 into contact with each other. An outer support roller 81 and an inner support roller 82 that are each rotatable about an axis parallel to a width direction orthogonal or substantially orthogonal to a conveying direction Fy are provided at the opening 61.
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