CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

    公开(公告)号:US20240276651A1

    公开(公告)日:2024-08-15

    申请号:US18005461

    申请日:2022-08-18

    CPC classification number: H05K3/3468 H05K1/113 H05K3/3485 H05K3/425

    Abstract: A circuit board assembly and an electronic is provided. The circuit board assembly includes at least a frame plate and circuit boards. The frame plate includes a frame body, first soldering portions, and second soldering portions. The frame body has a middle accommodating hole, an inner wall facing the middle accommodating hole, and an outer wall facing away from the middle accommodating hole. The first soldering portions are provided in an intermediate region located on the frame body between the inner wall and the outer wall. At least one of the inner wall and the outer wall is provided with accommodating grooves. The accommodating grooves extend along a thickness direction of the frame plate. The second soldering portions are provided in the accommodating grooves and connected to the frame body. Two circuit boards are respectively provided on two opposite sides of the frame plate along the thickness direction. The circuit board includes pads.

    CIRCUIT BOARD ASSEMBLY, MANUFACTURING METHOD, AND ELECTRONIC DEVICE

    公开(公告)号:US20240179845A1

    公开(公告)日:2024-05-30

    申请号:US18022376

    申请日:2022-08-22

    Abstract: A circuit board assembly, a manufacturing method are provided. The circuit board assembly includes a flexible printed circuit board and a printed circuit board, a pad for disposing a welding piece is provided on the printed circuit board, the flexible printed circuit board includes a main body and a welding part disposed on an inner wall of a through hole of the main body, the through hole includes a recessing part and a connection segment connected to a bottom wall of the recessing part, the recessing part is disposed on a side that is of the connection segment and that is away from the pad, and an end that is of the connection segment and that is away from the recessing part faces the pad, so that the welding piece overflows into the recessing part through the connection segment, and welds the welding part to the pad.

    CIRCUIT BOARD ASSEMBLY AND ELECTRONIC DEVICE

    公开(公告)号:US20240206102A1

    公开(公告)日:2024-06-20

    申请号:US18025470

    申请日:2022-08-18

    CPC classification number: H05K7/1422

    Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.

    METHOD FOR INCREASING PAGING RESPONSE SPEED OF TERMINAL AND TERMINAL

    公开(公告)号:US20230101731A1

    公开(公告)日:2023-03-30

    申请号:US17801472

    申请日:2021-03-05

    Abstract: A method for improving a paging response speed of a user equipment (UE), includes: camping, by the UE on a first cell of a first network, the UE being in an RRC connected state; when a first preset condition is met, sending, by an access network device, a first message to the UE, the first message being used to indicate the UE to enter an RRC inactive state; recording, by the access network device, that the UE is in an RRC inactive state; and in response to the first message that is received, entering, by the UE, the RRC inactive state; and when a second preset condition is met, camping, by the UE, on a second cell of the first network, where the UE is in an RRC inactive state, and the first cell and the second cell are the same or different.

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