公开(公告)号：US20240206102A1

公开(公告)日：2024-06-20

申请号：US18025470

申请日：2022-08-18

Applicant: HONOR DEVICE CO., LTD.

Inventor： Jianqiang GUO ,  Wenjun LUO ,  Fan YANG

IPC: H05K7/14

CPC classification number: H05K7/1422

Abstract: Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.

公开(公告)号：US20220407218A1

公开(公告)日：2022-12-22

申请号：US17778354

申请日：2021-04-13

Applicant: Honor Device Co., Ltd.

Inventor： Jianqiang GUO ,  Liang BAI ,  Lianjie YE ,  Wenjun LUO ,  Zhihai LI

IPC: H01Q1/24 ,  H04M1/02 ,  H01Q1/50

Abstract: An electronic device, relating to the technical field of antennas. The electronic device includes a frame, a screen, and a circuit board assembly. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator.

公开(公告)号：US20240269759A1

公开(公告)日：2024-08-15

申请号：US18042050

申请日：2022-09-14

Applicant: Honor Device Co., Ltd.

Inventor： Jianqiang GUO ,  Wenjun LUO ,  Mingchuan LI

IPC: B23K1/00 ,  B23K1/005 ,  B23K3/047 ,  B23K3/08 ,  B23K101/42 ,  H05K3/36

CPC classification number: B23K1/0016 ,  B23K1/0056 ,  B23K3/047 ,  B23K3/087 ,  H05K3/363 ,  B23K2101/42 ,  H05K2203/0147

Abstract: This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.