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公开(公告)号：US20240206102A1
公开(公告)日：2024-06-20
申请号：US18025470
申请日：2022-08-18
发明人： Jianqiang GUO , Wenjun LUO , Fan YANG
IPC分类号： H05K7/14
CPC分类号： H05K7/1422
摘要： Embodiments of this application provide a circuit board assembly and an electronic device. The circuit board assembly includes at least a frame plate, circuit boards, support bodies, and solder joints. The frame plate includes a frame body and first pads provided on the frame body. The circuit boards each are provided on one side of the frame plate. The circuit board includes a board body and second pads provided on the board body. The support bodies are provided between the frame plate and the circuit boards. The support bodies each include a first support portion and a second support portion. The first support portion is connected to the frame body. The second support portion is connected to the board body. Solder joints are provided between the first pads and the second pads. The solder joints connect the first pads to the second pads.
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公开(公告)号：US20220407218A1
公开(公告)日：2022-12-22
申请号：US17778354
申请日：2021-04-13
发明人： Jianqiang GUO , Liang BAI , Lianjie YE , Wenjun LUO , Zhihai LI
摘要： An electronic device, relating to the technical field of antennas. The electronic device includes a frame, a screen, and a circuit board assembly. A part of the frame forms a radiator of an antenna, or the radiator of the antenna is fixed on an inner side of the frame. The circuit board assembly is located on the inner side of the frame. The circuit board assembly includes a first conductive member, and a first board, an elevating board, and a second board sequentially stacked. The first board is located on one side of the second board away from the screen. The first board includes a first main body portion and a first extension portion connected to the first main body portion. The first main body portion is fixedly connected to the elevating board. The first extension portion protrudes relative to the elevating board and the second board, and is disposed close to the radiator.
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公开(公告)号：US20240276651A1
公开(公告)日：2024-08-15
申请号：US18005461
申请日：2022-08-18
发明人： Jianqiang GUO , Liying WANG , Xiaoyan WANG , Fan YANG
CPC分类号： H05K3/3468 , H05K1/113 , H05K3/3485 , H05K3/425
摘要： A circuit board assembly and an electronic is provided. The circuit board assembly includes at least a frame plate and circuit boards. The frame plate includes a frame body, first soldering portions, and second soldering portions. The frame body has a middle accommodating hole, an inner wall facing the middle accommodating hole, and an outer wall facing away from the middle accommodating hole. The first soldering portions are provided in an intermediate region located on the frame body between the inner wall and the outer wall. At least one of the inner wall and the outer wall is provided with accommodating grooves. The accommodating grooves extend along a thickness direction of the frame plate. The second soldering portions are provided in the accommodating grooves and connected to the frame body. Two circuit boards are respectively provided on two opposite sides of the frame plate along the thickness direction. The circuit board includes pads.
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4.发明公开公开(公告)号：US20240269759A1
公开(公告)日：2024-08-15
申请号：US18042050
申请日：2022-09-14
发明人： Jianqiang GUO , Wenjun LUO , Mingchuan LI
CPC分类号： B23K1/0016 , B23K1/0056 , B23K3/047 , B23K3/087 , H05K3/363 , B23K2101/42 , H05K2203/0147
摘要： This application provides a circuit board assembly soldering apparatus and corresponding method. The soldering apparatus is provided with at least two bearing seats on a base plate, the bearing seats are located in a space between the base plate and a pressing plate assembly, the bearing seats each include a workbench, the workbench is located on a side of the bearing seat that faces the pressing plate assembly, a circuit board assembly is placed on the workbench. At least one adjustable bearing seat is provided, and a spacing between the workbench of the adjustable bearing seat and the base plate is adjustable. Further, a spacing between the workbench of the adjustable bearing seat and the pressing plate assembly is adjusted, to implement soldered connection between circuit board assemblies with different thicknesses, and the soldering apparatus can connect at least two circuit board assemblies by soldering at a single time.
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公开(公告)号：US20240179845A1
公开(公告)日：2024-05-30
申请号：US18022376
申请日：2022-08-22
发明人： Fan YANG , Jianqiang GUO , Mingchuan LI
CPC分类号： H05K1/147 , H05K1/028 , H05K3/361 , H05K2201/09845 , H05K2203/04
摘要： A circuit board assembly, a manufacturing method are provided. The circuit board assembly includes a flexible printed circuit board and a printed circuit board, a pad for disposing a welding piece is provided on the printed circuit board, the flexible printed circuit board includes a main body and a welding part disposed on an inner wall of a through hole of the main body, the through hole includes a recessing part and a connection segment connected to a bottom wall of the recessing part, the recessing part is disposed on a side that is of the connection segment and that is away from the pad, and an end that is of the connection segment and that is away from the recessing part faces the pad, so that the welding piece overflows into the recessing part through the connection segment, and welds the welding part to the pad.
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