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1.发明申请Method of producing a glass substrate for a mask blank and method of producing a mask blank 审中-公开用于掩模坯料的玻璃基板的制造方法和掩模坯料的制造方法公开(公告)号：US20040192171A1
公开(公告)日：2004-09-30
申请号：US10809523
申请日：2004-03-26
Applicant: HOYA CORPORATION
Inventor： Kesahiro Koike
IPC: B24B049/00 , B24B051/00 , B24B001/00
CPC classification number: B24B49/00 , B24B37/042 , G03F1/60
Abstract: A method of producing a glass substrate for a mask blank has the steps of measuring a convex/concave profile of a surface of the glass substrate, controlling a flatness of the surface of the glass substrate to a value not greater than a predetermined reference value by specifying the degree of convexity of a convex portion present on the surface of the glass substrate with reference to a result of measurement obtained in the profile measuring step and executing local machining upon the convex portion under a machining condition depending upon the degree of convexity, and polishing, after the flatness control step, the surface of the glass substrate subjected to the local machining by the action of a machining liquid interposed between the surface of the glass substrate and a surface of a polishing tool without direct contact therebetween.
Abstract translation: 制造掩模坯料用玻璃基板的方法具有以下步骤：测量玻璃基板的表面的凸/凹形轮廓，将玻璃基板的表面的平坦度控制为不大于预定基准值的值，由 参照在轮廓测量步骤中获得的测量结果指定存在于玻璃基板表面上的凸部的凸度，并根据凸度在加工条件下对凸部进行局部加工，以及 在平坦度控制步骤之后，通过介于玻璃基板的表面和抛光工具的表面之间的机械液体的作用进行局部加工的玻璃基板的表面，而不会直接接触。
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2.发明申请Method of producing a glass substrate for a mask blank, method of producing a mask blank, method of producing a transfer mask, method of producing a semiconductor device, glass substrate for a mask blank, mask blank, and transfer mask 有权制造掩模板用玻璃基板的方法，掩模坯料的制造方法，转印掩模的制造方法，半导体装置的制造方法，掩模坯料用玻璃基板，掩模坯料和转印掩模公开(公告)号：US20040035153A1
公开(公告)日：2004-02-26
申请号：US10642657
申请日：2003-08-19
Applicant: HOYA CORPORATION
Inventor： Kesahiro Koike , Junji Miyagaki
IPC: B24B001/00
CPC classification number: C09G1/02 , B24B37/044
Abstract: In a method of producing a glass substrate for a mask blank, a surface of the glass substrate is polished by the use of a polishing liquid containing abrasive grains, and the abrasive grains include colloidal silica abrasive grains produced by hydrolysis of an organosilicon compound.
Abstract translation: 在制造掩模用玻璃基板的方法中，通过使用含有磨粒的研磨液对玻璃基板的表面进行研磨，磨粒包括通过有机硅化合物的水解生成的胶体二氧化硅磨粒。
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3.发明申请Method of producing a glass substrate for a mask blank and method of producing a mask blank 有权用于掩模坯料的玻璃基板的制造方法和掩模坯料的制造方法公开(公告)号：US20040192063A1
公开(公告)日：2004-09-30
申请号：US10809419
申请日：2004-03-26
Applicant: HOYA CORPORATION
Inventor： Kesahiro Koike
IPC: G03F009/00 , H01L021/302 , H01L021/461
CPC classification number: B24B37/08 , B24B37/013 , B24B49/12 , C03B19/1469 , C03C15/00 , C03C15/02 , C03C19/00 , G03F1/60
Abstract: A method of producing a glass substrate for a mask blank has the steps of measuring a convex/concave profile of a surface of the glass substrate, controlling a flatness of the surface of the glass substrate to a value not greater than a predetermined reference value by specifying the degree of convexity of a convex portion present on the surface of the glass substrate with reference to a result of measurement obtained in the profile measuring step and executing local machining upon the convex portion under a machining condition depending upon the degree of convexity, and polishing, after the flatness control step, the surface of the glass substrate subjected to the local machining. The surface of the glass substrate subjected to the local machining is subjected to acid treatment after the flatness control step and before the polishing step.
Abstract translation: 制造掩模坯料用玻璃基板的方法具有以下步骤：测量玻璃基板的表面的凸/凹形轮廓，将玻璃基板的表面的平坦度控制为不大于预定基准值的值，由 参照在轮廓测量步骤中获得的测量结果指定存在于玻璃基板表面上的凸部的凸度，并根据凸度在加工条件下对凸部进行局部加工，以及 在平坦度控制步骤之后，对玻璃基板的表面进行局部加工。 经过局部加工的玻璃基板的表面在平坦度控制步骤之后和抛光步骤之前进行酸处理。
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4.发明申请Method of determining a flatness of an electronic device substrate, method of producing the substrate, method of producing a mask blank, method of producing a transfer mask, polishing method, electronic device substrate, mask blank, transfer mask, and polishing apparatus 有权确定电子器件基板的平坦度的方法，制造基板的方法，掩模坯料的制造方法，转印掩模的制造方法，抛光方法，电子器件基板，掩模板，转印掩模和抛光装置公开(公告)号：US20030186624A1
公开(公告)日：2003-10-02
申请号：US10401770
申请日：2003-03-31
Applicant: HOYA CORPORATION
Inventor： Kesahiro Koike , Masato Ohtsuka , Yasutaka Tochihara
IPC: B24B049/00 , B24B001/00
CPC classification number: B24B49/16 , B24B37/30 , B24B49/04 , G03F1/60 , Y10T428/24355
Abstract: A flatness of a substrate is determined to achieve a desired flatness of a mask blank by predicting the variation in flatness resulting from a film stress of a thin film formed on the substrate. The flatness is adjusted by measuring the flatness of the substrate as a measured flatness, selecting a load type with reference to the measured flatness, and polishing the substrate under pressure distribution specified by the load type. A principal surface of the substrate has a flatness greater than 0 nullm and not greater than 0.25 nullm. A polishing apparatus includes a rotatable surface table, a polishing pad formed thereon, abrasive supplying means for supplying an abrasive to the polishing pad, substrate holding means, and substrate pressing means for pressing the substrate. The substrate pressing means has a plurality of pressing members for individually and desirably pressing a plurality of divided regions of the substrate surface.
Abstract translation: 通过预测由形成在基板上的薄膜的膜应力导致的平坦度的变化，确定基板的平坦度以实现掩模坯料的期望的平坦度。 通过测量作为测量平面度的基板的平整度，参照所测量的平坦度选择载荷类型，并在由载荷类型规定的压力分布下研磨基板来调整平面度。 基板的主表面具有大于0μm且不大于0.25μm的平坦度。 抛光装置包括可旋转的表台，形成在其上的抛光垫，用于向研磨垫供给研磨剂的磨料供给装置，基板保持装置以及用于按压基板的基板按压装置。 基板按压装置具有多个按压部件，用于分别且期望地按压基板表面的多个分割区域。
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