公开(公告)号：US20040084207A1

公开(公告)日：2004-05-06

申请号：US10728506

申请日：2003-12-05

Applicant: HRL Laboratories, LLC

Inventor： Daniel F. Sievenpiper ,  Joseph L. Pikulski ,  James H. Schaffner ,  Tsung-Yuan Hsu

IPC: H01G009/00

CPC classification number: H05K1/162 ,  H01Q15/008 ,  H01Q15/14 ,  H01Q15/141 ,  H05K1/0284 ,  H05K3/045 ,  H05K3/4614 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09672 ,  H05K2201/09981 ,  H05K2203/0455 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49174

Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

公开(公告)号：US20030010529A1

公开(公告)日：2003-01-16

申请号：US09905794

申请日：2001-07-13

Applicant: HRL Laboratories, LLC

Inventor： Daniel F. Sievenpiper ,  Joseph L. Pikulski ,  James H. Schaffner ,  Tsung-Yuan Hsu

IPC: H01G007/00

CPC classification number: H05K1/162 ,  H01Q15/008 ,  H01Q15/14 ,  H01Q15/141 ,  H05K1/0284 ,  H05K3/045 ,  H05K3/4614 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09672 ,  H05K2201/09981 ,  H05K2203/0455 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49174

Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

Abstract translation: 高阻抗表面及其制造方法。 该表面包括具有其中的重复图案的模制结构和侧壁表面的重复图案，所述孔贯穿其第一和第二主表面之间的结构以及连接第一主表面的侧壁表面。 金属层放置在所述模制结构上，金属层在孔中，覆盖第二主表面的至少一部分，覆盖第一主表面的侧壁和部分，以通过金属层将侧壁与其它侧壁互连 在第二个主表面和孔中。