公开(公告)号：US20230174371A1

公开(公告)日：2023-06-08

申请号：US18161310

申请日：2023-01-30

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Qin SHI ,  Qifang HU ,  Anping QIU ,  Jinghui XU

IPC分类号： B81B7/00 ,  B81C1/00

CPC分类号： B81B7/0048 ,  B81C1/00888 ,  B81B2201/0235 ,  B81B2201/0242

摘要： An MEMS device includes a package (1), a bottom plate (2), and a first inertial component (3). The first inertial component (3) is located in packaging space (4) formed by the bottom plate (2) and the package (1). There is a first alignment part (21) on a surface that is of the bottom plate (2) and that faces the packaging space (4), and the first inertial component (3) has a first mounting part (31). A shape of the first mounting part (31) matches a shape of the first alignment part (21). The MEMS device is equipped with a mounting alignment reference, the first mounting part (31) is connected to the first alignment part (21), and the first inertial component is mounted on the bottom plate at a preset angle. In addition, a bottom part of the first inertial component is not directly connected to the bottom plate.