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公开(公告)号：US20230365400A1
公开(公告)日：2023-11-16
申请号：US18360926
申请日：2023-07-28
发明人： Guoqiang WU , Shangshu YANG , Jinghui XU , Zhongye WU , Qifang HU
CPC分类号： B81B7/0048 , B81C3/001 , B81C2203/032
摘要： The technology of this application relates to an encapsulation structure that includes a micro-electromechanical system (MEMS) device, a substrate, and an attachment material. Materials included in the substrate include at least a first-type material and a second-type material, a coefficient of thermal expansion of the first-type material is less than a coefficient of thermal expansion of a base material of the MEMS device, and a coefficient of thermal expansion of the second-type material is greater than the coefficient of thermal expansion of the base material of the MEMS device. The attachment material is located between the MEMS device and the substrate, and is configured to attach the MEMS device to the substrate. The substrate includes a plurality of different materials.
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公开(公告)号：US20230176265A1
公开(公告)日：2023-06-08
申请号：US18154089
申请日：2023-01-13
发明人： Jinghui XU , Fengpei SUN , Jun FENG , Ming LI
CPC分类号： G02B5/0816 , G02B13/0065 , G03B30/00 , H04M1/0264
摘要： A reflector (10), a method for manufacturing the same, a lens module (001), and an electronic device are provided, and pertain to the field of optical technologies. The reflector (10) uses a silicon-based substrate (101) with a planar structure as a base material, which can effectively reduce a volume and mass of the reflector (10) when compared with a right triangular prism. In addition, an included angle (γ) between a second side surface (1d) and a second surface (1b) of the silicon-based substrate (101) is designed as an obtuse angle, to ensure that after the reflector (10) is arranged in an inclined manner, a right angle protruding outward is not formed between the second side face (1d) and the second surface (1b).
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公开(公告)号：US20230266360A1
公开(公告)日：2023-08-24
申请号：US18308098
申请日：2023-04-27
发明人： Shihao TANG , Qifang HU , Jinghui XU
IPC分类号： G01P15/18 , G01P15/125 , G01P15/08
CPC分类号： G01P15/18 , G01P15/125 , G01P15/0802
摘要： This application provides an accelerometer, an inertial measurement unit IMU, and an electronic device. The accelerometer includes an upper cover layer, the first axis accelerometer, and a substrate layer. The first axis accelerometer includes the first anchor region, a cantilever beam, a first proof mass, a first movable electrode, a second movable electrode, a first fixed electrode, a second fixed electrode, a second anchor region, and a third anchor region. The first proof mass is supported by the cantilever beam and suspended above the substrate layer. The first anchor region, the second anchor region, and the third anchor region are separately connected to the substrate layer and/or the upper cover layer. The first anchor region is located at the central position of the first axis accelerometer. This application may be applied to fields such as consumer electronics, wearable devices, industrial automation, the automobile industry, and the aircraft industry.
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公开(公告)号：US20230174371A1
公开(公告)日：2023-06-08
申请号：US18161310
申请日：2023-01-30
发明人： Qin SHI , Qifang HU , Anping QIU , Jinghui XU
CPC分类号： B81B7/0048 , B81C1/00888 , B81B2201/0235 , B81B2201/0242
摘要： An MEMS device includes a package (1), a bottom plate (2), and a first inertial component (3). The first inertial component (3) is located in packaging space (4) formed by the bottom plate (2) and the package (1). There is a first alignment part (21) on a surface that is of the bottom plate (2) and that faces the packaging space (4), and the first inertial component (3) has a first mounting part (31). A shape of the first mounting part (31) matches a shape of the first alignment part (21). The MEMS device is equipped with a mounting alignment reference, the first mounting part (31) is connected to the first alignment part (21), and the first inertial component is mounted on the bottom plate at a preset angle. In addition, a bottom part of the first inertial component is not directly connected to the bottom plate.
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公开(公告)号：US20230174370A1
公开(公告)日：2023-06-08
申请号：US18161263
申请日：2023-01-30
发明人： Fengpei SUN , Zhihong FENG , Jinghui XU , Xiaoshi DONG
CPC分类号： B81B3/0051 , B81B3/001 , B81C1/00341 , G02B26/0841 , G02B26/0858 , G02B26/085 , B81B2201/042 , B81B2203/0136 , B81C2203/03
摘要： An MEMS chip includes a substrate, a movable assembly, a fastening assembly, and a drive assembly. The fastening assembly is located between the substrate and the movable assembly. The movable assembly includes a fastening portion, a movable portion, and a first support beam. The first support beam is connected to the movable portion and the fastening portion. A first avoidance slot is disposed on a face that is of the movable portion and that faces the fastening assembly. The fastening assembly is grounded. A boss and a first position limiting pole are disposed on a face that is of the fastening assembly and that faces the movable assembly. The boss is connected to the fastening portion and configured to support the fastening portion. The first position limiting pole corresponds to the first avoidance slot. The drive assembly is connected to the movable portion to drive the movable portion to move.
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公开(公告)号：US20230043470A1
公开(公告)日：2023-02-09
申请号：US17974326
申请日：2022-10-26
发明人： Zhihong FENG , Danyang YAO , Jinghui XU
摘要： This application discloses example piezoelectric acoustic sensors and methods for manufacturing the piezoelectric acoustic sensor, and belongs to the field of electronic technologies. In one example, the piezoelectric acoustic sensor includes an anchoring unit, a piezoelectric unit, a support unit, and a hollow-out mechanical part. A back cavity is formed in the anchoring unit. The piezoelectric unit is configured to convert a sound signal that enters the back cavity into an electrical signal. The support unit covers the anchoring unit and the piezoelectric unit. The hollow-out mechanical part is connected between the anchoring unit and the piezoelectric unit, and is embedded in the support unit.
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