公开(公告)号：US20120292007A1

公开(公告)日：2012-11-22

申请号：US13220641

申请日：2011-08-29

申请人： HUNG-NIEN CHIU ,  CHING-BAI HWANG ,  NIEN-TIEN CHENG

发明人： HUNG-NIEN CHIU ,  CHING-BAI HWANG ,  NIEN-TIEN CHENG

IPC分类号： F28F13/00 ,  F28D15/04

CPC分类号： F28D15/0275 ,  F28D15/0233 ,  F28D15/06 ,  F28D2021/0028 ,  F28F1/32

摘要： A heat dissipation device for cooling a heat generating component, includes a fins module, a heat pipe, a fan, at least two temperature sensors, and a control system. The heat pipe includes an evaporation section absorbing heat from the heat generating component, and a condensation section thermally connected to the fins module. The fan is for driving airflow towards the fins module. The at least two temperature sensors are arranged on the evaporation section of the heat pipe, for continuously sensing temperatures of their respective positions on the heat pipe. The control system adjusts the speed of the fan and/or the operating power of the heat generating component according to the sensed temperatures of the at least two temperature sensors. A method for controlling the heat dissipation device is also provided.

摘要翻译： 一种用于冷却发热部件的散热装置，包括翅片模块，热管，风扇，至少两个温度传感器和控制系统。 热管包括从发热部件吸收热量的蒸发部和与散热片模块热连接的冷凝部。 风扇用于驱动朝向散热片模块的气流。 至少两个温度传感器布置在热管的蒸发部分上，用于连续检测热管上各自位置的温度。 控制系统根据感测到的至少两个温度传感器的温度来调节风扇的速度和/或发热部件的操作功率。 还提供了一种用于控制散热装置的方法。

公开(公告)号：US20130312938A1

公开(公告)日：2013-11-28

申请号：US13532809

申请日：2012-06-26

申请人： NIEN-TIEN CHENG ,  CHING-BAI HWANG

发明人： NIEN-TIEN CHENG ,  CHING-BAI HWANG

IPC分类号： F28D15/04

CPC分类号： F28D15/04 ,  F28D15/06 ,  F28F1/30 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： An exemplary heat pipe includes a hollow tube, a wick structure, a working fluid, and an accelerator. The tube includes an evaporator section and a condenser section along a longitudinal direction thereof. The wick structure is adhered on inner surfaces of the tube and inner surfaces of the wick structure surround an inner space therebetween. The working fluid is contained in the wick structure. The accelerator is received in the tube and edges thereof abut against the inner surfaces of the wick structure to divide the inner space to two parts. The working fluid in the wick structure of the evaporator section absorbs heat from a heat-generating component and is vaporized to vapor, and the vapor flows through the accelerator and moves faster and faster towards the condenser section.

摘要翻译： 示例性的热管包括中空管，芯结构，工作流体和加速器。 该管包括蒸发器部分和沿着其纵向方向的冷凝器部分。 芯结构粘附在管的内表面上，芯结构的内表面围绕着它们之间的内部空间。 工作流体包含在油绳结构中。 加速器被容纳在管中并且其边缘抵靠在芯结构的内表面上以将内部空间分成两部分。 蒸发器部分的芯结构中的工作流体吸收来自发热部件的热量并蒸发成蒸气，并且蒸汽流过加速器并朝向冷凝器部分移动得更快更快。

公开(公告)号：US20110247861A1

公开(公告)日：2011-10-13

申请号：US12775499

申请日：2010-05-07

申请人： CHING-BAI HWANG ,  HUNG-NIEN CHIU ,  SHU-CHENG YANG

发明人： CHING-BAI HWANG ,  HUNG-NIEN CHIU ,  SHU-CHENG YANG

IPC分类号： H05K1/00

CPC分类号： H05K1/0203 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H05K2201/066 ,  H05K2201/10598 ,  H01L2924/00

摘要： An exemplary electronic device includes a circuit board defining apertures therein, an electronic component arranged on the circuit board and surrounded by the apertures, a heat spreader arranged on the electronic component, and a latching mechanism fixing the heat spreader to the electronic component. The latching mechanism includes latching arms extending outwards from the heat spreader and elastic poles. Each latching arm defines a latching hole aligned with one of the apertures of the circuit board. The poles respectively extend through the apertures and the latching holes in turn. Each pole includes a main body engaged in the corresponding latching hole and a head resiliently abutting against the latching arm.

摘要翻译： 示例性电子设备包括限定其中的孔的电路板，布置在电路板上并被孔包围的电子部件，布置在电子部件上的散热器以及将散热器固定到电子部件的闭锁机构。 闭锁机构包括从散热器和弹性杆向外延伸的闩锁臂。 每个锁定臂限定与电路板的一个孔对准的锁定孔。 杆分别依次延伸穿过孔和锁孔。 每个杆包括接合在相应的闩锁孔中的主体和弹性地抵靠闩锁臂的头部。

公开(公告)号：US20090268392A1

公开(公告)日：2009-10-29

申请号：US12169639

申请日：2008-07-09

申请人： NIEN-TIEN CHENG ,  YUNG-FA CHENG ,  RUNG-AN CHEN ,  CHENG-JEN LIANG ,  CHING-BAI HWANG

发明人： NIEN-TIEN CHENG ,  YUNG-FA CHENG ,  RUNG-AN CHEN ,  CHENG-JEN LIANG ,  CHING-BAI HWANG

IPC分类号： G06F1/20 ,  H05K7/14 ,  H05K7/20

CPC分类号： G06F1/203

摘要： A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.

摘要翻译： 笔记本电脑包括发热部件，由导热材料制成的键盘框架和具有蒸发器和冷凝器的热管。 热管的蒸发器与发热部件热连通，并且冷凝器连接到键盘框架并远离发热部件。

公开(公告)号：US20090284912A1

公开(公告)日：2009-11-19

申请号：US12235609

申请日：2008-09-23

申请人： NIEN-TIEN CHENG ,  YUNG-FA CHENG ,  CHING-BAI HWANG ,  ZHI-HUI ZHAO ,  RUNG-AN CHEN

发明人： NIEN-TIEN CHENG ,  YUNG-FA CHENG ,  CHING-BAI HWANG ,  ZHI-HUI ZHAO ,  RUNG-AN CHEN

IPC分类号： H05K7/20

CPC分类号： G06F1/203

摘要： A notebook computer (1000) includes a base (100), a cover (300), a computer printed circuit board (PCB) (200) and a centrifugal fan (40). The cover covers the base, and cooperates with the base to form a receiving space (500) therebetween. The computer PCB is received in the receiving space and mounted on the base. The centrifugal fan is received in the receiving space, and includes a stator (401) and an impeller (402), rotatable with respect to the stator. The stator includes a motor (415) and a fan PCB (405) directly attached to the base. The motor electrically connects to the fan PCB. When the impeller rotates, airflow enters the receiving space through top and bottom air inlets (304,104). The fan PCB is integrally formed with the computer PCB and has a height less than the computer PCB.

摘要翻译： 笔记本电脑（1000）包括基座（100），盖（300），计算机印刷电路板（PCB）（200）和离心式风扇（40）。 所述盖子覆盖所述底座，并且与所述基座配合以在它们之间形成接收空间（500）。 计算机PCB接收在接收空间并安装在基座上。 离心风扇被容纳在接收空间中，并且包括可相对于定子旋转的定子（401）和叶轮（402）。 定子包括直接连接到基座的电动机（415）和风扇PCB（405）。 电机电连接到风扇PCB。 当叶轮旋转时，气流通过顶部和底部空气入口进入接收空间（304,104）。 风扇PCB与计算机PCB一体形成，并且具有小于计算机PCB的高度。

公开(公告)号：US20130201630A1

公开(公告)日：2013-08-08

申请号：US13418366

申请日：2012-03-13

申请人： SHIH-YAO LI ,  JUI-WEN HUNG ,  CHING-BAI HWANG

发明人： SHIH-YAO LI ,  JUI-WEN HUNG ,  CHING-BAI HWANG

IPC分类号： H05K7/20 ,  F28F7/00

CPC分类号： F28F3/022 ,  F28D2021/0029 ,  F28F7/00 ,  F28F2255/02

摘要： An exemplary electronic device includes a printed circuit board, electronic components mounted on a top surface of the printed circuit board, and a heat dissipation device. The heat dissipation device contacts the electronic components to absorb heat generated from the electronic components and dissipate the heat by natural convection and thermal radiation. The heat dissipation device includes a base plate contacting the electronic components to absorb heat generated therefrom and thermal hairs mounted on a top surface of the base plate. The thermal hairs wave with heated airflow at an inner of the electronic device to dissipate heat transferred from the base plate.

摘要翻译： 示例性电子设备包括印刷电路板，安装在印刷电路板的顶表面上的电子部件和散热装置。 散热装置接触电子部件以吸收由电子部件产生的热量，并通过自然对流和热辐射消散热量。 散热装置包括与电子部件接触以吸收由此产生的热量的底板和安装在基板顶表面上的热毛发。 热毛发在电子设备的内部具有加热的气流波浪，以散发从基板传递的热量。

公开(公告)号：US20130087311A1

公开(公告)日：2013-04-11

申请号：US13332391

申请日：2011-12-21

申请人： CHIH-PENG LEE ,  CHING-BAI HWANG

发明人： CHIH-PENG LEE ,  CHING-BAI HWANG

IPC分类号： F28F9/007

CPC分类号： F28D15/02 ,  F28D15/0233 ,  F28F2275/08 ,  F28F2275/20 ,  H01L23/427 ,  H01L2023/4087 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal module adapted for dissipating heat of an electronic component includes a heat pipe; and two mounting flakes mounted on the heat pipe. The mounting flakes are configured for mounting the thermal module on a circuit board on which the electronic component is mounted. Each of the mounting flakes is formed integrally as a single piece. The mounting flake includes a fixing body and two mounting arms formed at two opposite ends of the fixing body. The fixing body is directly bonded on the heat pipe. The mounting arms extend beyond the heat pipe and define through holes therein for extension of fasteners.

摘要翻译： 适于散发电子部件的热量的热模块包括热管; 和安装在热管上的两个安装片。 安装薄片被配置为将热模块安装在其上安装有电子部件的电路板上。 每个安装薄片一体地形成为单件。 安装片包括固定体和形成在固定体两相对端的两个安装臂。 固定体直接粘接在热管上。 安装臂延伸超过热管并且在其中限定通孔以延伸紧固件。

公开(公告)号：US20100139895A1

公开(公告)日：2010-06-10

申请号：US12482404

申请日：2009-06-10

申请人： CHING-BAI HWANG ,  JIN-GONG MENG ,  ZHI-HUI ZHAO

发明人： CHING-BAI HWANG ,  JIN-GONG MENG ,  ZHI-HUI ZHAO

IPC分类号： F28D15/02

CPC分类号： H01L23/427 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A thermal module includes a blower, a fin unit and a heat pipe. The blower includes a base, a cover, a sidewall between the base and the cover, and an impeller arranged among the base, the cover and the sidewall. An air outlet is defined in the sidewall of the blower. The fin unit is arranged at the air outlet. The heat pipe has a contacting plate integrally formed with one of the base and the cover of the blower. The contacting plate of the heat pipe includes a dissipating surface attaching to the fin unit, and an absorbing surface with different portions adapted for contacting with electronic components, wherein the different portions of the absorbing plate being at different levels.

摘要翻译： 热模块包括鼓风机，翅片单元和热管。 鼓风机包括基座，盖子，基座和盖子之间的侧壁以及布置在基座，盖子和侧壁之间的叶轮。 空气出口被限定在鼓风机的侧壁中。 散热单元布置在出风口处。 热管具有与鼓风机的底座和盖子中的一个一体形成的接触板。 热管的接触板包括附接到翅片单元的散热表面，以及具有适于与电子部件接触的不同部分的吸收表面，其中吸收板的不同部分处于不同的水平。

公开(公告)号：US20090169389A1

公开(公告)日：2009-07-02

申请号：US11964923

申请日：2007-12-27

申请人： CHING-BAI HWANG ,  ZHI-HUI ZHAO ,  RAN LIN

发明人： CHING-BAI HWANG ,  ZHI-HUI ZHAO ,  RAN LIN

IPC分类号： B63H1/20

CPC分类号： F04D29/281 ,  F04D29/30 ,  F05D2240/304

摘要： A cooling fan (10) includes a bottom housing (12), a top cover (14) covering the bottom housing, and impeller (16) and stator accommodated in a space formed between the bottom housing and the top cover. The impeller includes a hub (162), and a plurality of blades (164) radially and outwardly extending from the hub. Each of the blades includes a windward surface (164a) and a leeward surface (164b) which has a different configuration with the windward surface. The windward surface has a tip portion selected from a group consisting of forward curved surface and planar surface. The leeward surface has a tip portion selected from a group consisting of planar surface and backward curved surface.

摘要翻译： 冷却风扇（10）包括底部壳体（12），覆盖底部壳体的顶盖（14）和容纳在底部壳体和顶盖之间形成的空间中的叶轮（16）和定子。 叶轮包括轮毂（162）和从轮毂径向向外延伸的多个叶片（164）。 每个叶片包括与迎风面具有不同构型的迎风面（164a）和背风表面（164b）。 迎风表面具有从由前曲面和平面组成的组中选择的尖端部分。 背风表面具有从由平面和向后弯曲表面组成的组中选择的尖端部分。

公开(公告)号：US20090010757A1

公开(公告)日：2009-01-08

申请号：US11840181

申请日：2007-08-16

申请人： CHING-BAI HWANG ,  JUI-WEN HUNG

发明人： CHING-BAI HWANG ,  JUI-WEN HUNG

IPC分类号： F01D1/02

CPC分类号： F04D25/0613 ,  F04D29/582 ,  F04D29/601 ,  G06F1/203

摘要： A centrifugal blower (10) includes a casing (12) and a rotor (14) rotatable disposed in the casing. The casing includes a base plate (121), a sidewall (122) extending from the base plate and a cover (123) covering the sidewall. The sidewall is a multilayer structure and includes a first section (128a) and a second section (128c). A distance between a central axis (A) of the rotor and an inner surface of the second section is greater than that between the central axis of the rotor and an inner surface of the first section. The first section is located below a mother board (20) and the second section sits on a top surface of the motherboard when the centrifugal blower is mounted to the mother board.

摘要翻译： 离心式鼓风机（10）包括壳体（12）和可旋转地设置在壳体中的转子（14）。 壳体包括基板（121），从基板延伸的侧壁（122）和覆盖侧壁的盖（123）。 侧壁是多层结构，并且包括第一部分（128a）和第二部分（128c）。 转子的中心轴线（A）和第二部分的内表面之间的距离大于转子的中心轴线与第一部分的内表面之间的距离。 第一部分位于母板（20）的下方，当离心鼓风机安装在母板上时，第二部分位于母板的顶面上。