公开(公告)号：US09156090B2

公开(公告)日：2015-10-13

申请号：US13824192

申请日：2011-09-15

申请人： Ha Neul Kim ,  Eon Sik Lee ,  Oh-Joon Kwan ,  Sun Jong Park ,  Hee Soo Kang

发明人： Ha Neul Kim ,  Eon Sik Lee ,  Oh-Joon Kwan ,  Sun Jong Park ,  Hee Soo Kang

IPC分类号： B22F9/08 ,  C21C5/28

CPC分类号： B22F9/082 ,  B22F2009/0828 ,  B22F2009/0888 ,  C21C5/28 ,  Y02P10/216

摘要： A method of manufacturing iron-based powder includes providing an iron-based molten steel manufactured through a iron making process and a steelmaking process to a tundish; and performing water atomization over the molten steel discharged through a nozzle connected to the tundish. The iron-based powder is manufactured from the molten steel refined after a molten iron tapped from a iron making process is charged into a converter without a pre-treatment process of the molten iron, thus economically providing the highly clean iron-based powder.

摘要翻译： 制造铁基粉末的方法包括：通过炼铁工艺和炼钢工艺制造的铁基钢水到中间包; 并在通过与中间包连接的喷嘴排出的钢水上进行水雾化。 铁水粉末由炼铁过程中的铁水从炼铁过程中抽出的铁水加入到转炉中，而不用铁水的预处理，从而经济地提供高度清洁的铁基粉末。

公开(公告)号：US20130180360A1

公开(公告)日：2013-07-18

申请号：US13824192

申请日：2011-09-15

申请人： Ha Neul Kim ,  Eon Sik Lee ,  Oh-Joon Kwon ,  Sun Jong Park ,  Hee Soo Kang

发明人： Ha Neul Kim ,  Eon Sik Lee ,  Oh-Joon Kwon ,  Sun Jong Park ,  Hee Soo Kang

IPC分类号： B22F9/08

CPC分类号： B22F9/082 ,  B22F2009/0828 ,  B22F2009/0888 ,  C21C5/28 ,  Y02P10/216

摘要： A method of manufacturing iron-based powder includes providing an iron-based molten steel manufactured through a iron making process and a steelmaking process to a tundish; and performing water atomization over the molten steel discharged through a nozzle connected to the tundish. The iron-based powder is manufactured from the molten steel refined after a molten iron tapped from a iron making process is charged into a converter without a pre-treatment process of the molten iron, thus economically providing the highly clean iron-based powder.

摘要翻译： 制造铁基粉末的方法包括：通过炼铁工艺和炼钢工艺制造的铁基钢水到中间包; 并在通过与中间包连接的喷嘴排出的钢水上进行水雾化。 铁水粉末由炼铁过程中的铁水从炼铁过程中抽出的铁水加入到转炉中，而不用铁水的预处理，从而经济地提供高度清洁的铁基粉末。

公开(公告)号：US09147626B2

公开(公告)日：2015-09-29

申请号：US14455586

申请日：2014-08-08

申请人： Sung-Hwan Cha ,  Sang-Ran Koh ,  Yong Kook Kim ,  Woo-Han Kim ,  Ha Neul Kim ,  Chi Won An

发明人： Sung-Hwan Cha ,  Sang-Ran Koh ,  Yong Kook Kim ,  Woo-Han Kim ,  Ha Neul Kim ,  Chi Won An

IPC分类号： H01L23/29 ,  C08L83/04 ,  H01L33/56 ,  H01L31/048 ,  C09D183/04 ,  H01L31/0203 ,  C08G77/12 ,  C08G77/20 ,  H01L51/52

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  C09D183/04 ,  H01L31/0203 ,  H01L31/0481 ,  H01L33/56 ,  H01L51/5237 ,  H01L51/5253 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y02E10/50 ,  H01L2924/00

摘要： A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.

摘要翻译： 用于封装材料的树脂包括其末端具有与硅（Si-H）结合的氢的第一聚硅氧烷和在其末端包含与硅（Si-Vi）键合的烯基的第二聚硅氧烷，其中， 与第二聚硅氧烷中与硅（Si-Vi）结合的烯基与第一聚硅氧烷中与硅（Si-H）结合的氢的Si-H / Si-Vi为约1至约1。

公开(公告)号：US08847414B2

公开(公告)日：2014-09-30

申请号：US13339510

申请日：2011-12-29

申请人： Sung-Hwan Cha ,  Sang-Ran Koh ,  Yong Kook Kim ,  Woo-Han Kim ,  Ha Neul Kim ,  Chi Won An

发明人： Sung-Hwan Cha ,  Sang-Ran Koh ,  Yong Kook Kim ,  Woo-Han Kim ,  Ha Neul Kim ,  Chi Won An

IPC分类号： H01L23/29 ,  C08L83/05

CPC分类号： H01L23/296 ,  C08G77/12 ,  C08G77/20 ,  C08L83/04 ,  C09D183/04 ,  H01L31/0203 ,  H01L31/0481 ,  H01L33/56 ,  H01L51/5237 ,  H01L51/5253 ,  H01L2924/0002 ,  H01L2924/12044 ,  Y02E10/50 ,  H01L2924/00

摘要： A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.

摘要翻译： 用于封装材料的树脂包括其末端具有与硅（Si-H）结合的氢的第一聚硅氧烷和在其末端包含与硅（Si-Vi）键合的烯基的第二聚硅氧烷，其中， 与第二聚硅氧烷中与硅（Si-Vi）结合的烯基与第一聚硅氧烷中与硅（Si-H）结合的氢的Si-H / Si-Vi为约1至约1。

公开(公告)号：US20120168815A1

公开(公告)日：2012-07-05

申请号：US13338549

申请日：2011-12-28

申请人： Sang-Ran Koh ,  Yong Kook Kim ,  Woo-Han Kim ,  Ha Neul Kim ,  Chi Won An ,  Sung-Hwan Cha

发明人： Sang-Ran Koh ,  Yong Kook Kim ,  Woo-Han Kim ,  Ha Neul Kim ,  Chi Won An ,  Sung-Hwan Cha

IPC分类号： H01L33/52 ,  H01B1/20 ,  B82Y30/00

CPC分类号： H01L33/501 ,  C08G77/12 ,  C08G77/20 ,  C08K5/5435 ,  C08L83/04 ,  H01L27/322 ,  H01L33/56 ,  H01L51/5253 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： An encapsulation material and an electronic device, the encapsulation material including a resin, the resin including a first polysiloxane including hydrogen bonded with silicon (Si—H) at a terminal end thereof, and a second polysiloxane including an alkenyl group bonded with silicon (Si-Vi) at a terminal end thereof, a phosphor, and a density controlling agent, wherein a weight ratio of the density controlling agent to the phosphor is about 1.5:1 to about 10:1.

摘要翻译： 一种封装材料和电子器件，该封装材料包括树脂，该树脂包括在其末端包含与硅（Si-H）键合的氢的第一聚硅氧烷和包含与硅键合的第二聚硅氧烷（Si -Vi），荧光体和密度控制剂，其中密度控制剂与荧光体的重量比为约1.5：1至约10：1。