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公开(公告)号：US20120168815A1
公开(公告)日：2012-07-05
申请号：US13338549
申请日：2011-12-28
申请人： Sang-Ran Koh , Yong Kook Kim , Woo-Han Kim , Ha Neul Kim , Chi Won An , Sung-Hwan Cha
发明人： Sang-Ran Koh , Yong Kook Kim , Woo-Han Kim , Ha Neul Kim , Chi Won An , Sung-Hwan Cha
CPC分类号： H01L33/501 , C08G77/12 , C08G77/20 , C08K5/5435 , C08L83/04 , H01L27/322 , H01L33/56 , H01L51/5253 , H01L2224/48091 , H01L2924/12044 , H01L2924/00014 , H01L2924/00
摘要： An encapsulation material and an electronic device, the encapsulation material including a resin, the resin including a first polysiloxane including hydrogen bonded with silicon (Si—H) at a terminal end thereof, and a second polysiloxane including an alkenyl group bonded with silicon (Si-Vi) at a terminal end thereof, a phosphor, and a density controlling agent, wherein a weight ratio of the density controlling agent to the phosphor is about 1.5:1 to about 10:1.
摘要翻译： 一种封装材料和电子器件，该封装材料包括树脂，该树脂包括在其末端包含与硅（Si-H）键合的氢的第一聚硅氧烷和包含与硅键合的第二聚硅氧烷（Si -Vi），荧光体和密度控制剂，其中密度控制剂与荧光体的重量比为约1.5：1至约10：1。
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2.发明授权Resin for transparent encapsulation material, and associated encapsulation material and electronic device 有权用于透明封装材料的树脂，以及相关的封装材料和电子器件公开(公告)号：US08847414B2
公开(公告)日：2014-09-30
申请号：US13339510
申请日：2011-12-29
申请人： Sung-Hwan Cha , Sang-Ran Koh , Yong Kook Kim , Woo-Han Kim , Ha Neul Kim , Chi Won An
发明人： Sung-Hwan Cha , Sang-Ran Koh , Yong Kook Kim , Woo-Han Kim , Ha Neul Kim , Chi Won An
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , C09D183/04 , H01L31/0203 , H01L31/0481 , H01L33/56 , H01L51/5237 , H01L51/5253 , H01L2924/0002 , H01L2924/12044 , Y02E10/50 , H01L2924/00
摘要： A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si—Vi) at its terminal end, wherein a ratio (Si—H/Si—Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si—Vi) in the second polysiloxane is about 1 to about 1.
摘要翻译： 用于封装材料的树脂包括其末端具有与硅（Si-H）结合的氢的第一聚硅氧烷和在其末端包含与硅（Si-Vi）键合的烯基的第二聚硅氧烷，其中， 与第二聚硅氧烷中与硅（Si-Vi）结合的烯基与第一聚硅氧烷中与硅（Si-H）结合的氢的Si-H / Si-Vi为约1至约1。
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3.发明授权Resin for transparent encapsulation material, and associated encapsulation material and electronic device 有权用于透明封装材料的树脂，以及相关的封装材料和电子器件公开(公告)号：US09147626B2
公开(公告)日：2015-09-29
申请号：US14455586
申请日：2014-08-08
申请人： Sung-Hwan Cha , Sang-Ran Koh , Yong Kook Kim , Woo-Han Kim , Ha Neul Kim , Chi Won An
发明人： Sung-Hwan Cha , Sang-Ran Koh , Yong Kook Kim , Woo-Han Kim , Ha Neul Kim , Chi Won An
IPC分类号： H01L23/29 , C08L83/04 , H01L33/56 , H01L31/048 , C09D183/04 , H01L31/0203 , C08G77/12 , C08G77/20 , H01L51/52
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08L83/04 , C09D183/04 , H01L31/0203 , H01L31/0481 , H01L33/56 , H01L51/5237 , H01L51/5253 , H01L2924/0002 , H01L2924/12044 , Y02E10/50 , H01L2924/00
摘要： A resin for an encapsulation material includes a first polysiloxane including hydrogen bound to silicon (Si—H) at its terminal end, and a second polysiloxane including an alkenyl group bound to silicon (Si-Vi) at its terminal end, wherein a ratio (Si—H/Si-Vi) of hydrogen bound to silicon (Si—H) in the first polysiloxane to the alkenyl group bound to silicon (Si-Vi) in the second polysiloxane is about 1 to about 1.
摘要翻译： 用于封装材料的树脂包括其末端具有与硅（Si-H）结合的氢的第一聚硅氧烷和在其末端包含与硅（Si-Vi）键合的烯基的第二聚硅氧烷，其中， 与第二聚硅氧烷中与硅（Si-Vi）结合的烯基与第一聚硅氧烷中与硅（Si-H）结合的氢的Si-H / Si-Vi为约1至约1。
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4.发明授权Hybrid siloxane polymer, encapsulant obtained from the siloxane polymer, and electronic device including the encapsulant 有权杂化硅氧烷聚合物，由硅氧烷聚合物获得的密封剂，以及包括密封剂的电子器件公开(公告)号：US08344075B2
公开(公告)日：2013-01-01
申请号：US13182726
申请日：2011-07-14
申请人： Woo-Han Kim , June-Ho Shin , Sang-Ran Koh , Sung-Hwan Cha , Hyun-Jung Ahn
发明人： Woo-Han Kim , June-Ho Shin , Sang-Ran Koh , Sung-Hwan Cha , Hyun-Jung Ahn
IPC分类号： C08L83/07
CPC分类号： C08L83/04 , C08G77/50 , C08G77/52 , C08L83/00 , C09J183/04 , Y10T428/31663
摘要： A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:
摘要翻译： 混合硅氧烷聚合物，密封剂和电子器件，所述杂化硅氧烷聚合物包括线性第一硅氧烷树脂，其包括由以下化学式1a和1b表示的部分，所述第一硅氧烷树脂在其两个末端包括双键，和 具有网状结构的第二硅氧烷树脂：
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5.发明申请MODIFIED SILOXANE POLYMER COMPOSITION, ENCAPSULANT OBTAINED FROM THE MODIFIED SILOXANE POLYMER COMPOSITION, AND ELECTRONIC DEVICE INCLUDING THE ENCAPSULANT 审中-公开改性的硅氧烷聚合物组合物，由改性的硅氧烷聚合物组合物获得的包衣剂，以及包括香料的电子装置公开(公告)号：US20120029157A1
公开(公告)日：2012-02-02
申请号：US13192932
申请日：2011-07-28
申请人： Woo-Han KIM , June-Ho Shin , Sang-Ran Koh , Sung-Hwan Cha , Hyun-Jung Ahn
发明人： Woo-Han KIM , June-Ho Shin , Sang-Ran Koh , Sung-Hwan Cha , Hyun-Jung Ahn
IPC分类号： C08L83/07
CPC分类号： C08G77/50 , C08G77/12 , C08G77/20 , C08G77/80 , C08L83/04 , H01L31/0203 , H01L31/0481 , Y02E10/50 , C08L83/00
摘要： A modified siloxane polymer composition, an encapsulant, and an electronic device, the modified siloxane polymer including a modified siloxane polymer and a reticular siloxane polymer, the modified siloxane polymer including a cyclic siloxane moiety having at least two Si—O bonds with a cyclic structure, a substituted or unsubstituted linear siloxane moiety linked to Si of the cyclic siloxane moiety with a C2 to C10 alkylene group therebetween, and double bonds at its terminal ends.
摘要翻译： 改性硅氧烷聚合物组合物，密封剂和电子器件，所述改性硅氧烷聚合物包括改性硅氧烷聚合物和网状硅氧烷聚合物，所述改性硅氧烷聚合物包括具有至少两个具有环状结构的Si-O键的环状硅氧烷部分 与环状硅氧烷部分的Si连接的取代或未取代的线性硅氧烷部分，其间具有C2〜C10亚烷基，末端具有双键。
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6.发明授权Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material 有权聚有机硅氧烷，由聚有机硅氧烷获得的包封材料，以及包括封装材料的电子器件公开(公告)号：US08877877B2
公开(公告)日：2014-11-04
申请号：US13207665
申请日：2011-08-11
申请人： Sang-Ran Koh , June-Ho Shin , Woo-Han Kim , Sung-Hwan Cha , Hyun-Jung Ahn
发明人： Sang-Ran Koh , June-Ho Shin , Woo-Han Kim , Sung-Hwan Cha , Hyun-Jung Ahn
IPC分类号： C08G77/38 , C08L83/04 , C08L83/07 , C08L83/05 , H01L23/29 , C08G77/20 , C08G77/00 , C08G77/12
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08L83/04 , H01L2924/0002 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,
摘要翻译： 聚有机硅氧烷组合物，包封材料和电子器件，所述聚有机硅氧烷组合物包括线性第一聚有机硅氧烷树脂，其包含由以下化学式1表示的部分和由以下化学式2表示的部分，所述第一聚有机硅氧烷树脂包括双键 在其两个末端和具有三维网状结构的第二聚有机硅氧烷树脂中，
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7.发明申请POLYORGANOSILOXANE, ENCAPSULATION MATERIAL OBTAINED FROM THE POLYORGANOSILOXANE, AND ELECTRONIC DEVICE INCLUDING THE ENCAPSULATION MATERIAL 有权聚对苯二甲酸乙二醇酯，从聚硅氧烷中获得的包封材料，以及包括包封材料的电子装置公开(公告)号：US20120046423A1
公开(公告)日：2012-02-23
申请号：US13207665
申请日：2011-08-11
申请人： Sang-Ran KOH , June-Ho Shin , Woo-Han Kim , Sung-Hwan Cha , Hyun-Jung Ahn
发明人： Sang-Ran KOH , June-Ho Shin , Woo-Han Kim , Sung-Hwan Cha , Hyun-Jung Ahn
IPC分类号： C08G77/38
CPC分类号： H01L23/296 , C08G77/12 , C08G77/20 , C08G77/70 , C08G77/80 , C08L83/04 , H01L2924/0002 , H01L2924/12044 , C08L83/00 , H01L2924/00
摘要： A polyorganosiloxane composition, an encapsulation material, and an electronic device, the polyorganosiloxane composition including a linear first polyorganosiloxane resin including a moiety represented by the following Chemical Formula 1 and a moiety represented by the following Chemical Formula 2, the first polyorganosiloxane resin including double bonds at both terminal ends thereof, and a second polyorganosiloxane resin having a three dimensional network structure,
摘要翻译： 聚有机硅氧烷组合物，包封材料和电子器件，所述聚有机硅氧烷组合物包括线性第一聚有机硅氧烷树脂，其包含由以下化学式1表示的部分和由以下化学式2表示的部分，所述第一聚有机硅氧烷树脂包括双键 在其两个末端和具有三维网状结构的第二聚有机硅氧烷树脂中，
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8.发明申请HYBRID SILOXANE POLYMER, ENCAPSULANT OBTAINED FROM THE SILOXANE POLYMER, AND ELECTRONIC DEVICE INCLUDING THE ENCAPSULANT 有权混合硅氧烷聚合物，由硅氧烷聚合物获得的包衣剂，以及包括香料的电子装置公开(公告)号：US20120016083A1
公开(公告)日：2012-01-19
申请号：US13182726
申请日：2011-07-14
申请人： Woo-Han KIM , June-Ho Shin , Sang-Ran Koh , Sung-Hwan Cha , Hyung-Jung Ahn
发明人： Woo-Han KIM , June-Ho Shin , Sang-Ran Koh , Sung-Hwan Cha , Hyung-Jung Ahn
CPC分类号： C08L83/04 , C08G77/50 , C08G77/52 , C08L83/00 , C09J183/04 , Y10T428/31663
摘要： A hybrid siloxane polymer, an encapsulant, and an electronic device, the hybrid siloxane polymer including a linear first siloxane resin including moieties represented by the following Chemical Formulas 1a and 1b, the first siloxane resin including double bonds at both terminal ends thereof, and a second siloxane resin having a reticular structure:
摘要翻译： 混合硅氧烷聚合物，密封剂和电子器件，所述杂化硅氧烷聚合物包括线性第一硅氧烷树脂，其包括由以下化学式1a和1b表示的部分，所述第一硅氧烷树脂在其两个末端包括双键，和 具有网状结构的第二硅氧烷树脂：
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9.发明授权Resin composition for transparent encapsulation material and electronic device formed using the same 有权用于透明封装材料的树脂组合物和使用其形成的电子器件公开(公告)号：US08455605B2
公开(公告)日：2013-06-04
申请号：US13535673
申请日：2012-06-28
申请人： Sang-Ran Koh , June-Ho Shin , Hyun-Jung Ahn , Sung-Hwan Cha , Young-Eun Choi , Doo-Young Jung , Sang-Kyun Kim , Jong-Seob Kim
发明人： Sang-Ran Koh , June-Ho Shin , Hyun-Jung Ahn , Sung-Hwan Cha , Young-Eun Choi , Doo-Young Jung , Sang-Kyun Kim , Jong-Seob Kim
IPC分类号： C08G77/60
摘要： A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
摘要翻译： 一种透明包封材料用树脂组合物，该树脂组合物含有通过由下述化学式1表示的第一硅化合物的共聚合得到的聚硅氧烷和包含由下述化学式2表示的化合物的第二硅化合物，
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10.发明授权Transparent resin for encapsulation material and electronic device including the same 失效用于封装材料的透明树脂和包括其的电子器件公开(公告)号：US08512870B2
公开(公告)日：2013-08-20
申请号：US13535956
申请日：2012-06-28
申请人： June-Ho Shin , Sang-Ran Koh , Sung-Hwan Cha , Hyun-Jung Ahn , Young-Eun Choi
发明人： June-Ho Shin , Sang-Ran Koh , Sung-Hwan Cha , Hyun-Jung Ahn , Young-Eun Choi
IPC分类号： B32B9/04
CPC分类号： C08G77/02 , C08G77/58 , Y10T428/31663
摘要： A transparent resin for an encapsulation material, including a polymetallosiloxane obtained from at least one metal compound represented by Chemical Formulae 1A to 1D copolymerized with a silicon compound including a compound represented by Chemical Formula 2:
摘要翻译： 一种用于包封材料的透明树脂，包括由至少一种由化学式1A至1D表示的金属化合物获得的聚金属硅氧烷，所述金属化合物与包含由化学式2表示的化合物的硅化合物共聚合：
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