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公开(公告)号:US20140091463A1
公开(公告)日:2014-04-03
申请号:US13943037
申请日:2013-07-16
申请人: Hae-jung YU , Hak-kyoon BYUN , Kyung-tae NA , Seung-hun HAN , Tae-sung PARK , Choong-bin YIM
发明人: Hae-jung YU , Hak-kyoon BYUN , Kyung-tae NA , Seung-hun HAN , Tae-sung PARK , Choong-bin YIM
IPC分类号: H01L23/00
CPC分类号: H01L24/14 , H01L23/145 , H01L23/49816 , H01L23/49838 , H01L24/73 , H01L25/105 , H01L2224/32145 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2225/0651 , H01L2225/06562 , H01L2225/1023 , H01L2225/1058 , H01L2924/12042 , H01L2924/15311 , H01L2924/15331 , H01L2924/181 , H01L2924/3511 , H01L2924/00012 , H01L2924/00
摘要: According to example embodiments of inventive concepts, a semiconductor package apparatus includes a first semiconductor package including a first substrate, a first solder resist layer on the first substrate, and a first sealing member that covers and protects the first solder resist layer, and a plurality of solder balls on the first substrate. The plurality of solder balls includes a first solder ball having a first height and a second solder ball having a second height that is different from the first height. The first sealing member includes holes that expose the solder balls.
摘要翻译: 根据发明构思的示例性实施例,半导体封装装置包括第一半导体封装,其包括第一衬底,第一衬底上的第一阻焊层和覆盖并保护第一阻焊层的第一密封构件,以及多个 的焊球在第一基板上。 多个焊球包括具有第一高度的第一焊球和具有与第一高度不同的第二高度的第二焊球。 第一密封构件包括露出焊球的孔。