公开(公告)号：US09695523B2

公开(公告)日：2017-07-04

申请号：US14052719

申请日：2013-10-12

Applicant: Hamilton Sundstrand Corporation

Inventor： Sameh Dardona ,  Mark R. Jaworowski ,  Sergei F. Burlatsky ,  Dmitri Novikov ,  Lei Chen

IPC: C25D9/04 ,  C25D3/06 ,  C25D5/18 ,  C25D21/12 ,  C25D9/06

CPC classification number: C25D3/06 ,  C25D5/18 ,  C25D9/04 ,  C25D9/06 ,  C25D21/12

Abstract: A method for forming a trivalent chromium coating on an aluminum alloy substrate includes adding a chromium-containing solution to a vessel, immersing the aluminum alloy substrate in the chromium-containing solution, immersing a counter electrode in the chromium-containing solution, and applying an electrical potential bias to the aluminum alloy substrate with respect to its equilibrium potential to form a trivalent chromium coating on an outer surface of the aluminum alloy substrate. A method for forming a trivalent chromium coating on a metal substrate includes adding a chromium-containing solution to a vessel, immersing the metal substrate in the chromium-containing solution, immersing a counter electrode in the chromium-containing solution, and modulating an electrical potential difference between the metal substrate and the counter electrode to form a trivalent chromium coating on an outer surface of the metal substrate.

公开(公告)号：US20210268587A1

公开(公告)日：2021-09-02

申请号：US17325779

申请日：2021-05-20

Applicant: Hamilton Sundstrand Corporation

Inventor： Sergey Mironets ,  Alexander Madinger ,  Diana Giulietti ,  Dmitri Novikov

IPC: B22F12/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y10/00

Abstract: A splatter shield system for an additive manufacturing machine includes one or more splatter shields configured to cover at least a portion of a build area during energy application such that the at least one splatter shield is positioned between an energy source of an additive manufacturing machine and the build area during energy application. The one or more splatter shields are transparent to an energy source (e.g., a laser) of the additive manufacturing system such that energy application occurs through the splatter shield.

公开(公告)号：US20190151943A1

公开(公告)日：2019-05-23

申请号：US15820236

申请日：2017-11-21

Applicant: Hamilton Sundstrand Corporation

Inventor： Sergey Mironets ,  Alexander Madinger ,  Diana Giulietti ,  Dmitri Novikov

IPC: B22F3/105 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02

Abstract: A splatter shield system for an additive manufacturing machine includes one or more splatter shields configured to cover at least a portion of a build area during energy application such that the at least one splatter shield is positioned between an energy source of an additive manufacturing machine and the build area during energy application. The one or more splatter shields are transparent to an energy source (e.g., a laser) of the additive manufacturing system such that energy application occurs through the splatter shield.

公开(公告)号：US11027336B2

公开(公告)日：2021-06-08

申请号：US15820236

申请日：2017-11-21

Applicant: Hamilton Sundstrand Corporation

Inventor： Sergey Mironets ,  Alexander Madinger ,  Diana Giulietti ,  Dmitri Novikov

IPC: B22F10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B33Y10/00 ,  B29C64/153 ,  B23K26/342 ,  B29C64/35 ,  B22F10/10

Abstract: A splatter shield system for an additive manufacturing machine includes one or more splatter shields configured to cover at least a portion of a build area during energy application such that the at least one splatter shield is positioned between an energy source of an additive manufacturing machine and the build area during energy application. The one or more splatter shields are transparent to an energy source (e.g., a laser) of the additive manufacturing system such that energy application occurs through the splatter shield.

公开(公告)号：US20150101934A1

公开(公告)日：2015-04-16

申请号：US14052719

申请日：2013-10-12

Applicant: Hamilton Sundstrand Corporation

Inventor： Sameh Dardona ,  Mark R. Jaworowski ,  Sergei F. Burlatsky ,  Dmitri Novikov ,  Lei Chen

IPC: C25D3/06 ,  C25D21/12 ,  C25D5/18

CPC classification number: C25D3/06 ,  C25D5/18 ,  C25D9/04 ,  C25D9/06 ,  C25D21/12

Abstract: A method for forming a trivalent chromium coating on an aluminum alloy substrate includes adding a chromium-containing solution to a vessel, immersing the aluminum alloy substrate in the chromium-containing solution, immersing a counter electrode in the chromium-containing solution, and applying an electrical potential bias to the aluminum alloy substrate with respect to its equilibrium potential to form a trivalent chromium coating on an outer surface of the aluminum alloy substrate. A method for forming a trivalent chromium coating on a metal substrate includes adding a chromium-containing solution to a vessel, immersing the metal substrate in the chromium-containing solution, immersing a counter electrode in the chromium-containing solution, and modulating an electrical potential difference between the metal substrate and the counter electrode to form a trivalent chromium coating on an outer surface of the metal substrate.

Abstract translation: 在铝合金基板上形成三价铬涂层的方法包括向容器中加入含铬溶液，将铝合金基板浸入含铬溶液中，将反电极浸入含铬溶液中， 相对于其平衡电位，在铝合金基板的外表面上形成三价铬涂层的电位偏压。 在金属基材上形成三价铬涂层的方法包括向容器中加入含铬溶液，将金属基材浸入含铬溶液中，将相对电极浸入含铬溶液中，并调制电位 金属基板和对电极之间的差异，以在金属基板的外表面上形成三价铬涂层。