公开(公告)号：US10028409B1

公开(公告)日：2018-07-17

申请号：US15400110

申请日：2017-01-06

Applicant: Hamilton Sundstrand Corporation

Inventor： Mark W. Metzler ,  John Huss ,  Ernest Thompson

IPC: H05K7/20

Abstract: An immersion cooling arrangement includes a housing containing a liquid coolant. An electrical device is submerged within the liquid coolant. A printed wiring board is seated on the housing and separates the coolant from the environment external to the housing to provide penetration-free electrical communication between a power source and the electrical device.

公开(公告)号：US11268989B2

公开(公告)日：2022-03-08

申请号：US16179581

申请日：2018-11-02

Applicant: Hamilton Sundstrand Corporation

Inventor： Ernest Thompson ,  Dwight D. Schmitt ,  Jef William Good

IPC: G01R15/18 ,  G01R19/165 ,  G01R31/08 ,  G06F30/00 ,  H01F30/12

Abstract: A dual feeder circuit system for supplying electrical power can include one or more feeder groups, each feeder having a first wire and a second wire connected between a source terminal and a load terminal to carry the same electrical signal on both wires. The system can include one or more current transformers disposed on one or more of the feeders groups such that the current transformer is disposed around both the first wire and the second wire. The first wire can be passed directly through a first side of the current transformer to allow current to travel through the current transformer in a first direction, and the second wire can include a loop and be passed through a second side of the current transformer to allow current to travel through the current transformer in an second direction opposite the first direction.

公开(公告)号：US20180199461A1

公开(公告)日：2018-07-12

申请号：US15401872

申请日：2017-01-09

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： John Huss ,  Alan Kasner ,  Mark W. Metzler ,  Ernest Thompson ,  Debabrata Pal ,  Charles Patrick Shepard

IPC: H05K7/20 ,  H05K5/06 ,  H01L21/56 ,  H01L23/367 ,  H01L23/373 ,  H01L23/29

CPC classification number: H05K7/2039 ,  B82Y30/00 ,  C08K7/04 ,  C08K2003/382 ,  H01F27/08 ,  H01G2/08 ,  H01G2/10 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3675 ,  H01L23/3731 ,  H01L23/3737 ,  H01L23/42 ,  H05K5/064 ,  C08L75/04 ,  C08L83/04 ,  C08L63/00

Abstract: Potted electronic assemblies are disclosed along with methods of making and cooling them. The electronic assemblies include a conductive heat transfer medium disposed between and in contact with an electronic component and a heat sink. The conductive heat transfer medium has a hardened fluid polymer material that includes boron nitride nanotubes dispersed therein.

公开(公告)号：US20200251981A1

公开(公告)日：2020-08-06

申请号：US16268225

申请日：2019-02-05

Applicant: Hamilton Sundstrand Corporation

Inventor： Ernest Thompson ,  Adam Michael White ,  Dwight D. Schmitt

IPC: H02M1/32 ,  H02M7/5395 ,  H02M1/088

Abstract: A converter implementing a dual-reference three-level pulse width modulation (PWM) technique for constraining a midpoint duty cycle is provided. The converter includes a phase leg that includes upper, mid-upper, mid-lower, and lower switches. The upper, mid-upper, mid-lower, and lower switches are connected in series between direct current (DC) positive and negative leads, with an alternating current (AC) output lead connected at a junction of the mid-upper and mid-lower switches. The phase leg includes a first clamping diode connected to the junction of the switch and mid-upper switches and connected to a DC midpoint lead and a second clamping diode connected between the DC midpoint lead and connected to the junction of the mid-lower and lower switches. The converter is electrically coupled to and operatively associated with a controller to receive control signals to drive the converter to constrain the midpoint duty cycle between the DC midpoint and AC output leads.

公开(公告)号：US20180199465A1

公开(公告)日：2018-07-12

申请号：US15400110

申请日：2017-01-06

Applicant: Hamilton Sundstrand Corporation

Inventor： Mark W. Metzler ,  John Huss ,  Ernest Thompson

IPC: H05K7/20

CPC classification number: H05K7/20236

Abstract: An immersion cooling arrangement includes a housing containing a liquid coolant. An electrical device is submerged within the liquid coolant. A printed wiring board is seated on the housing and separates the coolant from the environment external to the housing to provide penetration-free electrical communication between a power source and the electrical device.

公开(公告)号：US10658919B1

公开(公告)日：2020-05-19

申请号：US16283874

申请日：2019-02-25

Applicant: Hamilton Sundstrand Corporation

Inventor： Ernest Thompson ,  Adam Michael White

IPC: H02M1/12 ,  H02M1/00 ,  H02M1/14 ,  H02M1/15 ,  G05F1/46

Abstract: Embodiments of the invention provide for a system, method, and controller for operating a harmonic regulator with loop delay compensation. Some embodiments include receiving, at a controller, voltage feedback from a power system, and applying a harmonic regulator to each distortion frequency to be compensated. Embodiments also include applying a predetermined delay to an output of the harmonic regulator, scaling the delayed output and adding it to a power source voltage reference waveform, and providing condition power to a load, using the conditioned power source voltage reference waveform.