公开(公告)号：US10164598B2

公开(公告)日：2018-12-25

申请号：US15235635

申请日：2016-08-12

Applicant: Hamilton Sundstrand Corporation

Inventor： Huazhen Chai ,  Eric A. Carter ,  John Huss

IPC: H03H7/06 ,  H03H7/01 ,  H01F17/06 ,  H01F27/40

Abstract: A power filter arrangement includes a toroidal package having a toroid and a resistive element. The resistive element is disposed about an outer circumference of the toroid and is joined to the toroid. The resistive element is wound about the toroid. The resistive element is provided with a first resistive pattern having an even number of total turns.

公开(公告)号：US20170133120A1

公开(公告)日：2017-05-11

申请号：US14936605

申请日：2015-11-09

Applicant: Hamilton Sundstrand Corporation

Inventor： William D. Sherman ,  John Huss ,  Alan Kasner

IPC: H01B3/30 ,  H01B7/02 ,  H01H1/021 ,  C08K3/38

CPC classification number: H01B3/30 ,  C08K3/38 ,  C08K2003/385 ,  H01B3/002 ,  H01B7/02 ,  H01H1/021

Abstract: A nanocomposite structure includes a nanocomposite. The nanocomposite includes a bulk matrix phase and a nanophase filler disposed within the bulk matrix phase. The nanophase has a plurality of nanotubes including a material with thermal conductivity that is greater than the thermal conductivity of the bulk matrix phase of the nanocomposite. An electrical device includes a conductor in thermal communication with the nanocomposite structure formed from the nanocomposite.

公开(公告)号：US10349530B1

公开(公告)日：2019-07-09

申请号：US15863668

申请日：2018-01-05

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Robert C. Cooney ,  John Huss ,  Kandy Elaine Spahr ,  Deron J. Staas ,  Mark W. Metzler ,  Debabrata Pal

IPC: H05K7/00 ,  H05K3/28 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K3/285 ,  H05K1/181 ,  H05K3/0044 ,  H05K3/284 ,  H05K2201/0108 ,  H05K2201/0125 ,  H05K2201/0129 ,  H05K2203/1333

Abstract: A system for protecting electronics includes a printed wiring assembly (PWA) having a surface with at least one electronic component. The system also includes a water resistant film configured to be used as a conformal coating on the PWA and further configured to be placed on the surface of the PWA and to shrink about the at least one electronic component.

公开(公告)号：US10028409B1

公开(公告)日：2018-07-17

申请号：US15400110

申请日：2017-01-06

Applicant: Hamilton Sundstrand Corporation

Inventor： Mark W. Metzler ,  John Huss ,  Ernest Thompson

IPC: H05K7/20

Abstract: An immersion cooling arrangement includes a housing containing a liquid coolant. An electrical device is submerged within the liquid coolant. A printed wiring board is seated on the housing and separates the coolant from the environment external to the housing to provide penetration-free electrical communication between a power source and the electrical device.

公开(公告)号：US20160363390A1

公开(公告)日：2016-12-15

申请号：US15177559

申请日：2016-06-09

Applicant: Hamilton Sundstrand Corporation

Inventor： Eric Karlen ,  John Horowy ,  Mark Hamilton Severson ,  Mark W. Metzler ,  Eric A. Carter ,  John Huss ,  Debabrata Pal

IPC: F28F3/10 ,  F28F3/04 ,  F28F3/12 ,  F28D15/00 ,  F28F3/02

CPC classification number: F28F3/10 ,  F28D15/00 ,  F28D2021/0028 ,  F28F3/025 ,  F28F3/027 ,  F28F3/04 ,  F28F3/12 ,  F28F2275/062 ,  H01L21/4882 ,  H01L23/473

Abstract: A cold plate assembly is provided having a base defining a cooling channel and a heat exchanger friction-stir welded to the base, wherein the heat exchanger is located within a portion of the cooling channel, and the friction-stir welding between the heat exchanger and the base forms a fluid seal.

Abstract translation: 提供一种冷板组件，其具有限定冷却通道的基座和摩擦搅拌焊接到基座的热交换器，其中热交换器位于冷却通道的一部分内，并且热交换器和 底座形成流体密封。

公开(公告)号：US10892665B2

公开(公告)日：2021-01-12

申请号：US15917163

申请日：2018-03-09

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Debabrata Pal ,  John Huss ,  Mark W. Metzler

IPC: H02K11/33 ,  H02K9/19 ,  H02P9/02 ,  H05K7/20 ,  H02P101/30 ,  H02K9/22

Abstract: A variable speed, constant frequency (VSCF) generator system is provided and includes a generator portion, a first cooling circuit and a second cooling circuit. The generator portion includes a generator, electronics configured to control operations of the generator and a housing to house the generator and the electronics. The first cooling circuit is provided such that first fluid exiting the generator passes through a first cooling element prior to returning to the generator. The second cooling circuit is provided such that second fluid exiting the electronics passes through a second cooling element prior to being pumped back toward the electronics.

公开(公告)号：US10510485B2

公开(公告)日：2019-12-17

申请号：US15358867

申请日：2016-11-22

Applicant: Hamilton Sundstrand Corporation

Inventor： John Huss ,  William D. Sherman

IPC: H01F41/12 ,  H01F27/22 ,  H01F27/02 ,  H01F27/28 ,  H01F37/00

Abstract: A magnetic assembly includes a winding and a housing disposed about the winding. The housing includes an interior surface contoured to conform to the winding to facilitate heat transfer between the winding and the housing. A method of manufacturing a magnetic assembly includes forming a contoured interior surface on a housing and assembling a winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing.

公开(公告)号：US10453603B2

公开(公告)日：2019-10-22

申请号：US15194657

申请日：2016-06-28

Applicant: HAMILTON SUNDSTRAND CORPORATION

Inventor： Harry Chai ,  Eric A. Carter ,  John Huss

IPC: H01F27/40 ,  H03H7/06 ,  H01C3/06 ,  H01F17/06 ,  H02M1/12

Abstract: An inductor damper circuit includes a toroidal inductor having an inductor coil and an inductor housing, and a resistive element configured around a periphery of the inductor coil and having one end connected to the toroidal inductor, where the resistive element is printed on a flexible substrate and configured between the inductor coil and the inductor housing, and the resistive element is integrated with the toroidal inductor.

公开(公告)号：US20190215968A1

公开(公告)日：2019-07-11

申请号：US15863668

申请日：2018-01-05

Applicant: Hamilton Sundstrand Corporation

Inventor： Robert C. Cooney ,  John Huss ,  Kandy Elaine Spahr ,  Deron J. Staas ,  Mark W. Metzler ,  Debabrata Pal

IPC: H05K3/28 ,  H05K1/18 ,  H05K3/00

Abstract: A system for protecting electronics includes a printed wiring assembly (PWA) having a surface with at least one electronic component. The system also includes a water resistant film configured to be used as a conformal coating on the PWA and further configured to be placed on the surface of the PWA and to shrink about the at least one electronic component.

公开(公告)号：US20170076862A1

公开(公告)日：2017-03-16

申请号：US15358867

申请日：2016-11-22

Applicant: Hamilton Sundstrand Corporation

Inventor： John Huss ,  William D. Sherman

IPC: H01F41/12

Abstract: A magnetic assembly includes a winding and a housing disposed about the winding. The housing includes an interior surface contoured to conform to the winding to facilitate heat transfer between the winding and the housing. A method of manufacturing a magnetic assembly includes forming a contoured interior surface on a housing and assembling a winding into the housing such that the interior surface of the housing conforms to the winding to facilitate heat transfer between the winding and the housing.

Abstract translation: 磁性组件包括绕组和围绕绕组布置的壳体。 壳体包括内表面，其轮廓以符合绕组以促进绕组和壳体之间的热传递。 制造磁性组件的方法包括在壳体上形成轮廓的内表面并将绕组组装到壳体中，使得壳体的内表面符合绕组以便于绕组和壳体之间的热传递。