公开(公告)号：US09708492B2

公开(公告)日：2017-07-18

申请号：US14759095

申请日：2014-01-10

申请人： Konica Minolta Inc.

发明人： Takeshi Kojima

IPC分类号： C08K3/22 ,  C09D5/33 ,  F21V7/22 ,  F21V7/00 ,  F21V19/00 ,  H01L33/46 ,  C09D183/04 ,  H01L33/60 ,  C08K3/30 ,  C08K3/38 ,  F21Y115/10

CPC分类号： C09D5/004 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/2296 ,  C08K2003/3045 ,  C08K2003/382 ,  C09D183/04 ,  F21V7/0066 ,  F21V7/22 ,  F21V19/001 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  C08K3/0033 ,  C08K5/5435 ,  C08K5/548 ,  C08K5/544 ,  C08K3/36 ,  C08K3/346 ,  C08K3/013

摘要： The present invention provides: an LED device from which light can be efficiently extracted for a long period of time because of less degradation of a reflective layer for reflecting light emitted from an LED element or the like; and a coating liquid that is used for the production of the LED device. The LED device includes a substrate, an LED element disposed on the substrate, a reflective layer disposed at least around the LED element on the substrate, wherein the reflective layer contains a white pigment and a polysiloxane, the rate of decrease in reflectance of light with a wavelength of 500 nm of the reflective layer after storage of the reflective layer at 180° C. for 1,000 hours is 10% or less of the reflectance before storage at 180° C., and the reflective layer has no glass transition point in the range of from −70° C. to 150° C.

公开(公告)号：US09695321B2

公开(公告)日：2017-07-04

申请号：US14895653

申请日：2014-05-23

申请人： PHILIPS LIGHTING HOLDING B.V.

发明人： Jianghong Yu ,  Marius Gabriel Ivan

IPC分类号： C08K3/38 ,  F21K99/00 ,  B01J19/12 ,  C09D5/33 ,  C09D183/04 ,  C08L83/04 ,  H01L33/60 ,  C08K3/22 ,  B05D1/00 ,  C09D183/06 ,  F21K9/62

CPC分类号： C09D5/004 ,  B01J19/123 ,  B01J2219/1203 ,  B05D1/005 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/221 ,  C08K2003/2227 ,  C08K2003/382 ,  C08K2003/385 ,  C08L83/04 ,  C09D183/04 ,  C09D183/06 ,  F21K9/62 ,  H01L33/60

摘要： The present invention relates to a UV light reflective composition comprising a light transmissive matrix comprising a silicone resin, and UV light reflective particles comprising boron nitride, the particles being dispersed in the transmissive matrix. The light reflective particles of the UV light reflective composition has an average particle size within the range of from 0.2 to 0.7 μm. An advantage of the present invention is that it provides a highly light reflective composition, especially in the UV range.

公开(公告)号：US20170158934A1

公开(公告)日：2017-06-08

申请号：US15046973

申请日：2016-02-18

申请人： INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

发明人： Yen-Chun LIU ,  Hui-Wen CHANG ,  Min-Chian WANG ,  Kuo-Chan CHIOU

IPC分类号： C09K5/14 ,  C08G73/14

CPC分类号： C09K5/14 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08K3/34 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/382 ,  C08L79/08

摘要： A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

公开(公告)号：US09669564B2

公开(公告)日：2017-06-06

申请号：US14328075

申请日：2014-07-10

申请人： Koppers Performance Chemicals Inc.

发明人： Jun Zhang ,  John Horton ,  Xinhao Howard Gao

IPC分类号： B27K3/16 ,  B05D1/02 ,  B05D1/18 ,  B05D1/28 ,  B05D7/06 ,  B27K3/36 ,  B27K3/02 ,  B27K3/08 ,  B27K5/00 ,  C09K21/04 ,  B05D7/08 ,  C09K21/02 ,  C09K21/10

CPC分类号： B27K3/163 ,  B05D1/02 ,  B05D1/18 ,  B05D1/28 ,  B05D7/06 ,  B05D7/08 ,  B05D2203/20 ,  B27K3/00 ,  B27K3/0221 ,  B27K3/0271 ,  B27K3/08 ,  B27K3/166 ,  B27K3/36 ,  B27K5/0055 ,  B27K2200/15 ,  B27K2200/30 ,  B27K2240/30 ,  C08K3/016 ,  C08K3/32 ,  C08K3/38 ,  C08K5/0066 ,  C08K5/053 ,  C08K5/16 ,  C08K5/17 ,  C08K5/21 ,  C08K5/34922 ,  C08K2003/322 ,  C08K2003/382 ,  C08K2003/387 ,  C09D5/185 ,  C09D15/00 ,  C09K21/02 ,  C09K21/04 ,  C09K21/06 ,  C09K21/10 ,  C09K21/12 ,  C09K21/14 ,  Y10T428/266 ,  C08L101/00

摘要： A process is provided for treating wood products including lumber, plywood and other engineered wood products comprising the steps of applying an aqueous fire-retardant impregnate and applying a coating to the surface of the wood product. In one embodiment, said process confers fire-retardant properties to the wood products sufficient to pass the extended burn test of ASTM E-84. The present invention also provides fire retardant wood products.

公开(公告)号：US09464214B2

公开(公告)日：2016-10-11

申请号：US14189302

申请日：2014-02-25

申请人： The Boeing Company

发明人： Peter Babilo ,  Randall Jay Moss

IPC分类号： C09J11/06 ,  B32B37/12 ,  C08K3/38 ,  C09J163/00 ,  H05K1/02 ,  H05K3/30 ,  B32B37/18 ,  C09K5/14

CPC分类号： C09J11/06 ,  B29C65/4855 ,  B29K2063/00 ,  B29K2509/04 ,  B29L2031/3406 ,  B32B37/1284 ,  B32B37/18 ,  B32B2037/1253 ,  B32B2457/00 ,  C07F7/1804 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/382 ,  C09J5/06 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09K5/14 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/12 ,  Y02P70/613 ,  C09J183/00

摘要： Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

摘要翻译： 提供了形成用于无人驾驶飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备形成这些键的粘合剂材料的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘合的电子部件损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。

公开(公告)号：US20160264809A1

公开(公告)日：2016-09-15

申请号：US14641756

申请日：2015-03-09

申请人： Shuyong Xiao ,  Kai Wu

发明人： Shuyong Xiao ,  Kai Wu

IPC分类号： C09D11/52 ,  H05B3/14 ,  C08J7/04 ,  C09D11/106 ,  C09D11/037

CPC分类号： C09D11/52 ,  C08K3/04 ,  C08K3/38 ,  C08K2003/382 ,  C08K2003/385 ,  C09D11/037 ,  C09D11/10 ,  C09D11/106 ,  H05B3/146 ,  H05B3/34 ,  H05B2203/02 ,  C08L27/20

摘要： The invention provides a carbon-based polymer PTC ink composition with enhanced heating uniformity to reduce the risk of hot spots across the PTC thick film fabricated from the PTC ink by addition of boron nitride. The added boron nitride is thermo-conductor and electric non-conductor. The presentation of boron nitride in carbon-based polymeric PTC film improves the temperature homogeneity across the film and maintains the desired PTC effect of the heating device. The content of boron nitride based on the total PTC composition in the invented PTC ink composition is 10-50 wt. %.

摘要翻译： 本发明提供一种具有增强的加热均匀性的碳基聚合物PTC油墨组合物，以通过添加氮化硼来减少由PTC油墨制造的PTC厚膜的热点的风险。 添加的氮化硼是热导体和电非导体。 碳基聚合物PTC膜中的氮化硼的呈现提高了膜上的温度均匀性并保持了加热装置的期望的PTC效应。 本发明PTC油墨组合物中基于总PTC组成的氮化硼含量为10-50wt。 ％。

公开(公告)号：US09101062B2

公开(公告)日：2015-08-04

申请号：US13061740

申请日：2009-09-07

申请人： Eijiro Aoyagi ,  Hongyuan Wang ,  Noriyuki Kirikae ,  Katsufumi Hiraishi

发明人： Eijiro Aoyagi ,  Hongyuan Wang ,  Noriyuki Kirikae ,  Katsufumi Hiraishi

IPC分类号： H05K1/03 ,  B32B15/08 ,  B32B27/20 ,  C08K7/00 ,  C08K3/22 ,  C08K3/38

CPC分类号： H05K1/0373 ,  B32B15/08 ,  B32B27/20 ,  C08K7/00 ,  C08K2003/2227 ,  C08K2003/382 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257

摘要： A highly heat conductive metal-clad laminate, which may be included in a highly heat conductive polyimide film, has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length DL of 0.1-15 μm and a spherical filler with an average particle diameter DR of 0.05-10 μm, DL and DR satisfy the relationship DL>DR/2, no heat conductive filler of 30 μm or more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.

摘要翻译： 可以包括在高导热性聚酰亚胺膜中的高导热性覆金属层压板在绝缘层的一侧或两侧上具有填充有导热填料的聚酰亚胺层的金属层。 高导热性覆金属层压板的绝缘层或具有填料填充聚酰亚胺层的高导热性聚酰亚胺膜的特征在于，填料填充聚酰亚胺层中的导热性填料的含量为20〜80重量％ 导热性填料含有平均长度DL为0.1〜15μm的板状填料，平均粒径DR为0.05〜10μm的球形填料，DL和DR满足关系式DL> DR / 2，无 含有30μm以上的导热性填料，热膨胀系数在10〜30ppm / K的范围内。

公开(公告)号：US20140227492A1

公开(公告)日：2014-08-14

申请号：US14005939

申请日：2011-11-28

申请人： Youn Eung Lee ,  Jin Kyu Lee ,  Young Taek Oh ,  Mahn Jong Kim

发明人： Youn Eung Lee ,  Jin Kyu Lee ,  Young Taek Oh ,  Mahn Jong Kim

IPC分类号： C08K3/38 ,  H05K1/03 ,  C08K3/40 ,  C08K3/08 ,  C08K3/04

CPC分类号： C08K3/38 ,  C08K3/01 ,  C08K3/013 ,  C08K3/04 ,  C08K3/08 ,  C08K3/40 ,  C08K7/14 ,  C08K2003/0812 ,  C08K2003/382 ,  C08K2003/385 ,  C08K2201/001 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/09118 ,  Y10T428/24802 ,  Y10T428/31786 ,  C08K3/0033 ,  C08L67/03 ,  C08K3/0008

摘要： A thermally conductive polymer composite material and an article including the same. The thermally conductive polymer composite material includes 15 to 20 parts by weight of a wholly aromatic liquid crystalline polyester resin; and 80 to 85 parts by weight of a thermally conductive additive.

摘要翻译： 导热性聚合物复合材料及其制品。 导热性聚合物复合材料包含15至20重量份的全芳族液晶聚酯树脂; 和80至85重量份的导热添加剂。

公开(公告)号：US20140080952A1

公开(公告)日：2014-03-20

申请号：US13829225

申请日：2013-03-14

申请人： MOMENTIVE PERFORMANCE MATERIALS INC.

发明人： Chandrashekar Raman ,  Bei Xiang ,  Anand Murugaiah

IPC分类号： C08K13/02 ,  C08K3/22 ,  C08K5/54 ,  C08K3/38

CPC分类号： C08K3/38 ,  B29B7/421 ,  B29B7/482 ,  B29B7/845 ,  B29B7/90 ,  B29C47/0009 ,  B29C47/1081 ,  B29C47/385 ,  B29C47/6031 ,  B29C47/605 ,  B29C47/64 ,  C08J3/203 ,  C08J2369/00 ,  C08J2377/02 ,  C08J2377/06 ,  C08K3/22 ,  C08K5/54 ,  C08K5/5403 ,  C08K5/5425 ,  C08K7/14 ,  C08K9/06 ,  C08K13/02 ,  C08K2003/382 ,  C08K2003/385 ,  C08K2201/001 ,  Y10T428/2991 ,  Y10T428/2995 ,  Y10T428/2996

摘要： A thermally conductive filler composition and a resin composition comprising such filler compositions. The filler composition comprises a blend of a boron nitride, a metal oxide, and a silane. The filler composition can further comprise other filler components including, for example, glass fiber or glass flake. The filler compositions can be added to a resin composition to provide a thermally conductive resin such as, for example, a thermally conductive plastic.

摘要翻译： 导热填料组合物和包含这种填料组合物的树脂组合物。 填料组合物包含氮化硼，金属氧化物和硅烷的共混物。 填料组合物还可包含其它填料组分，包括例如玻璃纤维或玻璃薄片。 可以将填料组合物加入到树脂组合物中以提供导​​热树脂，例如导热塑料。

公开(公告)号：US20140058014A1

公开(公告)日：2014-02-27

申请号：US14071742

申请日：2013-11-05

申请人： Edward Norman Peters

发明人： Edward Norman Peters

IPC分类号： C08L63/00

CPC分类号： C08L63/00 ,  B32B27/04 ,  B32B27/38 ,  B32B37/18 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2457/08 ,  C08G59/4215 ,  C08G59/4223 ,  C08G59/4276 ,  C08G59/54 ,  C08G59/686 ,  C08G65/485 ,  C08J5/24 ,  C08J2371/12 ,  C08K3/013 ,  C08K3/28 ,  C08K3/38 ,  C08K5/01 ,  C08K5/02 ,  C08K5/06 ,  C08K5/07 ,  C08K5/101 ,  C08K5/315 ,  C08K7/14 ,  C08K2003/2217 ,  C08K2003/2227 ,  C08K2003/382 ,  C08L63/04 ,  C08L63/06 ,  C08L71/126 ,  H05K1/0366 ,  H05K1/0373 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/24994 ,  Y10T428/31511

摘要： An epoxybenzyl-terminated poly(arylene ether) has the structure R—W—R wherein W is a divalent poly(arylene ether) residue terminated with phenolic oxygen atoms, and R is an epoxybenzyl group, wherein each occurrence of R is the same or different. The epoxybenzyl-terminated poly(arylene ether) is formed by reacting a peroxide-containing reagent with a vinybenzyl-terminated poly(arylene ether). Also disclosed is a curable composition including the epoxybenzyl-terminated poly(arylene ether)s, a curing promoter, and, optionally, an auxiliary epoxy resin. The curable composition is useful for the preparation of composites, and in particular, composites used in manufacturing printed circuit boards.

摘要翻译： 环氧苄基封端的聚（亚芳基醚）具有结构R-W-R，其中W是用酚氧原子封端的二价聚（亚芳基醚）残基，R是环氧苄基，其中R出现相同或不同。 环氧苄基封端的聚（亚芳基醚）通过使含过氧化物的试剂与乙烯基封端的聚（亚芳基醚）反应形成。 还公开了包含环氧苄基封端的聚（亚芳基醚），固化促进剂和任选的辅助环氧树脂的可固化组合物。 可固化组合物可用于制备复合材料，特别是用于制造印刷电路板的复合材料。