公开(公告)号：US20240191026A1

公开(公告)日：2024-06-13

申请号：US18077922

申请日：2022-12-08

Applicant: Ford Global Technologies, LLC

Inventor： Alper Kiziltas ,  Owen Li ,  Sandeep Tamrakar ,  Deborah Frances Mielewski

IPC: C08G71/04 ,  C08G18/00

CPC classification number: C08G71/04 ,  C08G18/00 ,  C08G2110/0008 ,  C08G2340/00 ,  C08K2003/382 ,  C08K2201/011

Abstract: A foam material includes the reaction product of a polyol mixture and an isocyanate mixture and a boron nitride filer in an amount of ≥ 0.01 wt. % to ≤ 0.1 wt. %. In various forms, the boron nitride filer is of nanoparticles, is of hexagonal boron nitride, and/or is treated with a silane coupling agent.

公开(公告)号：US11945717B2

公开(公告)日：2024-04-02

申请号：US16734908

申请日：2020-01-06

Applicant: FUJIFILM Corporation

Inventor： Seiichi Hitomi ,  Keita Takahashi ,  Naoyuki Hayashi

IPC: C01B21/064 ,  C01B21/072 ,  C08K3/38 ,  C08K9/04 ,  C08L63/00

CPC classification number: C01B21/0648 ,  C01B21/0728 ,  C08K3/38 ,  C08K9/04 ,  C08L63/00 ,  C01P2002/84 ,  C08K2003/382 ,  C08K2201/001

Abstract: An object of the present invention is to provide a surface-modified inorganic nitride having excellent dispersibility. Furthermore, another object of the present invention is to provide a composition, a thermally conductive material, and a device with a thermally conductive layer which contain the surface-modified inorganic nitride.
The surface-modified inorganic nitride of the present invention includes an inorganic nitride, and a compound which is represented by General Formula (I) and is adsorbed onto a surface of the inorganic nitride.

公开(公告)号：US11643554B2

公开(公告)日：2023-05-09

申请号：US16863526

申请日：2020-04-30

Applicant: National Institute of Advanced Industrial Science and Technology ,  Fuji Polymer Industries Co., Ltd.

Inventor： Yuichi Tominaga ,  Yoshiki Sugimoto ,  Yusuke Imai ,  Yuji Hotta ,  Setsuo Kikuchi ,  Makoto Iwai ,  Takumi Kataishi

IPC: C08L83/04 ,  C08K7/04 ,  C08K3/04 ,  C08K3/38 ,  C08K3/14 ,  C08K3/22 ,  C08K3/28

CPC classification number: C08L83/04 ,  C08K3/042 ,  C08K3/14 ,  C08K7/04 ,  C08K2003/222 ,  C08K2003/282 ,  C08K2003/382 ,  C08K2201/001 ,  C08L2203/20 ,  C08L83/04 ,  C08K3/38 ,  C08K5/56 ,  C08L83/00

Abstract: Composite resin granules 5 contain a binder resin 2 and a thermally conductive filler. The thermally conductive filler includes a non-anisotropic thermally conductive filler 3 and an anisotropic thermally conductive filler 4. The composite resin granules containing the binder resin and the thermally conductive filler are formed into a spherical shape. The particles of the anisotropic thermally conductive filler 4 are oriented in random directions. A thermally conductive rein molded body 6 of the present invention is obtained by compressing the composite resin granules 5. Thus, the present invention provides the thermally conductive resin molded body that has relatively high thermal conductivities in the in-plane direction and the thickness direction, well-balanced directional properties of thermal conduction, and a low specific gravity, the composite resin granules suitable for the thermally conductive resin molded body, and methods for producing them.

公开(公告)号：US09708492B2

公开(公告)日：2017-07-18

申请号：US14759095

申请日：2014-01-10

Applicant: Konica Minolta Inc.

Inventor： Takeshi Kojima

IPC: C08K3/22 ,  C09D5/33 ,  F21V7/22 ,  F21V7/00 ,  F21V19/00 ,  H01L33/46 ,  C09D183/04 ,  H01L33/60 ,  C08K3/30 ,  C08K3/38 ,  F21Y115/10

CPC classification number: C09D5/004 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2241 ,  C08K2003/2296 ,  C08K2003/3045 ,  C08K2003/382 ,  C09D183/04 ,  F21V7/0066 ,  F21V7/22 ,  F21V19/001 ,  F21Y2115/10 ,  H01L33/46 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  C08K3/0033 ,  C08K5/5435 ,  C08K5/548 ,  C08K5/544 ,  C08K3/36 ,  C08K3/346 ,  C08K3/013

Abstract: The present invention provides: an LED device from which light can be efficiently extracted for a long period of time because of less degradation of a reflective layer for reflecting light emitted from an LED element or the like; and a coating liquid that is used for the production of the LED device. The LED device includes a substrate, an LED element disposed on the substrate, a reflective layer disposed at least around the LED element on the substrate, wherein the reflective layer contains a white pigment and a polysiloxane, the rate of decrease in reflectance of light with a wavelength of 500 nm of the reflective layer after storage of the reflective layer at 180° C. for 1,000 hours is 10% or less of the reflectance before storage at 180° C., and the reflective layer has no glass transition point in the range of from −70° C. to 150° C.

公开(公告)号：US09695321B2

公开(公告)日：2017-07-04

申请号：US14895653

申请日：2014-05-23

Applicant: PHILIPS LIGHTING HOLDING B.V.

Inventor： Jianghong Yu ,  Marius Gabriel Ivan

IPC: C08K3/38 ,  F21K99/00 ,  B01J19/12 ,  C09D5/33 ,  C09D183/04 ,  C08L83/04 ,  H01L33/60 ,  C08K3/22 ,  B05D1/00 ,  C09D183/06 ,  F21K9/62

CPC classification number: C09D5/004 ,  B01J19/123 ,  B01J2219/1203 ,  B05D1/005 ,  C08K3/22 ,  C08K3/38 ,  C08K2003/221 ,  C08K2003/2227 ,  C08K2003/382 ,  C08K2003/385 ,  C08L83/04 ,  C09D183/04 ,  C09D183/06 ,  F21K9/62 ,  H01L33/60

Abstract: The present invention relates to a UV light reflective composition comprising a light transmissive matrix comprising a silicone resin, and UV light reflective particles comprising boron nitride, the particles being dispersed in the transmissive matrix. The light reflective particles of the UV light reflective composition has an average particle size within the range of from 0.2 to 0.7 μm. An advantage of the present invention is that it provides a highly light reflective composition, especially in the UV range.

公开(公告)号：US20170158934A1

公开(公告)日：2017-06-08

申请号：US15046973

申请日：2016-02-18

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yen-Chun LIU ,  Hui-Wen CHANG ,  Min-Chian WANG ,  Kuo-Chan CHIOU

IPC: C09K5/14 ,  C08G73/14

CPC classification number: C09K5/14 ,  C08G73/10 ,  C08G73/1035 ,  C08G73/1046 ,  C08G73/14 ,  C08K3/34 ,  C08K2003/2227 ,  C08K2003/282 ,  C08K2003/382 ,  C08L79/08

Abstract: A thermally conductive resin is provided. The thermally conductive resin has the formula In the formula, X1 is X2 is m is an integer ranging from 0 to 95, n is an integer ranging from 1 to 50, and o is an integer ranging from 1 to 80. A thermal interface material including the thermally conductive resin is also provided.

公开(公告)号：US09669564B2

公开(公告)日：2017-06-06

申请号：US14328075

申请日：2014-07-10

Applicant: Koppers Performance Chemicals Inc.

Inventor： Jun Zhang ,  John Horton ,  Xinhao Howard Gao

IPC: B27K3/16 ,  B05D1/02 ,  B05D1/18 ,  B05D1/28 ,  B05D7/06 ,  B27K3/36 ,  B27K3/02 ,  B27K3/08 ,  B27K5/00 ,  C09K21/04 ,  B05D7/08 ,  C09K21/02 ,  C09K21/10

CPC classification number: B27K3/163 ,  B05D1/02 ,  B05D1/18 ,  B05D1/28 ,  B05D7/06 ,  B05D7/08 ,  B05D2203/20 ,  B27K3/00 ,  B27K3/0221 ,  B27K3/0271 ,  B27K3/08 ,  B27K3/166 ,  B27K3/36 ,  B27K5/0055 ,  B27K2200/15 ,  B27K2200/30 ,  B27K2240/30 ,  C08K3/016 ,  C08K3/32 ,  C08K3/38 ,  C08K5/0066 ,  C08K5/053 ,  C08K5/16 ,  C08K5/17 ,  C08K5/21 ,  C08K5/34922 ,  C08K2003/322 ,  C08K2003/382 ,  C08K2003/387 ,  C09D5/185 ,  C09D15/00 ,  C09K21/02 ,  C09K21/04 ,  C09K21/06 ,  C09K21/10 ,  C09K21/12 ,  C09K21/14 ,  Y10T428/266 ,  C08L101/00

Abstract: A process is provided for treating wood products including lumber, plywood and other engineered wood products comprising the steps of applying an aqueous fire-retardant impregnate and applying a coating to the surface of the wood product. In one embodiment, said process confers fire-retardant properties to the wood products sufficient to pass the extended burn test of ASTM E-84. The present invention also provides fire retardant wood products.

公开(公告)号：US09464214B2

公开(公告)日：2016-10-11

申请号：US14189302

申请日：2014-02-25

Applicant: The Boeing Company

Inventor： Peter Babilo ,  Randall Jay Moss

IPC: C09J11/06 ,  B32B37/12 ,  C08K3/38 ,  C09J163/00 ,  H05K1/02 ,  H05K3/30 ,  B32B37/18 ,  C09K5/14

CPC classification number: C09J11/06 ,  B29C65/4855 ,  B29K2063/00 ,  B29K2509/04 ,  B29L2031/3406 ,  B32B37/1284 ,  B32B37/18 ,  B32B2037/1253 ,  B32B2457/00 ,  C07F7/1804 ,  C08K3/38 ,  C08K9/06 ,  C08K2003/382 ,  C09J5/06 ,  C09J9/00 ,  C09J163/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09K5/14 ,  H05K1/0203 ,  H05K3/305 ,  H05K2201/0133 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2203/12 ,  Y02P70/613 ,  C09J183/00

Abstract: Provided are methods of forming thermally conductive flexible bonds for use in electronic boards of unmanned spacecrafts and other types of aircraft. Also provided are methods of preparing adhesive materials to form these bonds including methods of preparing treated filler particles. In some aspects, an adhesive material includes filler particles having organofunctional groups, such as boron nitride particles treated in silane. These particles may be combined with a urethane modified epoxy to form the adhesive material. The weight ratio of the particles in the adhesive material may be about 40-60%. The adhesive material may be thermally cured using a temperature of less than 110° C. to prevent damage to bonded electronic components. The cured adhesive may have a thermal conductivity of at least about 2 W/m K measured in vacuum and may have a glass transition temperature if less than −40° C.

Abstract translation: 提供了形成用于无人驾驶飞船和其他类型的飞机的电子板的导热柔性键的方法。 还提供了制备形成这些键的粘合剂材料的方法，包括制备经处理的填料颗粒的方法。 在一些方面，粘合剂材料包括具有有机官能团的填料颗粒，例如在硅烷中处理的氮化硼颗粒。 这些颗粒可以与氨基甲酸酯改性的环氧树脂组合以形成粘合剂材料。 粘合剂材料中的颗粒的重量比可以为约40-60％。 粘合剂材料可以使用小于110℃的温度进行热固化，以防止粘合的电子部件损坏。 固化的粘合剂可以具有在真空中测量的至少约2W / m K的热导率，并且如果小于-40℃可具有玻璃化转变温度。

公开(公告)号：US20160264809A1

公开(公告)日：2016-09-15

申请号：US14641756

申请日：2015-03-09

Applicant: Shuyong Xiao ,  Kai Wu

Inventor： Shuyong Xiao ,  Kai Wu

IPC: C09D11/52 ,  H05B3/14 ,  C08J7/04 ,  C09D11/106 ,  C09D11/037

CPC classification number: C09D11/52 ,  C08K3/04 ,  C08K3/38 ,  C08K2003/382 ,  C08K2003/385 ,  C09D11/037 ,  C09D11/10 ,  C09D11/106 ,  H05B3/146 ,  H05B3/34 ,  H05B2203/02 ,  C08L27/20

Abstract: The invention provides a carbon-based polymer PTC ink composition with enhanced heating uniformity to reduce the risk of hot spots across the PTC thick film fabricated from the PTC ink by addition of boron nitride. The added boron nitride is thermo-conductor and electric non-conductor. The presentation of boron nitride in carbon-based polymeric PTC film improves the temperature homogeneity across the film and maintains the desired PTC effect of the heating device. The content of boron nitride based on the total PTC composition in the invented PTC ink composition is 10-50 wt. %.

Abstract translation: 本发明提供一种具有增强的加热均匀性的碳基聚合物PTC油墨组合物，以通过添加氮化硼来减少由PTC油墨制造的PTC厚膜的热点的风险。 添加的氮化硼是热导体和电非导体。 碳基聚合物PTC膜中的氮化硼的呈现提高了膜上的温度均匀性并保持了加热装置的期望的PTC效应。 本发明PTC油墨组合物中基于总PTC组成的氮化硼含量为10-50wt。 ％。

公开(公告)号：US09101062B2

公开(公告)日：2015-08-04

申请号：US13061740

申请日：2009-09-07

Applicant: Eijiro Aoyagi ,  Hongyuan Wang ,  Noriyuki Kirikae ,  Katsufumi Hiraishi

Inventor： Eijiro Aoyagi ,  Hongyuan Wang ,  Noriyuki Kirikae ,  Katsufumi Hiraishi

IPC: H05K1/03 ,  B32B15/08 ,  B32B27/20 ,  C08K7/00 ,  C08K3/22 ,  C08K3/38

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B27/20 ,  C08K7/00 ,  C08K2003/2227 ,  C08K2003/382 ,  H05K1/0346 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0245 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257

Abstract: A highly heat conductive metal-clad laminate, which may be included in a highly heat conductive polyimide film, has a metal layer on one or both sides of an insulating layer which has a heat conductive filler-filled polyimide layer. The insulating layer of the highly heat conductive metal-clad laminate or the highly heat conductive polyimide film having the filler-filled polyimide layer is characterized in that the content of the heat conductive filler in the filler-filled polyimide layer is 20-80 wt %, the heat conductive filler contains a plate-like filler with an average length DL of 0.1-15 μm and a spherical filler with an average particle diameter DR of 0.05-10 μm, DL and DR satisfy the relationship DL>DR/2, no heat conductive filler of 30 μm or more is contained, and the coefficient of thermal expansion is in the range of 10-30 ppm/K.

Abstract translation: 可以包括在高导热性聚酰亚胺膜中的高导热性覆金属层压板在绝缘层的一侧或两侧上具有填充有导热填料的聚酰亚胺层的金属层。 高导热性覆金属层压板的绝缘层或具有填料填充聚酰亚胺层的高导热性聚酰亚胺膜的特征在于，填料填充聚酰亚胺层中的导热性填料的含量为20〜80重量％ 导热性填料含有平均长度DL为0.1〜15μm的板状填料，平均粒径DR为0.05〜10μm的球形填料，DL和DR满足关系式DL> DR / 2，无 含有30μm以上的导热性填料，热膨胀系数在10〜30ppm / K的范围内。