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公开(公告)号：US20190267683A1
公开(公告)日：2019-08-29
申请号：US16411928
申请日：2019-05-14
Applicant: Hamilton Sundstrand Corporation
Inventor： Charles Patrick Shepard , Kris H. Campbell , Scott R. Bouras , Shin Katsumata
IPC: H01M10/613 , H01M10/6569 , H01M10/6568 , H01M10/615 , H01M10/6567 , H01M10/63 , H01M10/6554
Abstract: An energy storage system includes a sealed housing defining an interior space and a plurality of cells arranged within the interior space of the housing. A cooling liquid submerges each of the cells. The cooling system is positioned within the sealed housing configured to actively and passively cool and heat each of the cells.
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公开(公告)号：US20190180908A1
公开(公告)日：2019-06-13
申请号：US15839628
申请日：2017-12-12
Applicant: HAMILTON SUNDSTRAND CORPORATION
Inventor： Mark W. Metzler , Debabrata Pal , Mustansir Kheraluwala , Charles Patrick Shepard
Abstract: An inductor housing for housing an inductor having a core and a winding includes an outer annular wall and a third wall extending inward from the outer annular wall such that the outer annular wall and the third wall at least partially define an annular cavity configured to receive the inductor. The inductor housing further includes an attachment feature configured to couple the inductor housing to a secondary housing. The inductor is configured to be enclosed within the annular cavity and the secondary housing, and coolant from a coolant supply is configured to flow past the annular cavity and contact the winding of the inductor.
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公开(公告)号：US09757823B2
公开(公告)日：2017-09-12
申请号：US14870716
申请日：2015-09-30
Applicant: Hamilton Sundstrand Corporation
Inventor： Charles Patrick Shepard
CPC classification number: B23P11/00 , H01G2/08 , H01G2/106 , H01G4/18 , H01G4/32 , H01G4/33 , Y10T29/49826
Abstract: A method of mounting a capacitor to a bracket is provided. The method includes the step of providing a capacitor with an outer shell, a capacitor member disposed within the shell and a conductor member disposed within the outer shell and thermally coupled to the capacitor member. A collet is arranged having a first opening sized to slidingly engage the conductor member. A sleeve is provided having a second opening sized to receive a first end of the collet. The collet is slid onto the conductor member. The collet is pressed into the sleeve.
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公开(公告)号：US20160193701A1
公开(公告)日：2016-07-07
申请号：US14870716
申请日：2015-09-30
Applicant: Hamilton Sundstrand Corporation
Inventor： Charles Patrick Shepard
CPC classification number: B23P11/00 , H01G2/08 , H01G2/106 , H01G4/18 , H01G4/32 , H01G4/33 , Y10T29/49826
Abstract: A method of mounting a capacitor to a bracket is provided. The method includes the step of providing a capacitor with an outer shell, a capacitor member disposed within the shell and a conductor member disposed within the outer shell and thermally coupled to the capacitor member. A collet is arranged having a first opening sized to slidingly engage the conductor member. A sleeve is provided having a second opening sized to receive a first end of the collet. The collet is slid onto the conductor member. The collet is pressed into the sleeve.
Abstract translation: 提供了将电容器安装到支架上的方法。 该方法包括提供具有外壳的电容器，设置在外壳内的电容器构件和设置在外壳内并热耦合到电容器构件的导体构件的步骤。 夹头布置成具有第一开口的尺寸以滑动地接合导体构件。 提供具有第二开口的套筒，其尺寸适于容纳夹头的第一端。 夹头滑到导体件上。 将夹头压入套筒内。
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Patent Agency Ranking
公开(公告)号：US11527788B2
公开(公告)日：2022-12-13
申请号：US16411928
申请日：2019-05-14
Applicant: Hamilton Sundstrand Corporation
Inventor： Charles Patrick Shepard , Kris H. Campbell , Scott R. Bouras , Shin Katsumata
IPC: H01M10/613 , H01M10/6554 , H01M10/6569 , H01M10/6567 , H01M10/615 , H01M10/63 , H01M10/6568 , H01M10/625 , H01M10/48
Abstract: An energy storage system includes a sealed housing defining an interior space and a plurality of cells arranged within the interior space of the housing. A cooling liquid submerges each of the cells. The cooling system is positioned within the sealed housing configured to actively and passively cool and heat each of the cells.
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公开(公告)号：US20180174728A1
公开(公告)日：2018-06-21
申请号：US15379631
申请日：2016-12-15
Applicant: Hamilton Sundstrand Corporation
Inventor： Charles Patrick Shepard , Shin Katsumata
CPC classification number: H01F17/062 , H01F27/2804 , H01F27/2866 , H01F27/2895 , H01F27/29 , H01F27/292 , H01F2027/2814
Abstract: An electrical device includes a first flexible connector, including a first flexible conductor and a second flexible conductor, and a flexible insulator disposed between the first flexible conductor and the second flexible conductor, a second flexible connector spaced apart from the first flexible connector, the second flexible connector including a third flexible conductor, a first interconnect to electrically connect the first flexible conductor and the third flexible conductor, a second interconnect to electrically connect the third flexible conductor and the second flexible conductor, wherein the second interconnect is disposed opposite the first interconnect.
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公开(公告)号：US11348717B2
公开(公告)日：2022-05-31
申请号：US16176600
申请日：2018-10-31
Applicant: Hamilton Sundstrand Corporation
Inventor： Ashutosh Joshi , Debabrata Pal , Mark W. Metzler , Richard L. Downing , Charles Patrick Shepard
Abstract: An inductor assembly includes a housing including a base, a sidewall, and an insert. The base and the sidewall define a cavity and the insert being positioned within the cavity. A core assembly is positioned within the cavity. The core assembly includes a core and a plurality of windings wrapped about the core and disposed between the sidewall and the insert. A flow path is formed in the housing for receiving a coolant to remove heat from the core assembly.
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公开(公告)号：US10892082B2
公开(公告)日：2021-01-12
申请号：US15839628
申请日：2017-12-12
Applicant: HAMILTON SUNDSTRAND CORPORATION
Inventor： Mark W. Metzler , Debabrata Pal , Mustansir Kheraluwala , Charles Patrick Shepard
Abstract: An inductor housing for housing an inductor having a core and a winding includes an outer annular wall and a third wall extending inward from the outer annular wall such that the outer annular wall and the third wall at least partially define an annular cavity configured to receive the inductor. The inductor housing further includes an attachment feature configured to couple the inductor housing to a secondary housing. The inductor is configured to be enclosed within the annular cavity and the secondary housing, and coolant from a coolant supply is configured to flow past the annular cavity and contact the winding of the inductor.
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公开(公告)号：US20180199461A1
公开(公告)日：2018-07-12
申请号：US15401872
申请日：2017-01-09
Applicant: HAMILTON SUNDSTRAND CORPORATION
Inventor： John Huss , Alan Kasner , Mark W. Metzler , Ernest Thompson , Debabrata Pal , Charles Patrick Shepard
IPC: H05K7/20 , H05K5/06 , H01L21/56 , H01L23/367 , H01L23/373 , H01L23/29
CPC classification number: H05K7/2039 , B82Y30/00 , C08K7/04 , C08K2003/382 , H01F27/08 , H01G2/08 , H01G2/10 , H01L21/565 , H01L23/295 , H01L23/3675 , H01L23/3731 , H01L23/3737 , H01L23/42 , H05K5/064 , C08L75/04 , C08L83/04 , C08L63/00
Abstract: Potted electronic assemblies are disclosed along with methods of making and cooling them. The electronic assemblies include a conductive heat transfer medium disposed between and in contact with an electronic component and a heat sink. The conductive heat transfer medium has a hardened fluid polymer material that includes boron nitride nanotubes dispersed therein.
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