摘要:
A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with respect to the frame, and at least one stopper restricting a displacement of the actuator in a direction along the height of the actuator. The MEMS device is fabricated by bonding a second substrate to a first substrate, forming the frame and the actuator by partially removing the first substrate, and forming the at least one stopper by partially removing the second substrate.
摘要:
A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with respect to the frame, and at least one stopper restricting a displacement of the actuator in a direction along the height of the actuator. The MEMS device is fabricated by bonding a second substrate to a first substrate, forming the frame and the actuator by partially removing the first substrate, and forming the at least one stopper by partially removing the second substrate.
摘要:
A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with respect to the frame, and at least one stopper restricting a displacement of the actuator in a direction along the height of the actuator. The MEMS device is fabricated by bonding a second substrate to a first substrate, forming the frame and the actuator by partially removing the first substrate, and forming the at least one stopper by partially removing the second substrate.
摘要:
A microelectromechanical systems (MEMS) device includes a frame, an actuator formed on the same layer as the frame and connected to the frame to be capable of performing a relative motion with respect to the frame, and at least one stopper restricting a displacement of the actuator in a direction along the height of the actuator. The MEMS device is fabricated by bonding a second substrate to a first substrate, forming the frame and the actuator by partially removing the first substrate, and forming the at least one stopper by partially removing the second substrate.
摘要:
A vertical comb actuator radio frequency (RF) micro-electro-mechanical system (MEMS) switch. The RF MEMS switch includes a substrate; first and second signal lines spaced at a predetermined interval from each other and deposited on an upper surface of the substrate; an actuator positioned over the first and second signal lines when viewed from the upper surface of the substrate and spaced at a predetermined interval from the first and second signal lines; and a fixing portion positioned over the actuator when viewed from the upper surface of the substrate, wherein the fixing portion permits the actuator to come in contact with the first and second signal lines when a predetermined driving voltage is applied. Thus, it is possible to prevent the actuator from sticking to the substrate. In addition, the RF MEMS switch can be operated with a low voltage and insertion loss and power loss can be reduced.
摘要:
A vertical comb actuator radio frequency (RF) micro-electro-mechanical system (MEMS) switch. The RF MEMS switch includes a substrate; first and second signal lines spaced at a predetermined interval from each other and deposited on an upper surface of the substrate; an actuator positioned over the first and second signal lines when viewed from the upper surface of the substrate and spaced at a predetermined interval from the first and second signal lines; and a fixing portion positioned over the actuator when viewed from the upper surface of the substrate, wherein the fixing portion permits the actuator to come in contact with the first and second signal lines when a predetermined driving voltage is applied. Thus, it is possible to prevent the actuator from sticking to the substrate. In addition, the RF MEMS switch can be operated with a low voltage and insertion loss and power loss can be reduced.
摘要:
A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.
摘要:
A laser straight ruler having a main body and a beam scanner installed on the main body. A laser beam is scanned to form a beam spot on an object. A position sensing device receives a laser beam reflected by the object and senses a position of the beam spot. A signal processing unit drives the beam scanner and processes a signal of the position sensing device. A display displays a change in a distance between the main body and the object and data including a measured distance value from the signal processing unit. An input portion inputs data including adjustment of a scanning width of the beam spot and sets start and end positions of the measured distance. A straight distance of the object is measured or the beam spot having a scanning width corresponding to a measured distance or a predetermined distance is projected to the object.
摘要:
A balance filter packaging chip having a balun mounted therein and a manufacturing method thereof are provided. The balance filter packaging chip includes a device substrate; a balance filter mounted on the device substrate; a bonding layer stacked on a certain area of the device substrate; a packaging substrate having a cavity formed over the balance filter, and combined with the device substrate by the bonding layer; a balun located on a certain area over the packaging substrate; and an insulator layer for passivating the balun. Accordingly, the present invention can reduce an element size and simplify a manufacturing process.
摘要:
An integrated filter including a film bulk acoustic resonator (FBAR) and a surface acoustic wave (SAW) resonator and a method of fabricating the integrated filter. The integrated filter includes: a substrate; a first electrode positioned in a predetermined first area on an upper surface of the substrate; a first piezoelectric layer positioned on the first electrode; a second electrode positioned on the first piezoelectric layer; a second piezoelectric layer positioned in a predetermined second area on the upper surface of the substrate; and at least one inter-digital transducer (IDT) electrode positioned on the second piezoelectric layer. The IDT electrode includes: a first IDT electrode formed in a comb structure on the second piezoelectric layer; and a second IDT electrode formed in a comb structure on the second piezoelectric layer so as to mesh with the first IDT electrode. The first and second piezoelectric layers are formed of an identical material. Thus, an integrated filter which operates in various frequency bands can be made compact.