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公开(公告)号：US20240363825A1
公开(公告)日：2024-10-31
申请号：US18769472
申请日：2024-07-11
发明人： Chunjian LIU , Jian TIAN , Jie LEI , Yajun MA , Jianying ZHANG
IPC分类号： H01L33/62 , H01L25/075 , H01L33/54
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/54
摘要： The present disclosure provides a driving backplane, a light emitting substrate, a backlight module, and a display apparatus, which belongs to the field of display technology. The driving backplane includes a base substrate, a driving layer and an encapsulation layer sequentially laminated. The driving layer has a pad for binding an electronic element and a raised block corresponding to the pad, the pad is located on a side of the corresponding raised block away from the base substrate (BP), and an orthographic projection of the pad on the base substrate is located within an orthographic projection of the corresponding raised block on the corresponding base substrate. The encapsulation layer has a binding opening. The pad and the raised block are located in the binding opening.
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公开(公告)号：US20240282902A1
公开(公告)日：2024-08-22
申请号：US18681145
申请日：2021-11-02
发明人： Jie LEI , Zouming XU , Jian TIAN , Chunjian LIU , Xintao WU , Jie WANG , Jianying ZHANG , Zhi JIN
CPC分类号： H01L33/62 , H01L25/167
摘要： A light-emitting substrate comprises a plurality of signal channels arranged in sequence along a row direction. Each signal channel comprises a plurality of control areas arranged along a column direction, and each control area comprises at least one light area controlled by a same chip. In each signal channel, the light-emitting substrate is provided with a first driving line, a second driving line, and a plurality of reference power lines. The first driving line and the second driving line are respectively used for providing different driving signals to the chip. The reference power line is used for providing a reference power supply voltage to the chip. The reference power lines in a same signal channel are electrically connected, and at least one reference power line is provided between the first driving line and the second driving line.
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公开(公告)号：US20240186304A1
公开(公告)日：2024-06-06
申请号：US17795414
申请日：2021-09-30
发明人： Jie LEI , Jie WANG , Zouming XU , Jian TIAN , Chunjian LIU , Xintao WU , Jianying ZHANG , Zhi JIN , Yongfei LI
IPC分类号： H01L25/16 , H01L25/075
CPC分类号： H01L25/167 , H01L25/0753
摘要： A light-emitting substrate has a light-emitting region and a test region. A plurality of light-emitting device groups and a plurality of driving circuits are disposed in the light-emitting region. The driving circuits include at least one selected driving circuit, and a selected driving circuit includes at least one first-type output terminal and at least one second-type output terminal. The first-type output terminal is electrically connected to the light-emitting device group. A power line is electrically connected to the light-emitting device groups. A first test pad and a second test pad are disposed in the test region. The first test pad is electrically connected to a second-type output terminal of the selected driving circuit, and the second test pad is electrically connected to the power line. The first test device group is electrically connected to the first test pad and the second test pad.
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公开(公告)号：US20240113131A1
公开(公告)日：2024-04-04
申请号：US17765387
申请日：2021-05-31
发明人： Jie LEI , Zouming XU , Jian TIAN , Chunjian LIU , Xintao WU , Jie WANG , Jianying ZHANG , Yajun MA , Zhi ZHANG , Zhentao LI , Li YIN
IPC分类号： H01L27/12 , H01L25/075 , H01L25/16
CPC分类号： H01L27/124 , H01L25/0753 , H01L25/167
摘要： An array substrate (100) and a display device. The array substrate (100) includes a bonding area (102). The array substrate (100) includes a substrate (10), a first conductive layer (20) on the substrate (10), a first insulating layer (30) on one side of the first conductive layer (20) away from the substrate (10), and a second conductive layer (40) on one side of the first insulating layer (30) away from the substrate (10). The bonding area (102) is provided with bonding pins (201), and the bonding pin (201) includes a first conductive portion (21) and a second conductive portion (41) located on the side of the first conductive portion (21) away from the substrate (10), the first conductive portion (21) is located in the first conductive layer (20), the second conductive portion (41) is located in the second conductive layer (40), and the first conductive portion (21) is in direct contact with the second conductive portion (41). The first insulating layer (30) is provided with at least one first opening (301), and the orthographic projection of each of the first openings (301) on the substrate (10) covers the orthographic projections of the plurality of bonding pins (201) on the substrate (10).
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公开(公告)号：US20220342295A1
公开(公告)日：2022-10-27
申请号：US17421702
申请日：2021-03-15
发明人： Jie LEI , Qitao ZHENG , Zouming XU , Xintao WU , Chunjian LIU , Jian TIAN
摘要： A mask includes a first region and a second region. The first region includes a first light-shielding strip and a second light-shielding strip, the second region includes a third light-shielding strip, the first light-shielding strip, the second light-shielding strip is located between the first light-shielding strip and the third light-shielding strip, the first light-shielding strip, the second light-shielding strip and the third light-shielding strip are configured to shield light and bound spaces, and the spaces are configured in such a manner that light is allowed to pass through the spaces. A width of the first light-shielding strip in a first direction is larger than a width of the second light-shielding strip in the first direction, and the width of the second light-shielding strip in the first direction is larger than a width of the third light-shielding strip in the first direction.
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公开(公告)号：US20230341979A1
公开(公告)日：2023-10-26
申请号：US18215913
申请日：2023-06-29
发明人： Chunjian LIU , Jian TIAN , Xintao WU , Jie LEI , Jie WANG , Zouming XU , Tianqing LIU
CPC分类号： G06F3/0443 , G06F3/0412 , G06F2203/04107 , G06F2203/04103
摘要： A touch panel includes: a substrate; a bridging layer; an insulating layer; and a touch layer, including a first touch area and a border area surrounding the first touch area; the border area includes at least one second touch area, and the second touch area includes a plurality of button portions; a second shielding body is disposed between the second touch area and the first touch area; the border area further includes a bonding area for bonding with a driving circuit board; the second shielding body is provided with at least one wire groove, and at least one touch wire is coupled to the bonding area by passing through the wire groove; and the touch layer is disposed on a surface of the insulating layer away from the substrate, and at least two adjacent shielding units are coupled by the bridging layer.
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7.发明公开公开(公告)号：US20240170628A1
公开(公告)日：2024-05-23
申请号：US17786975
申请日：2021-07-30
发明人： Chunjian LIU , Wei HAO , Zouming XU , Jian TIAN , Xintao WU , Jie LEI , Jie WANG , Jianying ZHANG , Wenjin FAN , Jiawei XU , Le LI , Jian ZHANG
CPC分类号： H01L33/62 , H01L25/167
摘要： The present disclosure provides a light-emitting substrate and a manufacturing method thereof, a backlight and a display device. The light-emitting substrate includes a substrate including a plurality of light-emitting regions arranged in an array, each of the plurality of light-emitting regions including a driving circuit and at least one light-emitting unit connected to the driving circuit, a first electrically conductive portion on the substrate and connected to the driving circuit and the at least one light-emitting unit in each light-emitting region, and a second electrically conductive portion on the substrate and including a plurality of pads. The first electrically conductive portion and the second electrically conductive portion are on a same layer.
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公开(公告)号：US20230369233A1
公开(公告)日：2023-11-16
申请号：US17426815
申请日：2021-01-28
发明人： Chunjian LIU , Zouming XU , Feifei WANG , Qin ZENG , Xintao WU , Jian TIAN , Jie LEI , Jie WANG , Yufei ZHAN
IPC分类号： H01L23/538 , H01L25/16
CPC分类号： H01L23/5386 , H01L25/167
摘要： The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.
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公开(公告)号：US20230207761A1
公开(公告)日：2023-06-29
申请号：US18000198
申请日：2020-12-25
发明人： Chunjian LIU , Zouming XU , Jie LEI , Jian TIAN , Xintao WU , Qin ZENG , Jie WANG , Yufei ZHAN
IPC分类号： H01L33/62 , H01L25/075 , H01L33/38
CPC分类号： H01L33/62 , H01L25/0753 , H01L33/382
摘要： A drive backplane includes: a base substrate, binding electrodes, signal lines, and fan-out lines. The signal lines extend in a second direction and are arranged in a first direction. At least two signal lines have different lengths in the second direction. At least one fan-out line includes an oblique line portion and a first straight line portion. One end of the oblique line portion is coupled to the end of the signal line close to the binding electrode, and the other end thereof is coupled to the first straight line portion. The end of the first straight line portion away from the oblique line portion is coupled to the binding electrode. The distance, in a direction perpendicular to the first direction, between the two ends of the oblique line portion is a first distance, and the first distances of at least two oblique line portions are different.
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公开(公告)号：US20220359402A1
公开(公告)日：2022-11-10
申请号：US17611801
申请日：2020-12-08
发明人： Qin ZENG , Zouming XU , Chunjian LIU , Jian TIAN , Xintao WU , Jie LEI , Jie WANG , Xiaodong XIE , Min HE , Xinxiu ZHANG , Xue ZHAO , Huayu SANG , Wenjie XU
IPC分类号： H01L23/538 , H01L25/16 , H01L33/62
摘要： An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.
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