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公开(公告)号：US20230207542A1
公开(公告)日：2023-06-29
申请号：US17438447
申请日：2020-11-25
发明人： Tianyu ZHANG , Min HE , Tengfei ZHONG , Xinxiu ZHANG , Xiaodong XIE , Xue ZHAO , Wenjie XU , Huayu SANG
IPC分类号： H01L25/16 , H01L23/538
CPC分类号： H01L25/167 , H01L23/5386 , H01L25/162
摘要： This disclosure relates to a light-emitting substrate, a preparation method thereof, and an array substrate, and relates to the technical field of display. The array substrate is polygonal and has at least one set of first and second lateral sides oppositely arranged, and has a first binding area arranged near the first lateral side and a second binding area arranged near the second lateral side. The array substrate includes a base substrate and a pad layer arranged on a main surface of the base substrate. The pad layer includes first binding pads in the first binding area, and second binding pads in the second binding area. Any one of the first binding area and the second binding area is configured to connect with a driving circuit board to drive the array substrate. The array substrate can avoid the binding pad from being damaged and thus discarding the array substrate.
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公开(公告)号：US20220359402A1
公开(公告)日：2022-11-10
申请号：US17611801
申请日：2020-12-08
发明人： Qin ZENG , Zouming XU , Chunjian LIU , Jian TIAN , Xintao WU , Jie LEI , Jie WANG , Xiaodong XIE , Min HE , Xinxiu ZHANG , Xue ZHAO , Huayu SANG , Wenjie XU
IPC分类号： H01L23/538 , H01L25/16 , H01L33/62
摘要： An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.
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公开(公告)号：US20240105892A1
公开(公告)日：2024-03-28
申请号：US17768324
申请日：2021-04-16
发明人： Xue ZHAO , Xiaodong XIE , Min HE , Tengfei ZHONG , Wenjie XU , Xinxiu ZHANG , Bin PANG , Huayu SANG
IPC分类号： H01L33/62 , H01L25/075
CPC分类号： H01L33/62 , H01L25/0753 , H01L2933/0066
摘要： A driving backplane, a manufacturing method thereof, a light-emitting substrate are provided. In the driving backplane, a first conductive layer on a substrate; a first organic film layer is between the first conductive layer and second conductive layer, the first organic film layer has first via holes; a first inorganic film layer is on one side of first organic film layer away from the substrate; the second conductive layer is on one side of first inorganic film layer away from first organic film layer, the second conductive layer and the first conductive layer are connected through the first via holes; orthographic projections of the first conductive layer and second conductive layer have an overlapping region, the overlapping region includes a region including orthographic projection of the first via holes, and a first region, an orthographic projection of the first inorganic film layer covers parts of the first region.
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公开(公告)号：US20220404933A1
公开(公告)日：2022-12-22
申请号：US17776897
申请日：2021-05-13
发明人： Bin PANG , Xiaodong XIE , Min HE , Tengfei ZHONG , Xue ZHAO
IPC分类号： G06F3/044 , G02F1/1333
摘要： A touch substrate includes a substrate; a plurality of first touch electrodes disposed on the substrate and extending in a first direction; and a plurality of second touch electrodes disposed on the substrate and extending in a second direction intersecting with the first direction. The plurality of second touch electrodes are insulated from the plurality of first touch electrodes. Each first touch electrode and each second touch electrode both include a mesh structure and a plurality of first dummy electrodes; each first dummy electrode includes at least two line segments; the at least two line segments intersect with each other and have no closed region therebetween.
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公开(公告)号：US20220101801A1
公开(公告)日：2022-03-31
申请号：US17486624
申请日：2021-09-27
发明人： Tianyu ZHANG , Min HE , Tengfei ZHONG , Xiaodong XIE , Xinxiu ZHANG , Xue ZHAO , Huayu SANG
IPC分类号： G09G3/34
摘要： A light-emitting substrate includes a base and a plurality of light-emitting units disposed on the base. A light-emitting unit includes a driving voltage terminal, and a main driver chip pad group, a plurality of main light-emitting element pad groups connected in series and at least one spare light-emitting element pad group. Both ends of the plurality of main light-emitting element pad groups are coupled to the driving voltage terminal and the main driver chip pad group. Each spare light-emitting element pad group is connected in parallel with one of the plurality of main light-emitting element pad groups to constitute a pad unit.
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公开(公告)号：US20240047481A1
公开(公告)日：2024-02-08
申请号：US17639316
申请日：2021-04-16
发明人： Xinxiu ZHANG , Huayu SANG , Xue ZHAO , Xiaodong XIE , Tengfei ZHONG , Wenjie XU , Min HE , Bin PANG , Qiang JI , Jin ZHANG
IPC分类号： H01L27/12 , H01L33/62 , H01L25/16 , H01L25/075
CPC分类号： H01L27/1244 , H01L33/62 , H01L25/167 , H01L25/0753 , H01L2933/0066
摘要： An array substrate includes: a substrate, a first conductive layer, a second conductive layer and at least two organic insulating layers; the first conductive layer is provided on a side of the substrate; the second conductive layer is provided on a side of the first conductive layer away from the substrate, and an orthographic projection of the second conductive layer on the substrate has an overlapped region with an orthographic projection of the first conductive layer on the substrate, the overlapped region includes a via region and a routing region; the at least two organic insulating layers are provided between the first conductive layer and the second conductive layer, and an orthographic projection of the at least two organic insulating layers on the substrate is overlapped with an orthographic projection of the routing region.
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公开(公告)号：US20230376159A1
公开(公告)日：2023-11-23
申请号：US17907000
申请日：2021-10-20
发明人： Xinxiu ZHANG , Min HE , Xiaodong XIE , Tianyu ZHANG , Xue ZHAO , Tengfei ZHONG , Huayu SANG , Bin PANG
IPC分类号： G06F3/047
CPC分类号： G06F3/047 , G06F2203/04103 , G06F2203/04107
摘要： Provided are a touch substrate and a method for manufacturing the same, and a display apparatus. The touch substrate includes: a base, a first touch layer and a second touch layer on the base, and an interlayer insulation layer between the second touch layer and the first touch layer. The first touch layer includes first touch electrodes and touch signal lines arranged side by side along a first direction and extending in a second direction. The second touch layer includes second touch electrodes arranged side by side along the second direction, each of which extends in the first direction and is connected to at least one touch signal line through a first connection via penetrating through the interlayer insulation layer. The first touch layer further includes at least one shielding electrode extending in the second direction and arranged between the first touch electrodes and the touch signal lines.
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公开(公告)号：US20230061318A1
公开(公告)日：2023-03-02
申请号：US17793975
申请日：2022-05-17
发明人： Xiaodong XIE , Min HE , Jing WANG , Tianyu ZHANG , Xue ZHAO , Tengfei ZHONG
IPC分类号： H01L33/62 , H01L33/00 , H01L25/075
摘要： A light emitting substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method includes providing a base substrate; forming a first conductive pattern on the base substrate using a first mask; forming a first insulating layer on the first conductive pattern using a second mask, to form a first via hole and a second via hole; forming a second conductive pattern on the first insulating layer using the first mask, the second conductive pattern being electrically connected to the first conductive pattern through the first via hole and the second via hole; forming a second insulating layer on the second conductive pattern using the second mask, to form a third via hole; and forming a third conductive pattern on the second insulating layer using a third mask, the third conductive pattern being electrically connected to the second conductive pattern through the third via hole.
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公开(公告)号：US20220342245A1
公开(公告)日：2022-10-27
申请号：US17432557
申请日：2020-10-28
发明人： Min HE , Jing WANG , Xiaodong XIE , Tianyu ZHANG , Xue ZHAO , Tengfei ZHONG , Xinxiu ZHANG , Huayu SANG , Feng QU
IPC分类号： G02F1/1345
摘要： The embodiment of the present disclosure provides a driving backplate including a base substrate, and an insulation layer and a plurality of conductive structures on the base substrate. The insulation layer insulates the plurality of conductive structures from each other. The plurality of conductive structures includes a first conductive layer and a second conductive layer sequentially stacked along a direction away from the base substrate. At least one portion of a region in which the first conductive layer is in contact with the second conductive layer includes a flat contact region. An opening is formed at a position in the insulation layer corresponding to the conductive structure. An edge of the opening in the insulation layer is between the first conductive layer and the second conductive layer and is correspondingly in edge regions of the first conductive layer and the second conductive layer.
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公开(公告)号：US20210064209A1
公开(公告)日：2021-03-04
申请号：US16833613
申请日：2020-03-29
发明人： Xinxiu ZHANG , Shifeng XU , Xiaodong XIE , Min HE , Tengfei ZHONG , Bin PANG , Yuan LI , Tianyu ZHANG , Xue ZHAO
摘要： The present disclosure provides a touch screen and a display device. The touch screen includes a substrate, and a first metal wiring layer, a second metal wiring layer, and a third metal wiring layer formed on the substrate. A first insulation layer is arranged on a surface of the first metal wiring layer, and the second metal wiring layer is arranged on the first insulation layer. A second insulation layer is arranged on a surface of the second metal wiring layer, and the third metal wiring layer is arranged on the second insulation layer. Electrical connection channels are electrically connected to the second electrode channels in a one-to-one corresponding manner by using through holes, and the electrical connection channels are electrically connected to a second electrode lead terminal, so that the second electrode channels are electrically connected to the second electrode lead terminal.
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