公开(公告)号：US20050056914A1

公开(公告)日：2005-03-17

申请号：US10903495

申请日：2004-07-30

申请人： Heng Hong ,  Tian Yip ,  Joo Tan ,  Choon Lee ,  Liang Kng Koh

发明人： Heng Hong ,  Tian Yip ,  Joo Tan ,  Choon Lee ,  Liang Kng Koh

IPC分类号： H01L23/495

CPC分类号： H01L23/49551 ,  H01L23/4334 ,  H01L23/49541 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame (1) has a first portion (2) adapted to have a semiconductor device (10) mounted thereon and a second portion (3) including a main member (5), a number of first contact members (6) and a number of second contact members (7). The first and second contact members (6, 7) depend from the main member (5). The second portion (3) at least partially surrounds the first portion (6). The first contact members (6) extend form the main member (5) in a direction away for the first portion (2) and the second contact members (7) extend from the main member (5) in a direction towards the first portion (2).

摘要翻译： 引线框架（1）具有适于安装有半导体器件（10）的第一部分（2）和包括主元件（5）的第二部分（3），多个第一接触元件（6）和 第二接触构件（7）的数量。 第一和第二接触构件（6,7）从主构件（5）取向。 第二部分（3）至少部分地包围第一部分（6）。 第一接触构件（6）沿远离第一部分（2）的方向从主构件（5）延伸，并且第二接触构件（7）从主构件（5）沿朝向第一部分的方向（ 2）。

公开(公告)号：US20070252248A1

公开(公告)日：2007-11-01

申请号：US11660184

申请日：2004-08-26

申请人： Tian Yip ,  Bee Ngoh Kee

发明人： Tian Yip ,  Bee Ngoh Kee

IPC分类号： H01L23/495

CPC分类号： H01L23/49551 ,  H01L21/4842 ,  H01L23/4951 ,  H01L24/48 ,  H01L24/72 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A lead frame (200) for housing an integrated circuit is disclosed comprising a main member (220) and an engagement portion (230) for receiving an integrated circuit (210). The integrated circuit (210) is located at the engagement portion (230) and engaged with the lead frame through resilient engagement with the first and second engagement members (222, 223). The first and second engagement members (222,223) which depend from the main member, secure the integrated to the lead frame by engaging in resilient contact respective opposed surfaces of the integrated circuit. The integrated circuit is engaged to the lead frame by clipping into it into position between the engagement members. There is no need for a gluing process unlike conventional lead frame designs which where the integrated circuit is attached to a lead frame by gluing it onto the die paddle.

摘要翻译： 公开了一种用于容纳集成电路的引线框架（200），其包括用于接收集成电路（210）的主构件（220）和接合部分（230）。 集成电路（210）位于接合部分（230）处并通过与第一和第二接合构件（222,223）的弹性接合而与引线框架接合。 第一和第二接合构件（222,223），其从主构件取向，通过与集成电路的相对的相对表面接合弹性接触来将集成到引线框架上固定。 集成电路通过将其夹入到接合构件之间的适当位置而与引线框架接合。 与传统的引线框架设计不同，不需要胶合工艺，其中集成电路通过将其粘合到芯片上而附接到引线框架。