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公开(公告)号:US11866535B2
公开(公告)日:2024-01-09
申请号:US17153027
申请日:2021-01-20
申请人: Henkel AG & Co. KGaA
发明人: AiFu Che , Chunfu Chen , Bin Li , Chao Wang
IPC分类号: C09J163/00 , C08G59/44 , C08G59/46 , C08F283/10
CPC分类号: C08F283/10
摘要: This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.
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公开(公告)号:US20230392003A1
公开(公告)日:2023-12-07
申请号:US18237546
申请日:2023-08-24
申请人: Henkel AG & Co. KGaA
发明人: Yalong Qi , Bin Li , Hongyu Chu
CPC分类号: C08L63/00 , C08L9/00 , C08L2205/025 , C08L2205/035 , C08L2207/53
摘要: This invention relates to a photocurable adhesive composition comprising at least one first hydroxyl terminated epoxidized unsaturated polyolefin having an epoxide equivalent weight less than 250 g/eq; at least one second hydroxyl terminated epoxidized unsaturated polyolefin having an epoxide equivalent weight greater than or equal to 250 g/eq; at least one dimer acid modified epoxy resin;
at least one core-shell toughening agent; at least one polyol component; and at least one cationic photoinitiator. The cured product of the photocurable adhesive composition of the present invention shows excellent acid resistance and elongation property and is therefore suitable to be used for the protection of glass edge during the glass slimming process.-
公开(公告)号:US20210171694A1
公开(公告)日:2021-06-10
申请号:US17153027
申请日:2021-01-20
申请人: Henkel AG & Co. KGaA
发明人: AiFu Che , Chunfu Chen , Bin Li , Chao Wang
IPC分类号: C08F283/10
摘要: This invention relates to a two-part epoxy based composition, comprising a first part comprising at least one epoxy resin; a second part comprising at least one epoxy resin curing agent, and at least one acrylamide compound containing a hydrogen atom bound to the nitrogen atom in the acrylamide structure. The two-part epoxy based composition according to the present invention exhibits excellent adhesion strength to low surface tension substrates, such as stainless steel and PVC.
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公开(公告)号:US20230332025A1
公开(公告)日:2023-10-19
申请号:US18211399
申请日:2023-06-19
申请人: Henkel AG & Co. KGaA
发明人: Bin Li , Yalong Qi , Chunfu Chen , Hongyu Chu , Daoqiang Lu
IPC分类号: C09J163/00 , C09J11/06 , C09J177/00 , C09J5/04 , C09J5/06
CPC分类号: C09J163/00 , C09J11/06 , C09J177/00 , C09J5/04 , C09J5/06
摘要: The present invention relates to a two-part epoxy-based structural adhesive composition, comprising a first part and a second part, the first part comprising: i) a first aromatic difunctional epoxy resin having an epoxide equivalent weight (EEW) of less than 400 g/eq, ii) a second aromatic difunctional epoxy resin having an epoxide equivalent weight of from 400 g/eq to 3000 g/eq, and iii) a shell-core toughening agent; the second part comprising: I) a non-aromatic polyetheramide amine and II) an alicyclic amine. Moreover, the present invention also relates to a method for bonding substrates using the adhesive composition and an article bonded with the cured product of the adhesive composition and use of the composition in assembly of articles.
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