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公开(公告)号:US20240199925A1
公开(公告)日:2024-06-20
申请号:US18589316
申请日:2024-02-27
申请人: Henkel AG & Co. KGaA
CPC分类号: C09J9/02 , C09J5/00 , C09J11/04 , C09J11/08 , C09J163/10 , H01B1/22 , H01L31/0512 , C09J2421/00 , C09J2463/00
摘要: The present invention provides an electrically conductive adhesive composition comprising (A) at least one non-toughened epoxy resin, (B) optionally at least one toughened epoxy resin, (C) at least one imidazole compound, (D) at least one latent amine curing agent other than imidazole compound, (E) at least one silver filler having a D50 particle size of no more than 20 μm, and (F) at least one silver filler having a D50 particle size of from 20 to 100 μm.
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公开(公告)号:US20220216361A1
公开(公告)日:2022-07-07
申请号:US17455025
申请日:2021-11-16
申请人: Henkel AG & Co. KGaA
摘要: The present disclosure provides a rework device and a rework method useful in reworking a shingle cell module. The rework device includes a first supporting component, a second supporting component and a heating component disposed between the first supporting component and the second supporting component and being flush with the second supporting component. The first supporting component is inclined at an angle with respect to the heating component. This type of rework device and rework method has the advantages of simple structure, low cost and convenient operation.
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