公开(公告)号：US09938437B2

公开(公告)日：2018-04-10

申请号：US14857870

申请日：2015-09-18

申请人： Henkel IP & Holding GmbH

发明人： Timothy M. Champagne ,  Laxmisha M. Sridhar ,  Jonathan B. Israel ,  Philip T. Klemarczyk ,  XianMan Zhang ,  Benny E. Jordan

IPC分类号： C08L63/00 ,  C09J163/00 ,  H01L23/29 ,  H01L21/56 ,  C08K5/092 ,  C08F283/10 ,  C07C33/12 ,  C07C69/54 ,  C07C69/753 ,  C07D303/16 ,  C07D303/28 ,  C09J163/04 ,  H01L23/31 ,  H01L23/498 ,  C08G59/22 ,  C08G59/24 ,  C08G59/40 ,  C08G59/50 ,  C08G59/56 ,  C08L79/08

CPC分类号： C09J163/00 ,  C07C33/12 ,  C07C69/54 ,  C07C69/753 ,  C07C2603/68 ,  C07D303/16 ,  C07D303/28 ,  C08F283/10 ,  C08G59/226 ,  C08G59/24 ,  C08G59/4021 ,  C08G59/5073 ,  C08G59/56 ,  C08K5/092 ,  C08L53/02 ,  C08L63/00 ,  C08L79/085 ,  C09J163/04 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3142 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00

摘要： Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

公开(公告)号：US10472548B2

公开(公告)日：2019-11-12

申请号：US15795501

申请日：2017-10-27

申请人： Henkel IP & Holding GmbH

发明人： Timothy M. Champagne ,  Laxmisha M. Sridhar ,  Jonathan B. Israel ,  Philip T. Klemarczyk ,  XianMan Zhang ,  Benny E. Jordan

IPC分类号： C09J163/00 ,  C08L63/00 ,  H01L23/29 ,  H01L21/56 ,  C08K5/092 ,  C08F283/10 ,  C07C33/12 ,  C07C69/54 ,  C07C69/753 ,  C07D303/16 ,  C07D303/28 ,  C09J163/04 ,  H01L23/31 ,  H01L23/498 ,  C08G59/22 ,  C08G59/24 ,  C08G59/40 ,  C08G59/50 ,  C08G59/56 ,  C08L53/02 ,  C08L79/08

摘要： Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

公开(公告)号：US20180155588A1

公开(公告)日：2018-06-07

申请号：US15795501

申请日：2017-10-27

申请人： Henkel IP & Holding GmbH

发明人： Timothy M. Champagne ,  Laxmisha M. Sridhar ,  Jonathan B. Israel ,  Philip T. Klemarczyk ,  XianMan Zhang ,  Benny E. Jordan

IPC分类号： C09J163/00 ,  C07C33/12 ,  C07C69/54 ,  H01L23/29 ,  H01L21/56 ,  H01L23/498 ,  C08F283/10 ,  C09J163/04 ,  C08K5/092 ,  C07C69/753

摘要： Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

公开(公告)号：US20160002510A1

公开(公告)日：2016-01-07

申请号：US14857870

申请日：2015-09-18

申请人： Henkel IP & Holding GmbH

发明人： Timothy M. Champagne ,  Laxmisha M. Sridhar ,  Jonathan B. Israel ,  Philip T. Klemarczyk ,  XianMan Zhang ,  Benny E. Jordan

IPC分类号： C09J163/00 ,  C07D303/16 ,  C07D303/28 ,  C07C69/753 ,  H01L23/498 ,  C07C69/54 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  C09J163/04 ,  C07C33/12

CPC分类号： C09J163/00 ,  C07C33/12 ,  C07C69/54 ,  C07C69/753 ,  C07C2603/68 ,  C07D303/16 ,  C07D303/28 ,  C08F283/10 ,  C08G59/226 ,  C08G59/24 ,  C08G59/4021 ,  C08G59/5073 ,  C08G59/56 ,  C08K5/092 ,  C08L53/02 ,  C08L63/00 ,  C08L79/085 ,  C09J163/04 ,  H01L21/563 ,  H01L23/293 ,  H01L23/3142 ,  H01L23/49838 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/00

摘要： Thermosetting resin compositions are provided that are useful for mounting onto a circuit board semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”) and the like (collectively, “subcomponents”), or semiconductor chips. Reaction products of the compositions are controllably reworkable when subjected to appropriate conditions.

摘要翻译： 提供了可用于安装到电路板半导体器件上的热固性树脂组合物，例如芯片尺寸或芯片级封装（“CSP”），球栅阵列（“BGAs”），焊盘阵列（“LGAs”）和 （统称为“子部件”）或半导体芯片。 当经受适当条件时，组合物的反应产物是可控制的可再加工的。