METHOD FOR MANUFACTURING WAVEGUIDE STRUCTURES ON WAFER-LEVEL AND CORRESPONDING WAVEGUIDE STRUCTURES

    公开(公告)号:US20180372943A1

    公开(公告)日:2018-12-27

    申请号:US15992273

    申请日:2018-05-30

    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

    METHOD FOR MANUFACTURING WAVEGUIDE STRUCTURES ON WAFER-LEVEL AND CORRESPONDING WAVEGUIDE STRUCTURES
    2.
    发明申请
    METHOD FOR MANUFACTURING WAVEGUIDE STRUCTURES ON WAFER-LEVEL AND CORRESPONDING WAVEGUIDE STRUCTURES 有权
    水平波及波导结构波导结构的制造方法

    公开(公告)号:US20160223746A1

    公开(公告)日:2016-08-04

    申请号:US15014244

    申请日:2016-02-03

    CPC classification number: G02B6/0065 B29D11/00663

    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

    Abstract translation: 波导结构可以在晶片级制造,并且包括保持结构和每个具有芯和两个端面的第一和第二波导。 保持结构包括布置在第一和第二波导之间的分离结构,并且在第一和第二波导的端面之间的区域中提供第一和第二波导之间的光学隔离。 用于制造具有至少一个波导的这种波导结构的方法包括通过工具结构对复制材料进行成形以获得端面,硬化复制材料并从包括多个如此获得的波导的波导结构晶片中去除工具结构 。

    Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures

    公开(公告)号:US10215909B2

    公开(公告)日:2019-02-26

    申请号:US15992273

    申请日:2018-05-30

    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

    Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures

    公开(公告)号:US10007052B2

    公开(公告)日:2018-06-26

    申请号:US15014244

    申请日:2016-02-03

    CPC classification number: G02B6/0065 B29D11/00663

    Abstract: The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.

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