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公开(公告)号：US20210188718A1
公开(公告)日：2021-06-24
申请号：US16078710
申请日：2017-02-16
IPC分类号： C04B37/02 , H01L23/373
摘要： The invention relates to a copper-ceramic composite comprising:—a ceramic substrate;—a copper or copper alloy coating in which the copper or copper alloy has grain sizes of 10 μm to 300 μm and a number distribution of the grain sizes with a median d50 and an arithmetic mean darith, the ratio of d50 to darith (d50/darith) being between 0.75 and 1.10.
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公开(公告)号：US10403769B2
公开(公告)日：2019-09-03
申请号：US14425253
申请日：2013-08-30
发明人： Christian Muschelknautz , Matthias Horteis , Isao Tanaka , Klaus Kunze , Roupen Keusseyan , Toshinori Wada , Aziz S. Shaikh
IPC分类号： C09D5/24 , H01B1/22 , H01L31/0224
摘要： The invention relates to an electro-conductive paste comprising Ag nano-particles and spherical Ag micro-particles in the preparation of electrodes, particularly in electrical devices, particularly in temperature sensitive electrical devices or solar cells, particularly in HIT (Heterojunction with Intrinsic Thin-layer) solar cells. In particular, the invention relates to a paste, a process for preparing a paste, a precursor, a process for preparing an electrical device and a module comprising electrical devices. The invention relates to a paste comprising the following paste constituents: a. Ag particles, b. a polymer system; wherein the Ag particles have a multi-modal distribution of particle diameter with at least a first maximum in the range from about 1 nm to about less than 1 μm and at least a further maximum in the range from about 1 μm to about less than 1 mm; wherein the difference between the first and the further maximum is at least about 0.3 μm; wherein at least 50 wt. % of the Ag particles with a diameter in the range from 1 μm to 1 mm are spherical.
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公开(公告)号：US20190023619A1
公开(公告)日：2019-01-24
申请号：US16078235
申请日：2017-02-16
IPC分类号： C04B37/02 , H05K3/38 , B32B15/20 , H01L23/373
摘要： The present invention relates to a copper-ceramic composite comprising—a ceramic substrate which contains aluminum oxide, the aluminum oxide having particle sizes in the range of 0.01 μm to 25 μm and a quantity distribution of the particle sizes with a median value d50 and an arithmetic mean value darith, and the ratio of d50 to darith being in the range of 0.75 to 1.10, —a coating made of copper or a copper alloy provided on the ceramic substrate.
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公开(公告)号：US11021407B2
公开(公告)日：2021-06-01
申请号：US16078141
申请日：2017-02-16
摘要： The invention relates to a copper/ceramic composite comprising—a ceramic substrate which contains aluminum oxide, —a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Cu)=d50/darith; the aluminum oxide has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Al2O3)=d50/darith; and S(Al2O3) and S(Cu) satisfy the following condition: 0.7≤S(Al2O3)/S(Cu)≤1.4.
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公开(公告)号：US20190084893A1
公开(公告)日：2019-03-21
申请号：US16078676
申请日：2017-02-16
摘要： The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 μm to 300 μm.
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公开(公告)号：US11584696B2
公开(公告)日：2023-02-21
申请号：US16078662
申请日：2017-02-16
IPC分类号： C04B41/00 , C04B41/51 , C04B41/88 , H01L23/15 , H01L23/373 , C04B37/02 , C04B35/111
摘要： A copper-ceramic composite: includes a ceramic substrate containing alumina and a copper or copper alloy coating on the ceramic substrate. The alumina has a mean grain shape factor Ra(Al2O3), defined as the arithmetic mean of the shape factors R of the alumina grains, of at least 0.4.
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公开(公告)号：US11498878B2
公开(公告)日：2022-11-15
申请号：US16078182
申请日：2017-02-16
摘要： The invention relates to a copper-ceramic composite, comprising a ceramic substrate, which contains aluminum oxide, a coating on the ceramic substrate made of copper or a copper alloy, wherein the aluminum oxide has an average grain form factor Ra(Al2O3), determined as an arithmetic average value from the form factors of the grains of the aluminum oxide, the copper or the copper alloy has an average grain form factor Ra(Cu), determined as an arithmetic average of the form factors of the grains of the copper or copper alloy, and the average grain form factors of the aluminum oxide and copper or copper alloy meet the following condition: 0.5≤Ra(Al2O3)/Ra(Cu)≤2.0.
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8.发明申请ELECTRO-CONDUCTIVE PASTE WITH CHARACTERISTIC WEIGHT LOSS FOR HIGH TEMPERATURE APPLICATION 审中-公开具有高温应用特性重量损失的电导电胶公开(公告)号：US20160013333A1
公开(公告)日：2016-01-14
申请号：US14794116
申请日：2015-07-08
IPC分类号： H01L31/0224 , H01L31/18 , C09D5/24
CPC分类号： H01L31/022425 , C08K3/08 , C08K3/40 , C08L1/28 , C09D5/24 , H01B1/16 , H01B1/22 , H01L31/068 , H01L31/1864 , Y02E10/547
摘要： In general, the invention relates to electro-conductive pastes with characteristic weight loss and their use in the preparation of photovoltaic solar cells. More specifically, the invention relates to electro-conductive pastes, solar cell precursors, processes for preparation of solar cells, solar cells and solar modules.The invention relates to a paste comprising the following paste constituents: i. Metal particles; ii. An inorganic reaction system; iii. An organic vehicle; wherein the first weight loss Δ30 is in the range from about 0.05 to about 0.3 wt. %.
摘要翻译： 通常，本发明涉及具有特征重量损失的导电浆料及其在制备光伏太阳能电池中的用途。 更具体地，本发明涉及导电浆料，太阳能电池前体，太阳能电池的制备方法，太阳能电池和太阳能电池组件。 本发明涉及一种包含以下糊状成分的糊状物： 金属颗粒 ii。 无机反应体系; iii。 有机车; 其中所述第一减重量Dgr 30在约0.05至约0.3重量％的范围内。 ％。
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公开(公告)号：US11021406B2
公开(公告)日：2021-06-01
申请号：US16078676
申请日：2017-02-16
摘要： The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 μm to 300 μm.
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公开(公告)号：US20190055166A1
公开(公告)日：2019-02-21
申请号：US16078182
申请日：2017-02-16
摘要： The invention relates to a copper-ceramic composite, comprising a ceramic substrate, which contains aluminum oxide, a coating on the ceramic substrate made of copper or a copper alloy, wherein the aluminum oxide has an average grain form factor Ra(Al2O3), determined as an arithmetic average value from the form factors of the grains of the aluminum oxide, the copper or the copper alloy has an average grain form factor Ra(Cu), determined as an arithmetic average of the form factors of the grains of the copper or copper alloy, and the average grain form factors of the aluminum oxide and copper or copper alloy meet the following condition: 0.5≤Ra(Al2O3)/Ra(Cu)≤2.0.
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