公开(公告)号：US20070016898A1

公开(公告)日：2007-01-18

申请号：US11180445

申请日：2005-07-13

申请人： Herbert Derby ,  Nicholas Mitchell ,  Indrajit Poddar

发明人： Herbert Derby ,  Nicholas Mitchell ,  Indrajit Poddar

IPC分类号： G06F9/45

CPC分类号： G06F11/3604

摘要： A system, method, and computer program for identifying evolving regions in a graph of interrelated nodes representing a computer system environment. The method includes generating a series of samples (302) of the environment. Each sample includes a plurality of interrelated nodes (502) and at least one edge (504) classified into a plurality of at least one of node type and edge type, respectively. A summary (900) of the plurality of at least one of node type (502) and edge type (504) is created for the series of samples (302). A summary instance (312) of the summary (900) is created for each sample. At least one summary instance (312) is compared to at least one subsequent summary instance (314) and at least one result (318) is stored in memory (106). A successive behavior is characterized for one or more of the at least one of the node type and the edge type.

公开(公告)号：US6020562A

公开(公告)日：2000-02-01

申请号：US967489

申请日：1997-11-11

申请人： Lawrence M. Burns ,  Nicholas Mitchell ,  Theresa Bradshaw ,  Chong Woo

发明人： Lawrence M. Burns ,  Nicholas Mitchell ,  Theresa Bradshaw ,  Chong Woo

IPC分类号： H05K1/02 ,  H05K1/11 ,  H05K3/34 ,  H01R9/09 ,  H01R23/68

CPC分类号： H05K1/0216 ,  H05K1/111 ,  H05K1/0231 ,  H05K1/0243 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/0969 ,  H05K2201/1006 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K3/3421 ,  Y02P70/611

摘要： Component mounting pads for multi-layer printed circuit boards encompass a smaller area than conventional pads, reducing parasitic capacitance between the pads and a ground plane layer. A number of such pads are arranged to accommodate standard surface-mount component sizes and packages. Further capacitance reductions are achieved by implementing mesh areas or apertures in the board's ground plane opposite the reduced-capacitance pads.

摘要翻译： 用于多层印刷电路板的组件安装垫包括比传统焊盘更小的面积，减小焊盘和接地平面层之间的寄生电容。 许多这样的垫布置成适应标准的表面贴装部件尺寸和包装。 通过在电路板的接地平面中与减小电容的焊盘相对地实现网格区域或孔径来实现进一步的电容减小。