公开(公告)号：US20120083230A1

公开(公告)日：2012-04-05

申请号：US13250082

申请日：2011-09-30

Applicant: Heung-No LEE ,  Junho LEE ,  Sangjun PARK

Inventor： Heung-No LEE ,  Junho LEE ,  Sangjun PARK

IPC: H04B1/06

CPC classification number: H04L25/03891 ,  H04J11/0046 ,  H04L1/06 ,  H04L2025/03426 ,  H04W52/0251 ,  H04W72/00 ,  H04W84/18 ,  Y02D70/00

Abstract: Disclosed is a multiple sensor system including a plurality of different sensor devices to acquire respective signals sensed from a single signal source, and a signal acquisition apparatus to recover an original signal generated from the signal source. The signal acquisition apparatus recovers the original signal by applying joint recovery, based on characteristics and correlations between the respective sensor devices, to compressive sensing signals independently compressively sensed and transmitted from the respective sensor devices. At this time, a sensing matrix F prearranged with the respective sensor devices and channel information C between the original signal and each sensor device are used for joint recovery.

Abstract translation: 公开了一种多传感器系统，包括多个不同的传感器装置，以获取从单个信号源感测的各个信号，以及信号采集装置，用于恢复从信号源产生的原始信号。 信号采集装置通过基于相应传感器装置之间的特性和相关性，将压缩感测信号独立地压缩感测并从相应的传感器装置发送来应用联合恢复来恢复原始信号。 此时，使用预先布置有各个传感器装置的感测矩阵F和原始信号与每个传感器装置之间的通道信息C用于联合恢复。

公开(公告)号：US20170077074A1

公开(公告)日：2017-03-16

申请号：US15240183

申请日：2016-08-18

Applicant: Hongbin SHI ,  Soonbum KIM ,  Junho LEE

Inventor： Hongbin SHI ,  Soonbum KIM ,  Junho LEE

IPC: H01L25/10 ,  H01L25/00

CPC classification number: H01L25/105 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/00012

Abstract: A method for manufacturing a semiconductor package including providing a first semiconductor package including a first package substrate and a first solder ball, the first package substrate having a first surface and a second surface opposite to the first surface, the first solder ball on the first surface, providing a second semiconductor package including a second package substrate and a second solder ball, the second package substrate having a third surface and a fourth surface opposite to the third surface, the second solder ball on the third surface, forming a depression in the first solder ball, applying flux to the first solder ball to fill the depression, aligning the first semiconductor package and the second semiconductor package with each other such that the second solder ball is inserted into the depression, and performing a reflow process to combine the first solder ball with the second solder ball may be provided.

Abstract translation: 一种制造半导体封装的方法，包括提供包括第一封装衬底和第一焊球的第一半导体封装，所述第一封装衬底具有第一表面和与所述第一表面相对的第二表面，所述第一焊球在所述第一表面上 提供包括第二封装衬底和第二焊球的第二半导体封装，所述第二封装衬底具有与所述第三表面相对的第三表面和第四表面，所述第三焊盘在所述第三表面上形成第一焊盘 焊球，将焊剂施加到第一焊球以填充凹陷，使第一半导体封装和第二半导体封装彼此对准，使得第二焊球插入凹陷中，并且执行回流工艺以组合第一焊料 可以提供具有第二焊球的球。