公开(公告)号：US11960268B2

公开(公告)日：2024-04-16

申请号：US17307430

申请日：2021-05-04

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Khai Chiah Chng ,  Mun Hoong Tai ,  Kum Cheong Adam Chan ,  Song Poh Chai

IPC: G05B19/4155 ,  G06F1/18 ,  G06F1/20 ,  G06F1/26 ,  H01L23/34 ,  H01L23/367 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20

CPC classification number: G05B19/4155 ,  G06F1/182 ,  G06F1/206 ,  G06F1/26 ,  H01L23/345 ,  H01L23/367 ,  H05K1/0203 ,  H05K1/181 ,  H05K7/2039 ,  G05B2219/49216 ,  H05K2201/066

Abstract: Examples discussed herein relate to managing power allocation for devices, such as network devices, with processing chip. In some examples, based on determining that a first temperature measurement of the processing chip does not satisfy an operating temperature threshold, the network device allocates power from a power source to a first heating element of the network device to heat the processing chip & allocates power from the power source to a second heating element of the network device to heat the processing chip. Based on determining that a second temperature measurement satisfies the operating temperature threshold, the network device allocates power from the power source to a set of power over ethernet ports of the network device & the first amount of power from the power source selectively to the first heating element to heat the processing chip.