Transparent conductive film and touch panel

    公开(公告)号:US09910545B2

    公开(公告)日:2018-03-06

    申请号:US12503395

    申请日:2009-07-15

    IPC分类号: G06F3/044 G02B5/22 B32B3/00

    CPC分类号: G06F3/044

    摘要: The transparent conductive film of the present invention is a transparent conductive film, comprising: a transparent film substrate; a patterned transparent conductive layer formed on one side of the transparent film substrate; and a colored layer provided on at least one of an opposite side of the transparent conductive layer from the transparent film substrate and an opposite side of the transparent film substrate from the transparent conductive layer, wherein the colored layer has an average absorptance of from 35% to 90% for light in the wavelength range of from 380 nm to 780 nm.

    Vacuum film formation method and laminate obtained by the method
    2.
    发明授权
    Vacuum film formation method and laminate obtained by the method 有权
    通过该方法获得真空成膜方法和层压体

    公开(公告)号:US09523147B2

    公开(公告)日:2016-12-20

    申请号:US13458640

    申请日:2012-04-27

    摘要: A method of continuously subjecting an elongated substrate to vacuum film formation is disclosed. The method comprises the steps of: feeding a first substrate from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the first substrate; forming a film of a second material on the first substrate, in a second film formation chamber; and rolling up the first substrate in the second roll chamber, thereby producing the first substrate, and comprises similar steps to produce a second substrate. In advance of producing the first substrate with the second material film, the first cathode electrode of the first film formation chamber is removed from the first film formation chamber, and, in advance of producing the second substrate with the first material film, the second cathode electrode of the second film formation chamber is removed from the second film formation chamber.

    摘要翻译: 公开了一种连续使细长衬底经受真空成膜的方法。 该方法包括以下步骤:将来自第一辊室的第一衬底沿第一方向从第一辊室向第二辊室供给; 对第一衬底进行脱气; 在第二成膜室中在第一基板上形成第二材料的膜; 并卷起第二辊室中的第一基板,从而制造第一基板,并且包括类似的步骤以产生第二基板。 在利用第二材料膜制造第一基板之前,第一成膜室的第一阴极电极从第一成膜室除去,并且在用第一材料膜制造第二基板之前,第二阴极 从第二成膜室除去第二成膜室的电极。

    Transparent conductive film and touch panel
    3.
    发明授权
    Transparent conductive film and touch panel 有权
    透明导电膜和触摸屏

    公开(公告)号:US09513747B2

    公开(公告)日:2016-12-06

    申请号:US13271625

    申请日:2011-10-12

    摘要: The present invention provides a transparent conductive film in which the difference in visibility between the pattern portion and the pattern opening portion is kept small even when a transparent conductive layer is patterned. The transparent conductive film has a first dielectric layer, a second dielectric layer, and a transparent conductive layer in this order on a transparent film substrate, a thickness d21 of the first dielectric layer is larger than a thickness d22 of the second dielectric layer, the thickness d21 of the first dielectric layer is 8 to 40 nm and the thickness d22 of the second dielectric layer is 5 to 25 nm, and a difference between the thickness d21 of the first dielectric layer and the thickness d22 of the second dielectric layer, d21-d22, is 3 to 30 nm.

    摘要翻译: 本发明提供了一种透明导电膜,其中即使在透明导电层被图案化时,图案部分和图案开口部分之间的可见性差也保持较小。 透明导电膜在透明膜基板上依次具有第一电介质层,第二电介质层和透明导电层,第一电介质层的厚度d21大于第二电介质层的厚度d22, 第一电介质层的厚度d21为8〜40nm,第二电介质层的厚度d22为5〜25nm,第一电介质层的厚度d21与第二电介质层的厚度d22之差d21 -d22,为3〜30nm。

    Method for double-side vacuum film formation and laminate obtainable by the method
    4.
    发明授权
    Method for double-side vacuum film formation and laminate obtainable by the method 有权
    双面真空成膜方法和通过该方法得到的层压体

    公开(公告)号:US09297066B2

    公开(公告)日:2016-03-29

    申请号:US13559041

    申请日:2012-07-26

    IPC分类号: C23C14/56 C23C14/02

    摘要: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the fed substrate; forming a first material film on the first surface of the degassed substrate in a first film formation chamber; forming a second material film on the first material film in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the material films formed thereon; unrolling and feeding the taken up substrate from the first roll chamber in the direction, using a second surface opposite the first surface of the substrate as a surface for film formation; and repeating all the above treatments.

    摘要翻译: 成膜方法包括以下步骤:使用第一表面作为成膜表面,从第一辊室向第一辊室向第二辊室展开卷绕并卷绕成辊状的细长基材; 对进料基材进行脱气; 在第一成膜室中在脱气基板的第一表面上形成第一材料膜; 在第二成膜室中在第一材料膜上形成第二材料膜; 在第二辊室中以辊状卷取基板,其中形成有材料膜的基板; 使用与基板的第一表面相对的第二表面作为成膜的表面,使卷取的基板从第一辊室沿着该方向展开和进给; 并重复所有上述处理。

    Method for double-side vacuum film formation and laminate obtainable by the method
    5.
    发明授权
    Method for double-side vacuum film formation and laminate obtainable by the method 有权
    双面真空成膜方法和通过该方法得到的层压体

    公开(公告)号:US09249503B2

    公开(公告)日:2016-02-02

    申请号:US13559094

    申请日:2012-07-26

    IPC分类号: C23C14/56

    CPC分类号: C23C14/562 Y10T428/31678

    摘要: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber, using a first surface as a surface for film formation; degassing the substrate fed in the first direction; forming a second material film on the first surface of the substrate in a second film formation chamber; taking up the substrate in a roll form in the second roll chamber, the substrate having the second material film formed thereon; unrolling and feeding the substrate from the second roll chamber in a second direction from the second roll chamber toward the first roll chamber; forming a first material film on the second material film in a first film formation chamber; taking up the substrate in a roll form in the first roll chamber.

    摘要翻译: 成膜方法包括以下步骤:使用第一表面作为成膜表面,从第一辊室向第二辊室,以第一方向从第一辊室开始卷绕并卷绕成卷状的细长衬底 ; 对沿第一方向进给的基板进行脱气; 在第二成膜室中在所述基板的第一表面上形成第二材料膜; 在第二辊室中以辊状卷取基板,其上形成有第二材料膜的基板; 从第二辊室朝向第一辊室从第二辊室向第二方向展开和供给衬底; 在第一成膜室中在第二材料膜上形成第一材料膜; 在第一辊室中以辊状卷取基材。

    Method for double-side vacuum film formation and laminate obtainable by the method
    6.
    发明授权
    Method for double-side vacuum film formation and laminate obtainable by the method 有权
    双面真空成膜方法和通过该方法得到的层压体

    公开(公告)号:US09243320B2

    公开(公告)日:2016-01-26

    申请号:US13559155

    申请日:2012-07-26

    IPC分类号: C23C14/56

    CPC分类号: C23C14/562 Y10T428/31678

    摘要: The film formation method comprises the steps of: unrolling and feeding an elongated substrate wound in a roll form from a first roll chamber in a first direction from the first roll chamber toward a second roll chamber; degassing the fed substrate; forming a first material film on a first surface in a first film formation chamber; guiding the substrate having the first material film formed thereon to a second film formation chamber in a second direction from the second roll chamber toward the first roll chamber; forming, in the second film formation chamber, a second material film on a second surface opposite the first surface of the substrate when it is being guided in the second direction; taking up, in a third roll chamber provided between the first roll chamber and the second roll chamber, the substrate in a roll state.

    摘要翻译: 成膜方法包括以下步骤:从第一方向从第一辊室向第二辊室展开卷绕并卷绕成卷状的细长基材从第一辊室; 对进料基材进行脱气; 在第一成膜室中的第一表面上形成第一材料膜; 将其上形成有第一材料膜的基板从第二辊室朝向第一辊室沿第二方向引导到第二成膜室; 在所述第二成膜室中,当在所述第二方向上被引导时,在与所述基板的所述第一表面相对的第二表面上形成第二材料膜; 在设置在第一辊室和第二辊室之间的第三辊室中卷绕处于辊状态的基板。

    Transparent conductive laminate and touch panel equipped with it
    9.
    发明授权
    Transparent conductive laminate and touch panel equipped with it 有权
    透明导电层压板和触摸面板配备

    公开(公告)号:US08048512B2

    公开(公告)日:2011-11-01

    申请号:US12376014

    申请日:2007-06-07

    IPC分类号: B32B7/02

    摘要: The transparent conductive laminate of the present invention is a transparent conductive laminate, comprising: a transparent film substrate; a transparent conductive thin film provided on one side of the transparent film substrate with a dielectric thin film interposed therebetween; and a transparent substrate bonded to another side of the transparent film substrate with a transparent pressure-sensitive adhesive layer interposed therebetween, wherein the transparent substrate comprises at least two transparent base films laminated with the transparent pressure-sensitive adhesive layer interposed therebetween, and the dielectric thin film comprises a first transparent dielectric thin film consisting of a SiOx (x is from 1.5 to less than 2) film having a relative refractive index of 1.6 to 1.9, and a second transparent dielectric thin film consisting of a SiO2 film. This feature can improve the surface contact pressure durability.

    摘要翻译: 本发明的透明导电性层叠体是透明导电性层叠体,其包含:透明膜基板; 透明导电薄膜,其设置在介于其间的介电薄膜的透明薄膜基片一侧; 以及透明基板,其中透明粘合剂层与透明膜基材的另一侧粘合,其中所述透明基板包括至少两个层压有透明压敏粘合剂层的透明基膜和介电层 薄膜包括由相对折射率为1.6至1.9的SiOx(x为1.5至小于2)的膜构成的第一透明电介质薄膜和由SiO 2膜组成的第二透明电介质薄膜。 此功能可以提高表面接触压力的耐久性。

    TRANSPARENT CONDUCTIVE FILM AND TOUCH PANEL
    10.
    发明申请
    TRANSPARENT CONDUCTIVE FILM AND TOUCH PANEL 有权
    透明导电膜和触控面板

    公开(公告)号:US20100015417A1

    公开(公告)日:2010-01-21

    申请号:US12502288

    申请日:2009-07-14

    IPC分类号: B32B3/10

    摘要: The transparent conductive film of the present invention is a transparent conductive film, comprising a transparent film substrate, and a first transparent dielectric layer, a second transparent dielectric layer and a patterned transparent conductive layer that are formed on one or both sides of the transparent film substrate in this order from the transparent film substrate side, wherein the transparent conductive layer has a thickness of 31 nm or more, the first transparent dielectric layer has a thickness of from 7 nm to 16 nm, the second transparent dielectric layer has a thickness of from 30 nm to 60 nm, and the relation n2

    摘要翻译: 本发明的透明导电膜是透明导电膜,其包括透明膜基板,形成在透明膜的一面或两面上的第一透明介电层,第二透明电介质层和图案化的透明导电层 从透明膜基板一侧依次形成基板,其中透明导电层的厚度为31nm以上,第一透明电介质层的厚度为7nm〜16nm,第二透明电介质层的厚度为 满足n2