公开(公告)号：US08043953B2

公开(公告)日：2011-10-25

申请号：US12521936

申请日：2008-01-15

申请人： Hideya Murai ,  Yuji Kayashima ,  Takehiko Maeda ,  Shintaro Yamamichi ,  Takuo Funaya

发明人： Hideya Murai ,  Yuji Kayashima ,  Takehiko Maeda ,  Shintaro Yamamichi ,  Takuo Funaya

IPC分类号： H01L21/44 ,  H01L21/4763

CPC分类号： H01L24/19 ,  B23K26/389 ,  H01L21/76802 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor device that can be readily manufactured, can include a large number of pads, and can be thin, and a method for manufacturing the same are provided. The semiconductor device is characterized in that the semiconductor device includes an LSI chip, an insulating layer provided on the LSI chip and made of a nonphotosensitive resin, the insulating layer including a via hole in the position corresponding to an externally connected pad, and a wiring layer extending along the insulating layer through the via hole to the externally connected pad, and at least part of the via hole is formed by irradiating the insulating layer with laser light.

摘要翻译： 可以容易地制造的半导体器件可以包括大量的焊盘，并且可以是薄的，并且提供其制造方法。 半导体器件的特征在于，半导体器件包括LSI芯片，设置在LSI芯片上并由非感光树脂制成的绝缘层，所述绝缘层包括在与外部连接的焊盘相对应的位置中的通孔，以及布线 所述层通过所述通孔延伸到所述外部连接的焊盘，并且所述通孔的至少一部分通过用激光照射所述绝缘层而形成。

公开(公告)号：US20090294951A1

公开(公告)日：2009-12-03

申请号：US12521936

申请日：2008-01-15

申请人： Hideya Murai ,  Yuji Kayashima ,  Takehiko Maeda ,  Shintaro Yamamichi ,  Takuo Funaya

发明人： Hideya Murai ,  Yuji Kayashima ,  Takehiko Maeda ,  Shintaro Yamamichi ,  Takuo Funaya

IPC分类号： H01L23/48 ,  H01L21/768

CPC分类号： H01L24/19 ,  B23K26/389 ,  H01L21/76802 ,  H01L23/5389 ,  H01L24/24 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H01L2924/00014

摘要： A semiconductor device that can be readily manufactured, can include a large number of pads, and can be thin, and a method for manufacturing the same are provided. The semiconductor device is characterized in that the semiconductor device includes an LSI chip, an insulating layer provided on the LSI chip and made of a nonphotosensitive resin, the insulating layer including a via hole in the position corresponding to an externally connected pad, and a wiring layer extending along the insulating layer through the via hole to the externally connected pad, and at least part of the via hole is formed by irradiating the insulating layer with laser light.

摘要翻译： 可以容易地制造的半导体器件可以包括大量的焊盘，并且可以是薄的，并且提供其制造方法。 半导体器件的特征在于，半导体器件包括LSI芯片，设置在LSI芯片上并由非感光树脂制成的绝缘层，所述绝缘层包括在与外部连接的焊盘相对应的位置中的通孔，以及布线 所述层通过所述通孔延伸到所述外部连接的焊盘，并且所述通孔的至少一部分通过用激光照射所述绝缘层而形成。

公开(公告)号：US06414336B2

公开(公告)日：2002-07-02

申请号：US09902259

申请日：2001-07-11

申请人： Yuji Kayashima

发明人： Yuji Kayashima

IPC分类号： H01L2348

CPC分类号： H01L22/32 ,  H01L22/20 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2924/13091 ,  H01L2924/00

摘要： In a method for manufacturing a semiconductor device, probe pads are formed simultaneously with formation of an intermediate conductive layer, and a test operation is performed upon the semiconductor device by placing probes on the probe pads. Then, post-stage processes are performed upon the semiconductor device in accordance with characteristics of the semiconductor device obtained by the test operation.

摘要翻译： 在制造半导体器件的方法中，在形成中间导电层的同时形成探针焊盘，并且通过在探针焊盘上放置探针来对半导体器件进行测试操作。 然后，根据通过测试操作获得的半导体器件的特性，在半导体器件上进行后期处理。

公开(公告)号：US06309898B1

公开(公告)日：2001-10-30

申请号：US09619762

申请日：2000-07-19

申请人： Yuji Kayashima

发明人： Yuji Kayashima

IPC分类号： H01L2166

CPC分类号： H01L22/32 ,  H01L22/20 ,  H01L2224/02166 ,  H01L2224/05553 ,  H01L2924/13091 ,  H01L2924/00

摘要： In a method for manufacturing a semiconductor device, probe pads are formed simultaneously with formation of an intermediate conductive layer, and a test operation is performed upon the semiconductor device by placing probes on the probe pads. Then, post-stage processes are performed upon the semiconductor device in accordance with characteristics of the semiconductor device obtained by the test operation.

摘要翻译： 在制造半导体器件的方法中，在形成中间导电层的同时形成探针焊盘，并且通过在探针焊盘上放置探针来对半导体器件进行测试操作。 然后，根据通过测试操作获得的半导体器件的特性，在半导体器件上进行后期处理。