Sticking method and sticking apparatus
    4.
    发明授权
    Sticking method and sticking apparatus 失效
    粘贴方法和粘贴装置

    公开(公告)号:US08298365B2

    公开(公告)日:2012-10-30

    申请号:US12796872

    申请日:2010-06-09

    IPC分类号: B32B38/10 B32B37/12

    摘要: A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.

    摘要翻译: 提供了一种用于将支撑板粘贴到基板上以使得能够快速且容易地移除支撑板的方式的粘贴方法。 根据本发明的粘贴方法包括通过设置在晶片2上的第一粘合层4,设置在第一粘合剂层4上的分离膜5和第二粘合剂层将支撑板3粘贴到晶片2上的步骤 6,设置在分离膜层5上,或者溶解在比第一粘合剂层4溶解的溶解速度高的溶剂中,或溶解在与第一粘合层4溶解的溶剂不同的溶剂中。

    STICKING METHOD AND STICKING APPARATUS
    6.
    发明申请
    STICKING METHOD AND STICKING APPARATUS 失效
    手提方法和手提装置

    公开(公告)号:US20100314043A1

    公开(公告)日:2010-12-16

    申请号:US12796872

    申请日:2010-06-09

    IPC分类号: B32B37/12

    摘要: A sticking method for sticking a support plate onto a substrate in such a way that the support plate can be removed in quickly and easily is provided. The sticking method according to the present invention includes the step of sticking a support plate 3 onto a wafer 2 via a first adhesive layer 4 provided on the wafer 2, a separate film 5 provided on the first adhesive layer 4, and a second adhesive layer 6, provided on the separation film layer 5, which either is higher in rate of dissolution in a solution than the first adhesive layer 4 or dissolves in a solvent different from the solvent in which the first adhesive layer 4 dissolves.

    摘要翻译: 提供了一种用于将支撑板粘贴到基板上以使得能够快速且容易地移除支撑板的方式的粘贴方法。 根据本发明的粘贴方法包括通过设置在晶片2上的第一粘合层4,设置在第一粘合剂层4上的分离膜5和第二粘合剂层将支撑板3粘贴到晶片2上的步骤 6,设置在分离膜层5上,或者溶解在比第一粘合剂层4溶解的溶解速度高的溶剂中,或溶解在与第一粘合层4溶解的溶剂不同的溶剂中。