Laminated conformal seal for electroluminescent displays
    5.
    发明授权
    Laminated conformal seal for electroluminescent displays 有权
    用于电致发光显示器的层压共形密封

    公开(公告)号:US08193705B2

    公开(公告)日:2012-06-05

    申请号:US11554901

    申请日:2006-10-31

    IPC分类号: H05B33/04

    CPC分类号: H05B33/04

    摘要: The present invention is an electroluminescent display that incorporates a laminated seal that inhibits exposure of display components to atmospheric contaminants and to a sealing process for fabrication of the same. The sealed electroluminescent display comprises a substrate upon which is constructed a thick dielectric electroluminescent display covered by a laminated seal comprising a lower multi-functional polymer film and an upper inorganic film that provides a barrier layer to inhibit exposure of the electroluminescent display structure to an atmospheric contaminant.

    摘要翻译: 本发明是一种电致发光显示器,其包含抑制显示组件暴露于大气污染物的层压密封件及其制造的密封工艺。 密封电致发光显示器包括基底,其上构成了由层叠密封件覆盖的厚电介质电致发光显示器,该层叠密封件包括下部多功能聚合物膜和上部无机膜,其提供阻挡层以抑制电致发光显示结构暴露于大气 污染物。

    Aluminum oxide and aluminum oxynitride layers for use with phosphors for electroluminescent displays
    6.
    发明授权
    Aluminum oxide and aluminum oxynitride layers for use with phosphors for electroluminescent displays 有权
    用于电致发光显示器的荧光体的氧化铝和氮氧化铝层

    公开(公告)号:US07812522B2

    公开(公告)日:2010-10-12

    申请号:US11184457

    申请日:2005-07-19

    IPC分类号: H01J1/62

    摘要: A novel laminate is provided to improve the operating stability of thioaluminate based phosphors used in ac thick film dielectric electroluminescent displays. The novel structure comprises a rare earth activated alkaline earth thioaluminate phosphor thin film layer and an aluminum oxide or aluminum oxynitride layer provided directly adjacent and in contact with the bottom of the phosphor thin film layer. The invention is particularly applicable to phosphors used in electroluminescent displays that employ thick dielectric layers subject to high processing temperatures to form and activate the phosphor films.

    摘要翻译: 提供了一种新颖的层压材料,以改善在ac厚膜电介质电致发光显示器中使用的硫铝酸盐基磷光体的操作稳定性。 该新型结构包括稀土活化的碱土金属硫铝酸盐荧光体薄膜层和直接邻近并与荧光体薄膜层的底部接触的氧化铝或氮氧化铝层。 本发明特别适用于采用在高处理温度下形成和激活荧光膜的厚电介质层的电致发光显示器中使用的荧光体。

    Chip antenna and method of manufacturing the same
    9.
    发明授权
    Chip antenna and method of manufacturing the same 失效
    芯片天线及其制造方法

    公开(公告)号:US06724347B2

    公开(公告)日:2004-04-20

    申请号:US10178328

    申请日:2002-06-20

    IPC分类号: H01Q138

    摘要: Of margins of a resin molding with an antenna element buried therein which lie around the antenna element, a margin on that side of the resin molding where a gate mark remains is made larger than margins on other sides where there is no gate mark. Particularly, when the antenna element has a line antenna portion and a capacitance-adding portion provided at a distal end of the line antenna portion, the resin molding is injection-molded in such a way that a gate mark can be formed on that side where the capacitance-adding portion is located. Those portions of the resin molding where the terminal portions are led out are dented from levels of portions around those portions. This provides a chip antenna which has a simple structure with a high mechanical strength and does not prevent separation or cracking from occurring in the resin molding in which the antenna element is buried and a method of manufacturing the chip antenna.

    摘要翻译: 在埋设在天线元件周围的天线元件的树脂模制品的边缘处,留下栅极标记的树脂模制品侧的边缘大于没有栅极标记的另一侧的边缘。 特别地,当天线元件具有线天线部分和设置在线天线部分的远端处的电容增加部分时,树脂模制件以这样的方式被注射成型,即可以在那一侧形成栅极标记 电容添加部分被定位。 端子部分被引出的树脂模塑件的那些部分由这些部分周围的部分的凹陷凹陷。 这提供了具有机械强度高的简单结构的芯片天线,并且不防止在埋设天线元件的树脂模制件中发生分离或破裂以及制造芯片天线的方法。

    Antenna device
    10.
    发明授权

    公开(公告)号:US06642907B2

    公开(公告)日:2003-11-04

    申请号:US10044069

    申请日:2002-01-09

    IPC分类号: H01Q138

    摘要: An antenna device includes a dielectric chip fitted to an aperture formed in an exterior casing of a terminal unit and having an outer surface thereof cooperating with an outer surface to form part of an outer surface of the terminal unit, and an antenna conductor embedded into the dielectric chip and disposed at a vertical position sufficiently far from a grounding conductor of a printed circuit board in the exterior casing.