摘要:
A flexural vibration piece includes a base, and a vibrating arms extending therefrom, each pair of vibrating arms has a first groove formed in the extension direction of the vibrating arm in one main surface following the direction in which the pair of vibrating arms are aligned, and a second groove formed side by side to the first groove in another main surface, the sum of the depths of the first and second groove portions is greater than the interval between the one main surface and the other main surface, and a mass portion is provided on each of the pair of vibrating arms, on the one main surface which is the opening side of the first grooves formed toward the outer sides opposite the inner sides on which the vibrating arms face each other.
摘要:
A flexural vibration piece including a vibrator having a first region on which a compressive stress or a tensile stress acts and a second region on which a tensile stress acts when a compressive stress acts on the first region and a compressive stress acts when a tensile stress acts on the first region, and performs flexural vibration in a first plane; and a heat conduction path formed of a material having a thermal conductivity higher than the vibrator and that thermally connects the regions, wherein when m is the number of heat conduction paths, ρth is the thermal resistivity of the heat conduction path, ρv is the thermal resistivity of the vibrator, tv is the thickness of the vibrator in a direction orthogonal to the first plane, and tth is the thickness of the heat conduction path, a relationship of tth≧(1/m)×tv×(ρth/ρv) is satisfied.
摘要:
A flexural vibration piece includes a flexural vibrator that has a first region on which a compressive stress or a tensile stress acts due to vibration and a second region having a relationship in which a tensile stress acts thereon when a compressive stress acts on the first region and a compressive stress acts thereon when a tensile stress acts on the first region, and performs flexural vibration in a first plane. The flexural vibration piece also includes a heat conduction path, in the vicinity of the first region and the second region, that is formed of a material having a thermal conductivity higher than that of the flexural vibrator and thermally connects between the first region and the second region.
摘要:
A flexural vibration piece includes a flexural vibrator that has a first region on which a compressive stress or a tensile stress acts due to vibration and a second region having a relationship in which a tensile stress acts thereon when a compressive stress acts on the first region and a compressive stress acts thereon when a tensile stress acts on the first region, and performs flexural vibration in a first plane. The flexural vibration piece also includes a heat conduction path, in the vicinity of the first region and the second region, that is formed of a material having a thermal conductivity higher than that of the flexural vibrator and thermally connects between the first region and the second region.
摘要:
A resonator element includes: a base portion; and a resonating arm extending in a first direction from the base portion, wherein the resonating arm includes a first surface, a second surface facing the first surface, a first side surface extending in the first direction so as to connect the first and second surfaces, and a second side surface facing the first side surface, wherein the resonating arm includes a first width portion having a first width and a second width portion provided at a root of the resonating arm so as to have a second width larger than the first width, wherein the resonating arm includes a groove portion provided on at least one of the first and second surfaces so as to extend in the first direction, the groove portion in the second width portion having a width larger than a width of the groove portion in the first width portion, and wherein a sum of the width between the groove portion in the second width portion and the first side surface and the width between the groove portion in the second width portion and the second side surface is smaller than a sum of the width between the groove portion in the first width portion and the first side surface and the width between the groove portion in the first width portion and the second side surface.
摘要:
A tuning fork oscillating piece includes: a base; a pair of oscillating arms extending from the base in directions substantially parallel with each other; a drive piezoelectric element provided at least on one main surface or side surface of each of the oscillating arms to allow bending oscillation of the oscillating arms by piezoelectric distortion caused by applied charge; a detection piezoelectric element provided on the surface opposed to the surface of each of the oscillating arms on which the drive piezoelectric element is provided to convert the piezoelectric distortion caused by the bending oscillation of the oscillating arms into charge and output the charge. The drive piezoelectric element has a drive piezoelectric section. The detection piezoelectric element has a detection piezoelectric section. The absolute value of the piezoelectric d constant of the drive piezoelectric section is larger than the absolute value of the piezoelectric d constant of the detection piezoelectric section. The absolute value of the piezoelectric g constant of the detection piezoelectric section is larger than the absolute value of the piezoelectric g constant of the drive piezoelectric section.
摘要:
A rectangular vibrating plate 10 in which a piezoelectric element and a reinforcing plate are stacked is supported on a main plate by a support member 11, and is urged toward the rotor 100 by an elastic force of the support member 11. This brings a projection 36 provided on the vibrating plate 10 into abutment with an outer peripheral surface of the rotor 100. In this construction, when the vibrating plate 10 vibrates in the horizontal direction in the figure by an applied voltage from a driving circuit (not shown), the rotor 100 is rotated in a clockwise direction in accordance with the displacement of the projection 36 due to the vibration.
摘要:
Deterioration of the Q value caused by the thermoelastic effect is suppressed. Since a first depth of a first groove and a second depth of a second groove are smaller than a distance between a surface including a third surface and a surface including a fourth surface, the first and second grooves do not penetrate between the surface including the third surface and the surface including the fourth surface. In addition, the sum of the first depth of the first groove and the second depth of the second groove is greater than the distance between the third and fourth surfaces, a heat transfer path between a first expandable portion (the first surface) and a second expandable portion (the second surface) cannot be formed as a straight line. As such, the heat transfer path between the first expandable portion (the first surface) and a second expandable portion (the second surface) is made to detour to the first and second grooves and and thus be lengthened.
摘要:
A resonator having a base part; and a resonating arm that performs flexing vibration, the resonating arm part has two principal surfaces, a first groove provided on one principal surface, a second groove provided in juxtaposition with the first groove on the other principal surface, a third groove provided in juxtaposition with the first groove and provided nearer the base part side than the first groove on the other principal surface, and a fourth groove provided in juxtaposition with the second groove and provided nearer the base part side than the second groove on the principal surface. The sum of a depth of the first and second groove part and a sum of a depth of the third and fourth groove part are larger than a distance between the one principal surface and the other principal surface.
摘要:
A surface acoustic wave (SAW) device includes at least an IC region and a SAW element region. A semiconductor element layer and wiring layer is located in the IC region, and the semiconductor element layer has a semiconductor element and an element insulating film. The wiring layer is formed by stacking wiring to connect with the semiconductor element and a wiring insulating film extending to the SAW region. The semiconductor element layer further includes a piezoelectric thin film formed above the wiring insulating film, and in the SAW element region, a SAW element is formed on the piezoelectric thin film equipped with an IDT electrode provided with a plurality of electrode fingers, and at least one layer of layer thickness adjusting films having linear shapes and arranged in parallel to and with the same pitch as the electrode fingers of the IDT electrode.