Process for producing thin films
    1.
    发明授权
    Process for producing thin films 失效
    薄膜生产工艺

    公开(公告)号:US5203974A

    公开(公告)日:1993-04-20

    申请号:US826905

    申请日:1992-01-24

    IPC分类号: G03G5/05

    CPC分类号: G03G5/0525 Y10S516/02

    摘要: A process for producing a thin film comprising electrotreating a dispersion or solution obtained by dispersing or dissolving a hydrophobic substance powder in an aqueous medium with a surfactant having a HLB value of 10.0 to 20.0, under conditions for forming a thin film of the hydrophobic substance on a cathode. The thin film of a hydrophobic substance can be formed on base metals such as aluminum, which can be applied to photosensitive materials and the like.

    摘要翻译: 一种薄膜的制造方法,其特征在于,在形成所述疏水性物质的薄膜的条件下,通过将疏水性物质粉末分散或溶解在含有HLB值为10.0〜20.0的表面活性剂的水性介质中而获得的分散液 一个阴极。 疏水物质的薄膜可以形成在诸如铝的基底金属上,其可以应用于感光材料等。

    Multilayer substrate
    4.
    发明授权
    Multilayer substrate 有权
    多层基板

    公开(公告)号:US08735732B2

    公开(公告)日:2014-05-27

    申请号:US13331306

    申请日:2011-12-20

    IPC分类号: H05K1/16 H05K1/03

    摘要: A multilayer substrate is configured by stacking conductive layers and insulation layers. The multilayer substrate includes a core that is one of the conductive layers and is thicker than any of other conductive layers, and a first signal line that is included in the conductive layers and is adjacent to the core so that a first insulation layer that is one of the insulation layers is interposed between the core and the first signal line, the first signal line being used for transmission of an RF signal. The core has a recess portion so as to face the first signal line.

    摘要翻译: 通过堆叠导电层和绝缘层来构成多层基板。 多层基板包括作为导电层之一并且比任何其它导电层更厚的芯以及包含在导电层中并且与芯相邻并且与第一绝缘层为一体的第一信号线 的绝缘层插入在芯和第一信号线之间,第一信号线用于发射RF信号。 芯部具有面向第一信号线的凹部。

    High-frequency circuit module
    5.
    发明授权
    High-frequency circuit module 有权
    高频电路模块

    公开(公告)号:US08483104B1

    公开(公告)日:2013-07-09

    申请号:US13589578

    申请日:2012-08-20

    IPC分类号: H04B1/56 H04B7/005 H04B1/44

    摘要: Provided is a high-frequency module that can prevent a transmission signal from reaching a reception circuit and that can achieve high mounting density. A first duplexer 110 for a first frequency band is mounted on a circuit substrate 200, and a second transmission filter 122 and a second reception filter 124 that constitute a second duplexer 120 for a second frequency band are embedded in the circuit substrate 200. The second transmission filter 122 and the second reception filter 124 are embedded in the circuit substrate in locations that overlap at least a part of a projection region that is formed by projecting the first duplexer 110 in a thickness direction of the circuit substrate. The first frequency band and the second frequency band are separated from each other by at least a prescribed frequency range.

    摘要翻译: 提供了可以防止发送信号到达接收电路并且可以实现高安装密度的高频模块。 用于第一频带的第一双工器110安装在电路基板200上,并且构成用于第二频带的第二双工器120的第二传输滤波器122和第二接收滤波器124嵌入在电路基板200中。第二 传输滤波器122和第二接收滤波器124在电路基板的厚度方向上突出形成突起区域的至少一部分的位置嵌入电路基板。 第一频带和第二频带彼此分开至少规定的频率范围。

    Composite plating method
    6.
    发明授权

    公开(公告)号:US06635166B2

    公开(公告)日:2003-10-21

    申请号:US09959722

    申请日:2001-12-04

    IPC分类号: C25D1500

    CPC分类号: C25D15/02

    摘要: Inorganic or organic fine particles which are insoluble to water are added to a metal plating bath, by dispersing the fine particles in a watery medium by the help of an azo-surfactant having an aromatic azo compound residue. Electrolysis is then carried out. According to the present invention, the content of the fine particles present in a composite plating film composed of the fine particles and a metal can be increased.

    High frequency electronic component
    7.
    发明授权
    High frequency electronic component 有权
    高频电子元器件

    公开(公告)号:US09041485B2

    公开(公告)日:2015-05-26

    申请号:US13599667

    申请日:2012-08-30

    申请人: Tetsuo Saji

    发明人: Tetsuo Saji

    IPC分类号: H03H7/46

    CPC分类号: H04B1/525

    摘要: An electronic component includes: a first circuit connected to a first common terminal for inputting/outputting a first signal set, a second common terminal for inputting/outputting a second signal set having a frequency higher than the first signal set, and a third common terminal for being connected to an antenna; and a second circuit connected in parallel to the first circuit between the first and second common terminals, wherein the first circuit includes a first filter transmitting the first signal set and reflecting the second signal set, and a second filter transmitting the second signal set and reflecting the first signal set, the third common terminal is located between the first and second filters, and the second circuit reflects a first transmission signal and a second transmission signal, transmits parts of the first and second transmission signals, and inverts phases of the parts of the first and second transmission signals.

    摘要翻译: 电子部件包括:连接到第一公共端子的第一电路,用于输入/输出第一信号组;第二公共端子,用于输入/输出具有高于第一信号组的频率的第二信号组;以及第三公共端 用于连接到天线; 以及与所述第一和第二公共端子之间的第一电路并联连接的第二电路,其中所述第一电路包括传输所述第一信号组并反射所述第二信号集的第一滤波器,以及传输所述第二信号组并反射的第二滤波器 第一信号组,第三公共端子位于第一和第二滤波器之间,并且第二电路反映第一传输信号和第二传输信号,传输第一和第二传输信号的部分,并将部分的相位反相 第一和第二传输信号。

    Substrate with built-in electronic component
    8.
    发明授权
    Substrate with built-in electronic component 有权
    基板内置电子元器件

    公开(公告)号:US08536959B1

    公开(公告)日:2013-09-17

    申请号:US13589531

    申请日:2012-08-20

    IPC分类号: H03H9/00 H01L41/00

    摘要: Provided is a substrate with a built-in electronic component that can minimize occurrence of functional anomaly, damage, or the like in a filter function section of an elastic wave filter that is caused by a deformation of a hollow cover of the elastic wave filter that is built into the substrate. The substrate with a built-in electronic component includes: an SAW filter built into a substrate, a filter function section of the SAW filter being covered by a hollow cover; and a stress absorbing layer that faces the hollow cover of the SAW filter through an insulating layer in the substrate.

    摘要翻译: 本发明提供一种具有内置电子部件的基板,其能够使由弹性波滤波器的中空盖的变形引起的弹性波滤波器的滤波器功能部中的功能异常,损伤等的发生最小化, 内置于基材中。 具有内置电子部件的基板包括:内置于基板的SAW滤波器,SAW滤波器的滤波器功能部分被中空盖覆盖; 以及通过基板中的绝缘层面向SAW滤波器的中空盖的应力吸收层。