公开(公告)号：US20090240017A1

公开(公告)日：2009-09-24

申请号：US12475849

申请日：2009-06-01

申请人： Hiroshi MATSUTANI ,  Makoto KAJI ,  Koichi ABE ,  Yuko UCHIMARU

发明人： Hiroshi MATSUTANI ,  Makoto KAJI ,  Koichi ABE ,  Yuko UCHIMARU

IPC分类号： C08G79/08

CPC分类号： H01L21/02118 ,  C08G79/08 ,  H01L21/02126 ,  H01L21/022 ,  H01L21/02282 ,  H01L21/3121 ,  H01L21/76801 ,  Y10T428/31504 ,  Y10T428/31663

摘要： Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10−8 A/cm2.

摘要翻译： 设置在存储电容器单元8中的层间绝缘膜5,7（绝缘膜）形成在形成在硅晶片1上的栅电极3和对电极8C之间。层间绝缘膜5,7包括环硼氮烷基树脂， 具有不大于2.6的比介电常数，5GPa或更大的杨氏模量和不大于1×10 -8 A / cm 2的泄漏电流。

公开(公告)号：US20110313122A1

公开(公告)日：2011-12-22

申请号：US13219342

申请日：2011-08-26

申请人： Hiroshi MATSUTANI ,  Makoto Kaji ,  Koichi Abe ,  Yuko Uchimaru

发明人： Hiroshi MATSUTANI ,  Makoto Kaji ,  Koichi Abe ,  Yuko Uchimaru

IPC分类号： C08G79/08 ,  C07F7/21

CPC分类号： H01L21/02118 ,  C08G79/08 ,  H01L21/02126 ,  H01L21/022 ,  H01L21/02282 ,  H01L21/3121 ,  H01L21/76801 ,  Y10T428/31504 ,  Y10T428/31663

摘要： Interlayer insulating films 5,7 (insulating films) provided in a memory capacitor cell 8 are formed between a gate electrode 3 and a counter electrode 8C formed on a silicon wafer 1. The interlayer insulating films 5,7 comprise a borazine-based resin, having a specific dielectric constant of no greater than 2.6, a Young's modulus of 5 GPa or greater and a leak current of no greater than 1×10−8 A/cm2.

摘要翻译： 设置在存储电容器单元8中的层间绝缘膜5,7（绝缘膜）形成在形成在硅晶片1上的栅电极3和对电极8C之间。层间绝缘膜5,7包括环硼氮烷基树脂， 具有不大于2.6的比介电常数，5GPa或更大的杨氏模量和不大于1×10 -8 A / cm 2的漏电流。

公开(公告)号：US20080051550A1

公开(公告)日：2008-02-28

申请号：US11779181

申请日：2007-07-17

申请人： Haruaki SUE ,  Takashi KUMAKI ,  Hideyasu TSUIKI ,  Hiroshi MATSUTANI ,  Toshihiko TAKASAKI ,  Iwao FUKUCHI

发明人： Haruaki SUE ,  Takashi KUMAKI ,  Hideyasu TSUIKI ,  Hiroshi MATSUTANI ,  Toshihiko TAKASAKI ,  Iwao FUKUCHI

IPC分类号： C08G65/38

CPC分类号： C07C323/29 ,  C07C323/16 ,  C07C323/20 ,  C07C323/56 ,  C07C323/66 ,  C08G59/06

摘要： The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—  (1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.

摘要翻译： 本发明公开了一种含硫酚醛树脂，其包含由下式（1）表示的有机基团：<？in-line-formula description =“In-line formula”end =“lead”→> -R