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1.CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE 审中-公开
标题翻译: 化学机械抛光方法及制造半导体器件的方法公开(公告)号:US20070128874A1
公开(公告)日:2007-06-07
申请号:US11563414
申请日:2006-11-27
申请人: Hirotaka SHIDA , Yukiteru MATSUI , Atsushi SHIGETA , Shinichi HIRASAWA , Hirokazu KATO , Masako KINOSHITA , Takeshi NISHIOKA , Hiroyuki YANO
发明人: Hirotaka SHIDA , Yukiteru MATSUI , Atsushi SHIGETA , Shinichi HIRASAWA , Hirokazu KATO , Masako KINOSHITA , Takeshi NISHIOKA , Hiroyuki YANO
IPC分类号: H01L21/4763 , H01L21/461
CPC分类号: H01L21/7681 , C09G1/02 , H01L21/31058 , H01L21/31144 , H01L21/76835
摘要: A chemical mechanical polishing method comprises polishing an organic film using a slurry including polymer particles having a surface functional group and a water-soluble polymer.
摘要翻译: 化学机械抛光方法包括使用包含具有表面官能团的聚合物颗粒和水溶性聚合物的浆料来抛光有机膜。