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公开(公告)号：US09532444B2
公开(公告)日：2016-12-27
申请号：US13520812
申请日：2011-02-23
CPC分类号： H05K3/42 , H05K1/0243 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K1/181 , H05K3/303 , H05K3/4611 , H05K2201/0187 , H05K2201/0323 , H05K2203/0228
摘要： On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.
摘要翻译： 在通过制造印刷电路板的方法获得的印刷线路板上，预定部件将被安装在前表面侧和后表面侧中的至少一个上。 制造方法包括：制备CFRP芯，形成通孔，以从前表面侧到后表面侧穿透CFRP芯，并且在平面图中包括其中待安装部件的区域，以及 通过用具有绝缘性能的树脂填充通孔并固化树脂，将具有绝缘性能的GFRP芯嵌入到通孔内。 根据制造方法，安装在印刷电路板上的部件不受由CFRP引起的杂散电容的影响，并且不难形成电路。
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公开(公告)号：US20130008700A1
公开(公告)日：2013-01-10
申请号：US13520812
申请日：2011-02-23
CPC分类号： H05K3/42 , H05K1/0243 , H05K1/0366 , H05K1/0373 , H05K1/115 , H05K1/181 , H05K3/303 , H05K3/4611 , H05K2201/0187 , H05K2201/0323 , H05K2203/0228
摘要： On a printed wiring board obtained by a method of manufacturing a printed board, a predetermined component is to be mounted on at least one of a front surface side and a back surface side. The manufacturing method includes preparing a CFRP core, forming a through hole so as to penetrate the CFRP core from the front surface side to the back surface side and include a region in which the component is to be mounted when viewed in a plan view, and embedding a GFRP core having insulating properties within the through hole by filling the through hole with a resin having insulating properties and curing the resin. According to the manufacturing method, the component mounted on the printed board is not affected by a stray capacitance due to a CFRP, and it is not difficult to form a circuit.
摘要翻译： 在通过制造印刷电路板的方法获得的印刷线路板上，预定部件将被安装在前表面侧和后表面侧中的至少一个上。 制造方法包括：制备CFRP芯，形成通孔，以从前表面侧到后表面侧穿透CFRP芯，并且在平面图中包括其中待安装部件的区域，以及 通过用具有绝缘性能的树脂填充通孔并固化树脂，将具有绝缘性能的GFRP芯嵌入到通孔内。 根据制造方法，安装在印刷电路板上的部件不受由CFRP引起的杂散电容的影响，并且不难形成电路。
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