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    Polishing composition
    1.
    发明申请
    Polishing composition 审中-公开
    抛光组成

    公开(公告)号：US20050208883A1

    公开(公告)日：2005-09-22

    申请号：US11081560

    申请日：2005-03-17

    申请人： Hiroyuki Yoshida ,  Yuichi Honma ,  Shigeaki Takashina ,  Toshiya Hagihara

    发明人： Hiroyuki Yoshida ,  Yuichi Honma ,  Shigeaki Takashina ,  Toshiya Hagihara

    IPC分类号： B24B1/00 ,  B24B7/24 ,  B24B37/04 ,  B24D3/02 ,  C09G1/02 ,  C09K3/14

    CPC分类号： C09G1/02 ,  B24B37/044 ,  C09K3/1436 ,  C09K3/1463

    摘要： The present invention relates to a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from −15 to 40 mV; a method for manufacturing a substrate including the step of polishing a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from −15 to 40 mV; and a method for reducing scratches on a substrate to be polished with a polishing composition containing an aqueous medium and silica particles, including the step of adjusting a zeta potential of silica particles in the polishing composition to −15 to 40 mV. The polishing composition can be favorably used in polishing the substrate for precision parts, including substrates for magnetic recording media such as magnetic discs, optical discs and opto-magnetic discs; photomask substrates; optical lenses; optical mirrors; optical prisms; semiconductor substrates; and the like.

    摘要翻译： 本发明涉及含有水性介质和二氧化硅颗粒的抛光组合物，其中抛光组合物中的二氧化硅颗粒的ζ电位为-15至40mV; 一种基板的制造方法，其特征在于，包括使用含有水性介质和二氧化硅粒子的研磨用组合物研磨待研磨基板的工序，其中，研磨用组合物中的二氧化硅粒子的ζ电位为-15〜40mV， 以及包括将研磨用组合物中的二氧化硅粒子的ζ电位调整为-15〜40mV的步骤的减少含有水性介质和二氧化硅粒子的研磨用组合物的研磨用基板上的划痕的方法。 抛光组合物可以有利地用于抛光用于精密部件的基板，包括用于诸如磁盘，光盘和光磁盘的磁记录介质的基板; 光掩模基板; 光学镜片; 光学镜; 光学棱镜 半导体衬底; 等等。

    Polishing composition
    2.
    发明申请
    Polishing composition 有权
    抛光组成

    公开(公告)号：US20050221726A1

    公开(公告)日：2005-10-06

    申请号：US11095564

    申请日：2005-04-01

    申请人： Yuichi Honma ,  Kouji Taira ,  Shigeaki Takashina

    发明人： Yuichi Honma ,  Kouji Taira ,  Shigeaki Takashina

    IPC分类号： B24B1/00 ,  B24B37/00 ,  B24D3/02 ,  C09G1/02 ,  C09K3/14

    CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1409

    摘要： The present invention relates to a polishing composition containing an abrasive having an average particle size of from 1 to 30 nm and water, wherein the abrasive has a packing ratio of from 79 to 90% by weight; a method for manufacturing a substrate, including the steps of introducing the above polishing composition between a substrate and a polishing pad, and polishing the substrate, while contacting the substrate with the polishing composition; and a method for reducing scratches of a substrate to be polished, including the step of polishing the substrate to be polished with the above polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, substrates for magnetic recording media, such as magnetic disks, and opto-magnetic disks, photomask substrates, optical disks, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.

    摘要翻译： 本发明涉及一种含有平均粒径为1〜30nm的研磨剂和水的抛光组合物，其中研磨剂的填充率为79〜90重量％ 一种制造基板的方法，包括以下步骤：在基板和抛光垫之间引入上述抛光组合物，并在将基板与抛光组合物接触的同时研磨基板; 以及减少待研磨的基板的划痕的方法，包括用上述抛光组合物抛光待抛光的基板的步骤。 抛光组合物适用于抛光用于精密部件的基板，例如磁记录介质如磁盘，光磁盘，光掩模基板，光盘，光学透镜，光学镜，光学棱镜和半导体基板 ，等等。

    Polishing composition
    3.
    发明授权
    Polishing composition 有权
    抛光组成

    公开(公告)号：US07267702B2

    公开(公告)日：2007-09-11

    申请号：US11095564

    申请日：2005-04-01

    申请人： Yuichi Honma ,  Kouji Taira ,  Shigeaki Takashina

    发明人： Yuichi Honma ,  Kouji Taira ,  Shigeaki Takashina

    IPC分类号： B24B1/00 ,  B24B37/00 ,  C09G1/02 ,  C09G1/04 ,  C09K3/14

    CPC分类号： C09K3/1463 ,  C09G1/02 ,  C09K3/1409

    摘要： A polishing composition is provided containing an abrasive having an average particle size of from 1 to 30 nm and water, wherein the abrasive has a packing ratio of from 79 to 90% by weight; a method for manufacturing a substrate, including the steps of introducing the above polishing composition between a substrate and a polishing pad, and polishing the substrate, while contacting the substrate with the polishing composition; and a method for reducing scratches of a substrate to be polished, including the step of polishing the substrate to be polished with the above polishing composition. The polishing composition is suitable for polishing substrates for precision parts including, for example, substrates for magnetic recording media, such as magnetic disks, and opto-magnetic disks, photomask substrates, optical disks, optical lenses, optical mirrors, optical prisms and semiconductor substrates, and the like.

    摘要翻译： 提供了含有平均粒度为1〜30nm的研磨剂和水的抛光组合物，其中研磨剂的填充率为79〜90重量％ 一种制造基板的方法，包括以下步骤：在基板和抛光垫之间引入上述抛光组合物，并在将基板与抛光组合物接触的同时研磨基板; 以及减少待研磨的基板的划痕的方法，包括用上述抛光组合物抛光待抛光的基板的步骤。 抛光组合物适用于抛光用于精密部件的基板，例如磁记录介质如磁盘，光磁盘，光掩模基板，光盘，光学透镜，光学镜，光学棱镜和半导体基板 ，等等。