公开(公告)号：US20170190905A1

公开(公告)日：2017-07-06

申请号：US15312991

申请日：2015-01-28

Applicant: HITACHI, LTD.

Inventor： Satoshi ARAI ,  Shigeharu TSUNODA

IPC: C08L67/02 ,  B33Y30/00 ,  B33Y50/02 ,  C08K3/00 ,  B29C67/00 ,  C08K3/36 ,  C08K7/14 ,  C08K5/00 ,  B33Y10/00 ,  B33Y70/00

CPC classification number: C08L67/02 ,  B29C64/153 ,  B29C64/40 ,  B29K2067/006 ,  B29K2105/251 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B33Y70/00 ,  C08G63/183 ,  C08K3/016 ,  C08K3/36 ,  C08K5/0066 ,  C08K7/14 ,  C08L2201/02 ,  C08L69/00

Abstract: Molded bodies formed from PA-12 resin lose elasticity by absorbing water and lose strength as a result. Due to this, application to only some products used in low humidity environments is possible, which is a problem that needed to be addressed. This resin powder material, for use in powder laminate molding methods, is characterized in that the resin powder is a polybutylene terephthalate resin which has a crystallization temperature lower than that of homopolybutylene terephthalate resins.

公开(公告)号：US20190111617A1

公开(公告)日：2019-04-18

申请号：US16090541

申请日：2016-04-13

Applicant: HITACHI, LTD.

Inventor： Satoshi ARAI ,  Shigeharu TSUNODA

IPC: B29C64/153 ,  B33Y30/00 ,  B33Y70/00 ,  B33Y80/00 ,  B29C64/218 ,  B29C64/268

Abstract: The invention is to provide a resin powder that is highly robust with regard to temperature control and is capable of improving heat resistance of a molded article. In order to solve the above problem, the resin powder according to the invention uses a mixed resin powder in which a thermoplastic base resin powder and a thermoplastic high-melting-point resin powder having a melting point higher than that of the base resin powder are mixed together. For example, isophthalic acid copolymerized PBT (polybutylene terephthalate) is used in the base resin powder, and homo-PBT is used in the high-melting-point resin powder. Alternatively, a polyamide 12 is used in the base resin powder, and MXD nylon is used in the high-melting-point resin powder.

公开(公告)号：US20180222113A1

公开(公告)日：2018-08-09

申请号：US15881105

申请日：2018-01-26

Applicant: Hitachi, Ltd.

Inventor： Akihiro YAMAGUCHI ,  Satoshi ARAI ,  Shigeharu TSUNODA

IPC: B29C64/153 ,  B33Y10/00 ,  B33Y80/00 ,  A61N5/10

CPC classification number: B29C64/153 ,  A61N5/10 ,  A61N2005/1095 ,  B29C64/393 ,  B29L2011/0066 ,  B33Y10/00 ,  B33Y50/02 ,  B33Y80/00

Abstract: To prevent warp deformation of a molded object which is formed by laser powder layer laminating molding.There is provided a powder layer laminating molding method including a first step of forming a powder layer which includes powder of a thermoplastic resin, and a second step of sintering the powder layer by irradiating the formed powder layer with a beam having a heating action, in which a molded object is obtained by repeatedly performing the forming and the sintering of the powder layer in the first step and the second step, and an irradiation surface which is irradiated with the beam is divided into a plurality of small regions.

公开(公告)号：US20190275736A1

公开(公告)日：2019-09-12

申请号：US16133052

申请日：2018-09-17

Applicant: HITACHI, LTD.

Inventor： Akihiro YAMAGUCHI ,  Satoshi ARAI ,  Shigeharu TSUNODA

IPC: B29C64/153 ,  B29C64/268 ,  B29C64/393

Abstract: A powder layered modeling apparatus capable of modeling a three-dimensional object using a material powder contains at least a crystalline resin and filler particles. A modeling unit which partitions a modeling space for laying a material powder layer by the material powder to mold the three-dimensional object, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a first direction with respect to the modeling space, a powder laying unit capable of laying the material powder layer in the modeling space by moving the material powder along a second direction not parallel to the first direction, and an energy supply unit which supplies energy for melting or sintering the material powder to a part constituting a cross-sectional layer to be molded of the three-dimensional object of the material powder layer laid in the modeling space.